High-Precision 15W/20W UV Laser for Industrial Marking Solutions
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Product Highlights
- High Stability: Average power stability <3%RMS over 8 hours for long-term running.
- Compact Structure: Dimensions 580*210*117mm with low power consumption design.
- Cold Processing: 355nm UV wavelength breaks chemical bonds with minimal heat transfer.
- High Repetition Rate: Range up to 150kHz for rapid-pulse processing capabilities.
- Flexible Customization: OEM and ODM services available with flexible customization options.
- Precision Micromachining: Ideal for wafer dicing, drilling, and MEMS fabrication.
- Biomedical Applications: Suitable for laser surgery, dermatology, and confocal microscopy.
Product Attributes
- Customization
- Available
- Spatial Mode
- Tem00(M² <1.3)
- Beam Divergence Full Angle
- <2mrad
- Model NO.
- HMLA-Grace X 355
- Beam Roundness
- >90%
- Beam Pointing Stability
- <50urad
- Polarization Direction
- Horizontal
- Size
- 580*210*117mm
- Weight
- Weight
- Transport Package
- Wooden Case
- Specification
- customized
- Trademark
- Himalaya
- Origin
- China
- Production Capacity
- 100
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Product Description
- Encapsulation in hundred class ultra clean laboratory
- Good beam quality(M²<1.3)
- High stability for long term running, 24/7 industrial application
- Compact structure and low power consumption
Technical Parameters
| MODEL | Grace X 355-15S | Grace X 355-20S |
| Wavelength | 355nm | |
| Pulse Repetition Rate Range | 50kHz to 150kHz | 70kHz to 150kHz |
| Pulse Width | 22±2ns@50kHz | 26±2ns@100kHz |
| Average Power | >15W@50kHz | >20W@70kHz |
| Average Power Stability | <3%RMS over 8 hours | |
| Pulse-to-Pulse Stability | <3%RMS | |
| Spatial Mode | TEM00(M² <1.3) | |
| Beam Divergence Full Angle | <2mrad | |
| 1/e² Beam Diameter | 0.6±0.2mm | |
| Beam Roundness | >90% | |
| Beam Pointing Stability | <50urad | |
| Polarization Direction | Horizontal | |
| Polarization Ratio | 100:1 | |
| Size | 580*210*117mm | |
| Weight | 19.5kg | |
| Cooling | Water-cooling | |
Application

Product Description

Overview of 355nm UV Lasers
Ultraviolet (UV) lasers, particularly the 355nm wavelength, are sophisticated optical devices that have garnered significant attention due to their wide-ranging applications in biomedicine, material processing, and optical communication.
Generation and Key Characteristics
The 355nm UV laser is typically generated through a process of frequency conversion. An infrared pump laser (commonly at 1064nm) is passed through nonlinear crystals, such as KDP (potassium dihydrogen phosphate) or BBO (β-barium borate). These crystals perform third-harmonic generation, effectively tripling the frequency and shortening the wavelength to the ultraviolet 355nm.
This process results in a laser with exceptional properties:
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High Beam Quality: Allows for tight focusing to a very small spot size.
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Narrow Spectral Linewidth: Provides a pure, precise wavelength.
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High Energy & High Repetition Rate: Enables both powerful and rapid-pulse processing.
Advantages in Fine Micromachining
Laser fine micromachining involves processing materials and devices with micrometer-level accuracy. The 355nm UV nanosecond laser is a dominant tool in this field due to several key advantages:
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High Photon Energy: The short UV wavelength carries more energy per photon, facilitating "cold processing" that directly breaks chemical bonds without significant heat transfer to the surrounding material.
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High Material Absorption: Many materials, including polymers, glass, and semiconductors, strongly absorb UV light, leading to efficient and clean ablation.
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Excellent Focusing Performance: The high beam quality allows for the creation of extremely fine features.
Major Applications
1. Biomedicine
The short wavelength of 355nm lasers allows for precise interaction with biological tissues and molecules. Key applications include:
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Confocal Microscopy & Imaging: Used for high-resolution cellular and tissue imaging.
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Laser Surgery: Enables precise ablation with minimal thermal damage to surrounding areas.
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Dermatology: Effectively treats conditions like vitiligo and vascular lesions by targeting specific skin structures.
2. Material Processing and Semiconductor Manufacturing
The ability to achieve high precision makes 355nm lasers indispensable in advanced manufacturing:
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Wafer Dicing and Drilling: Used for scribing and cutting brittle semiconductor wafers (like silicon) with clean, precise edges.
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Lithography: Plays a role in direct-write and mask-making processes for creating microelectronic circuits.
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Nanofabrication: Essential for manufacturing microelectromechanical systems (MEMS) and other miniature devices.
3. Optical Communication
The ongoing development of fiber optic technology leverages the properties of UV lasers:
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Fiber Bragg Grating (FBG) Inscription: 355nm lasers are used to create periodic refractive index changes within optical fibers, which are critical components for sensors, filters, and wavelength division multiplexers.
