High Precision COB Die Bonding and Dispensing Machine for Electronics

Product Details
Customization: Available
After-sales Service: Provided
Condition: New
Gold Member Since 2023

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  • High Precision COB Die Bonding and Dispensing Machine for Electronics
  • High Precision COB Die Bonding and Dispensing Machine for Electronics
  • High Precision COB Die Bonding and Dispensing Machine for Electronics
  • High Precision COB Die Bonding and Dispensing Machine for Electronics
  • High Precision COB Die Bonding and Dispensing Machine for Electronics
  • High Precision COB Die Bonding and Dispensing Machine for Electronics
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
SHD8060
Speed
High Speed
Precision
High Precision
Certification
RoHS, ISO, CE
Warranty
12 Months
Automatic Grade
Automatic
Type
Ultra High-speed Chip Mounter
Product Name
Semiconductor Equipment
Feature 1
High Precision
Feature 2
High Efficiency
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System
Product Description
High Precision COB Die Bonding and Dispensing Machine for Electronics

High Precision COB Die Bonding and Dispensing Machine for Electronics

High Precision COB Die Bonding and Dispensing Machine for Electronics

Equipment Specifications
  DIE BONDER SHD8060
  Bonding method Eutectic
  Bonding precision X/Y ±0.04mm
  Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame)
  Chip size 0.2mmx0.2mm~2.3mmx2.3mm
   Wafer size 3~8 inches (with 8-inch work frame)
   Frame type Silver-plated frame,bare copper frame,nickel-plated frame(up to 65mm wide)
  Frame movement Roller feeding (Tape reel frame)
  Chip rotation angle  ±3°
  Wafer movement Mechanical advancement
  Top chip angle  0°to  360°
  Bonding head Vacuum surface suction
  Bonding arm  180°
  Bonding strength 20~200g
  Adaptable nozzle Steel nozzle,rubber nozzle,bakelite nozzle
  Image recognition 256-level grayscale
  Resolution 640×480 pixels
  Recognition accuracy 0.025mil~50mil observation range
  Dimensions(mm 1900*1240*1350
  Equipment weight (kg) About 600kg
High Precision COB Die Bonding and Dispensing Machine for Electronics
Exhibition & Customers

High Precision COB Die Bonding and Dispensing Machine for ElectronicsHigh Precision COB Die Bonding and Dispensing Machine for ElectronicsJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

High Precision COB Die Bonding and Dispensing Machine for Electronics
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:Why choose us?
A3:OEM/ODM/Designing service.

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