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Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu, China
Main Products:
Die Bonder , Wire Bonding , Laser Marking(ID IC Wafer) , Laser Grooving , Laser Cutting , ...
Year of Establishment:
2019-09-12
Repeat Buyers Choice:
80%~100%
Address:
Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital:
100,000,000 RMB
Main Markets:
Europe
OEM/ODM Service
Sample Available
Overseas Agent / Branch
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Die Bonder, Wire Bonding manufacturer / supplier in China, offering 8-Inch Silicon Wafer Semi Chip Standard Chip High End Lithography/Litho Machine, Precision Laser Marking Technology for Metal and Plastic Surfaces, Advanced Die Bonding Machine for Optimal Solidification Performance and so on.

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Total 834 Products
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Video
High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device
High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device
FOB Price: US $100,000-1,000,000 / Set
Min. Order: 1 Set
Send Inquiry
Video
High Speed Fully Automatic Gold/Copper/Aluminum Wire Bonder
High Speed Fully Automatic Gold/Copper/Aluminum Wire Bonder
FOB Price: US $5,000-70,000 / Piece
Min. Order: 1 Piece
Send Inquiry
Video
Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
FOB Price: US $50,000-100,000 / Piece
Min. Order: 1 Piece
Send Inquiry
Video
Advanced Fully Automatic Laser Marking Machine for Wafer ID
Advanced Fully Automatic Laser Marking Machine for Wafer ID
FOB Price: US $50,000-70,000 / Piece
Min. Order: 1 Piece
Send Inquiry
Video
Advanced Frame Laser Marking Machine with Smart Label Detection
Advanced Frame Laser Marking Machine with Smart Label Detection
FOB Price: US $100,000-200,000 / Piece
Min. Order: 1 Piece
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Video
Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
FOB Price: US $30,000-300,000 / Piece
Min. Order: 1 Piece
Send Inquiry
Video
Advanced Laser Stealth Dicing/Cutting Equipment for Semiconductor Wafers
Advanced Laser Stealth Dicing/Cutting Equipment for Semiconductor Wafers
FOB Price: US $70,000-100,000 / Set
Min. Order: 1 Set
Send Inquiry
Video
Advanced Mobile Robotics Solutions for Supply Chain Efficiency
Advanced Mobile Robotics Solutions for Supply Chain Efficiency
FOB Price: US $50,000-100,000 / Set
Min. Order: 1 Set
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Video
High Precision Wafer Identification and Secure Storage System
High Precision Wafer Identification and Secure Storage System
FOB Price: US $50,000-200,000 / Set
Min. Order: 1 Set
Send Inquiry
Video
Advanced Laser Debonding Machine for Precision Applications in Industry
Advanced Laser Debonding Machine for Precision Applications in Industry
FOB Price: US $1,000,000-3,000,000 / Set
Min. Order: 1 Set
Send Inquiry
Video
Precision Laser Cutting Machine for PCB and Pet Materials
Precision Laser Cutting Machine for PCB and Pet Materials
FOB Price: US $50,000-100,000 / Piece
Min. Order: 1 Piece
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Video
Advanced Automatic IC Reel Packaging Machine for Semiconductor Efficiency
Advanced Automatic IC Reel Packaging Machine for Semiconductor Efficiency
FOB Price: US $40,000-100,000 / Piece
Min. Order: 1 Piece
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Video
8-Inch Silicon Wafer Semi Chip Standard Chip High End Lithography/Litho Machine
8-Inch Silicon Wafer Semi Chip Standard Chip High End Lithography/Litho Machine
FOB Price: US $50,000-100,000 / Piece
Min. Order: 1 Piece
Send Inquiry
Video
High End Semiconductor Fully Automatic Laser Ring Cutting Machine
High End Semiconductor Fully Automatic Laser Ring Cutting Machine
FOB Price: US $100,000-1,000,000 / Set
Min. Order: 1 Set
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Video
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
FOB Price: US $100,000-1,000,000 / Set
Min. Order: 1 Set
Send Inquiry
Video
Fully Automatic Semiconductor Glue Coating and Developing Equipment
Fully Automatic Semiconductor Glue Coating and Developing Equipment
FOB Price: US $10,000-50,000 / Piece
Min. Order: 1 Piece
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Video
High-Performance Laser Cutting Equipment for LED Wafer Production
High-Performance Laser Cutting Equipment for LED Wafer Production
FOB Price: US $500,000-1,000,000 / Set
Min. Order: 1 Set
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Video
High-Precision Fully Automatic Wafer Marking Equipment for Semiconductor Industry
High-Precision Fully Automatic Wafer Marking Equipment for Semiconductor Industry
FOB Price: US $40,000-100,000 / Piece
Min. Order: 1 Piece
Send Inquiry
Video
High End Semiconductor Fully Automatic Llo Laser Peeling Equipment
High End Semiconductor Fully Automatic Llo Laser Peeling Equipment
FOB Price: US $1,000,000-2,000,000 / Set
Min. Order: 1 Set
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Video
High End Semiconductor Fully Automatic Molding Equipment for Lead Frame/Substrate
High End Semiconductor Fully Automatic Molding Equipment for Lead Frame/Substrate
FOB Price: US $500,000-1,000,000 / Set
Min. Order: 1 Set
Send Inquiry
Video
High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)
High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
Send Inquiry
Video
Advanced High-Precision Fiber Laser Cutting Machine with Intelligent Sensors
Advanced High-Precision Fiber Laser Cutting Machine with Intelligent Sensors
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
Send Inquiry
Video
Optimal Production Pss-H160 Seam Welding System for Industry
Optimal Production Pss-H160 Seam Welding System for Industry
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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Video
High-Efficiency Automatic Lead Wedge Welder for Seamless Joints
High-Efficiency Automatic Lead Wedge Welder for Seamless Joints
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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