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High-Speed Sources: Their short wavelength and high energy make them suitable for developing advanced, high-capacity communication systems.
About the Supplier
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Company Profile
Empowering Global Semiconductor Excellence: An Introduction to Jiangsu Himalaya Semiconductor Co., Ltd.
In the rapidly evolving landscape of global electronics, precision and reliability are the cornerstones of success. Since its establishment in 2019, Jiangsu Himalaya Semiconductor Co., Ltd. Has emerged as a pivotal force in the semiconductor industry, specializing in the high-level integration and international trade of advanced manufacturing equipment.
With a footprint extending to over 30 countries and a robust network of more than 200 global customers and suppliers, we serve as the critical link in the semiconductor supply chain. Our mission is clear: To secure the most cost-effective, high-performance solutions for our clients while ensuring seamless, risk-free transactions for our partners.
Comprehensive Equipment Solutions for Semiconductor Manufacturing
We take pride in our diverse portfolio of high-precision machinery designed to meet the rigorous demands of modern wafer processing and packaging.
1. Advanced Bonding & Marking
Precision at the microscopic level is essential for chip integrity. Our core lineup includes:
Die Bonders: Ensuring high-speed, accurate placement of chips.
Wire Bonding: Providing reliable electrical interconnections with industry-leading stability.
Laser Marking: Specialized ID marking for IC wafers to ensure full traceability throughout the lifecycle.
2. Cutting-Edge Laser Processing
As wafers become thinner and materials more complex, our laser solutions provide the necessary finesse without compromising structural integrity:
Laser Grooving & Cutting: Expertly designed for glass, ceramics, and wafer packaging.
Internal Modification Machines: Specialized laser technology for Si/SiC (Silicon Carbide) and LT/LN (Lithium Tantalate/Lithium Niobate) wafers.
Laser Annealing: Optimized for Si/SiC substrates to enhance electrical properties and repair lattice damage.
3. Dicing & Dispensing
Automatic Dicing Saw Machines: High-efficiency dicing for wafer packaging applications.
Automatic Silicone Dispensing Equipment: Precision fluid control for protective coating and encapsulation.
Customized Industrial Solutions
Beyond standard machinery, Jiangsu Himalaya Semiconductor provides specialized engineering solutions tailored to unique factory requirements:
TGV (Through Glass Via) Technology: Offering manual, semi-automatic, and fully automatic equipment for next-generation 3D packaging.
Coating & Plating: Customized machines designed for specific surface treatment and metal deposition needs.
Environmental & Resource Management: Efficient solutions for handling exhausted metal sorter equipment, promoting sustainable manufacturing practices.
Why Partner with Jiangsu Himalaya Semiconductor?
In a market defined by volatility, we offer stability and strategic advantage. We understand that for our customers, the "final stage" of procurement is the most critical. We utilize our deep industry expertise to filter through global options, delivering products that balance cost with cutting-edge performance.
For our suppliers, we are a partner of trust. We strive for one-time payment collection and comprehensive risk avoidance, allowing manufacturers to focus on innovation while we handle the complexities of global distribution.
Contact Us Today
Whether you are scaling your production line or seeking a reliable global export partner, Jiangsu Himalaya Semiconductor Co., Ltd. is ready to elevate your operations.
Explore the peak of semiconductor technology with Himalaya.
About Our Factory & Business Background
- Address
- Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
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Registered Capital
- 100,000,000 RMB
-
Terms of Payment
- LC, T/T, PayPal, Western Union
-
International Commercial Terms(Incoterms)
- FOB, CIF, CFR, EXW
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Average Lead Time
-
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months -
Nearest Port
- Shenzhen Port
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Minimum Order Quantity
- 1 Set
-
Supply Chain Partners
- 30
Our Production Capability & Technical Expertise
-
Main Products
- Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
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Inspection Type for Finished Products
- 100% inspection(Visual inspection & Function inspection)
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Inspection Method for Finished Products
- Finished product checked by packing staff
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Customization Options
- Flexible customization
-
ODM Service Available
- Yes
-
OEM Service Available
- Yes
-
Traceability of Raw Materials
- No
Our Industry Experience & Global Business Record
-
Year of Establishment
- 2019-09-12
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Export Year
- 5 Years
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Main Markets
- Europe
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Repeat Buyers Choice
- 80%~100%
FAQ
- How stable is the average power output?
- It maintains an average power stability of less than 3%RMS over an 8-hour period.
- What are the available power options?
- Models are available with average power greater than 15W at 50kHz and 20W at 70kHz.
- Can this laser be customized?
- Yes, OEM and ODM services are available with flexible customization options.
- What is the minimum order quantity?
- The minimum order quantity is 1 set.
- What are the lead times for production?
- Lead time is 1-3 months during off-peak season and 3-6 months during peak season.
- What is the beam divergence angle?
- The full angle beam divergence is less than 2mrad.
- Is the laser suitable for semiconductor manufacturing?
- Yes, it is ideal for wafer dicing, drilling, and lithography in semiconductor manufacturing.
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