Infrared Picosecond Laser Cutting Machine

• Customization: Available
• After-sales Service: 1 Year
• Warranty: 1 Year
• Model NO.: HMLA-6070CD
• Application: Home Appliance, Environmental Equipment, Petroleum Machinery Manufacturing, Agriculture Machinery, Textile Machinery, Food Machinery, Aerospace Industry, Automotive Industry, Shoemaking Industry, Woodwork Industry, Advertising Industry
• Cooling System: Water Cooling
• Technical Class: Pulse Laser
• Applicable Material: Metal
• Structure Type: Dual-Platform
• Laser Classification: Semiconductor Laser
• Laser Technology: Laser Control Fault Cutting
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 5000

Product Description

 

Product Description

Infrared picosecond laser cutting machine
The light source is a high-power picosecond laser;
Self-developed glass laser cutting head. The lenses are all imported. The light spot is fine and the focal length is long.
Support the integrated cutting of chips, separate cutting and separate splitting.
The X/ Y-axis motors adopt high-end linear motors and German 0.1um digital grating rulers.
The motion control is standardly equipped with PSO function, which enables uniform control of the laser spot spacing.
The device aligns the CCD and telecentric vision lens to accurately identify mark points such as circles and crosses.
The electrical components are from France, and the switching power supply is from Mean Well of Taiwan.
One knife can cut a thickness of up to 19mm.
The motor platform and the optical platform base are made of natural marble, ensuring better precision.

 

Application scope
Instruments and meters, thickened and extra-thick glass industry cutting, such as: ultra-white glass, plain white glass, high borosilicate glass, quartz glass, etc.
Tempered and non-tempered glass cutting, such as: mobile phone glass covers, vehicle glass covers, camera glass covers, etc.
Sapphire glass cutting, such as: sapphire covers for mobile phones, sapphire glass covers for cameras, sapphire light strips (LED light strips), etc.
Liquid crystal screen glass cutting, such as: inverted R/U/C corners for irregular liquid crystal screens, liquid crystal screen slitting, etc.
Other optical glass cutting, such as: K9 glass, filter cutting, mirror cutting, etc.


Main Parameter

Equipment Name	Dual-platform Picosecond Laser Glass Cutting & Breaking All-in-One Machine	Dual-platform Picosecond Laser Glass Cutter	Single-platform Picosecond Laser Glass Cutter
Equipment Model	HMLA-6070CD / 6090CD	HMLA-4050D / 6070D / 6090D	HMLA-4050 / 6070 / 6090
Cutting Laser Source
Laser Type	Infrared Picosecond Pulsed Laser	Infrared Picosecond Pulsed Laser	Infrared Picosecond Pulsed Laser
Power	50W (optional: 10W, 20W, 30W, 60W, 80W, etc.)	50W (optional: 10W, 20W, 30W, 60W, 80W, etc.)	50W (optional: 10W, 20W, 30W, 60W, 80W, etc.)
Wavelength	1064nm, Beam Quality: M² < 1.2	1064nm, Beam Quality: M² < 1.2	1064nm, Beam Quality: M² < 1.2
Pulse Width	<10PS, Pulse Frequency: 1Hz-1000kHz	<10PS, Pulse Frequency: 1Hz-1000kHz	<10PS, Pulse Frequency: 1Hz-1000kHz
Cooling Method	Water Cooling	Water Cooling	Water Cooling
Cutting Performance
Drive Motor	XY linear motor + grating ruler, positioning accuracy ≤±2μm, repeatability accuracy ≤±1.5μm, acceleration 1G, maximum linear speed 1000mm/s	XY linear motor + grating ruler, positioning accuracy ≤±2μm, repeatability accuracy ≤±1.5μm, acceleration 1G, maximum linear speed 1000mm/s	XY linear motor + grating ruler, positioning accuracy ≤±2μm, repeatability accuracy ≤±1.5μm, acceleration 1G, maximum linear speed 1000mm/s
Cutting Speed	0-500mm/s adjustable	0-500mm/s adjustable	0-500mm/s adjustable
Cutting Thickness	Ultra-white glass (single pass ≤19mm), green glass (two passes ≤19mm) (Select laser power and cutting head focal depth according to material, thickness, and speed requirements; material may affect processing thickness, and multi-pass cutting can be used for thicker materials)	Ultra-white glass (single pass ≤19mm), green glass (two passes ≤19mm) (Select laser power and cutting head focal depth according to material, thickness, and speed requirements; material may affect processing thickness, and multi-pass cutting can be used for thicker materials)	Ultra-white glass (single pass ≤19mm), green glass (two passes ≤19mm) (Select laser power and cutting head focal depth according to material, thickness, and speed requirements; material may affect processing thickness, and multi-pass cutting can be used for thicker materials)
Minimum Cutting Edge Chipping	≤5μm	≤5μm	≤5μm
Cutting Accuracy	≤20μm	≤20μm	≤20μm
XY Cutting Stroke	600×700mm; 600×900mm dual platform	400×500mm; 600×700mm; 600×900mm dual platform	400×500mm; 600×700mm; 600×900mm single platform
Breaking Laser Source	Breaking Laser Source	Breaking Laser Source	Breaking Laser Source
Laser Type	Continuous Laser	Excludes breaking part, optional single/dual platform breaking machine separately	Excludes breaking part, optional single/dual platform breaking machine separately
Power	150W (250W/350W optional)
Wavelength	10.6μm
Pulse Frequency	1-100kHz
Cooling Method	Water Cooling
Power, Dimensions & Weight	Power, Dimensions & Weight	Power, Dimensions & Weight	Power, Dimensions & Weight
Voltage & Power	<8KW, AC220V	<5KW, AC220V	<4KW, AC220V
Equipment Dimensions	Length 2150mm × Width 2080mm × Height 1960mm Length 2550mm × Width 2080mm × Height 1960mm	Length 1700mm × Width 1700mm × Height 1960mm Length 2150mm × Width 2080mm × Height 1960mm Length 2550mm × Width 2080mm × Height 1960mm	Length 1600mm × Width 1700mm × Height 1960mm Length 1700mm × Width 1700mm × Height 1960mm Length 1900mm × Width 1700mm × Height 1960mm
Weight	Approximately 3500KG / 4000KG	Approximately 2000KG / 3500KG / 4000KG	Approximately 2000KG / 2500KG / 3000KG
Floor Load Capacity	>700kg/m²	>500-700kg/m²	>500-700kg/m²

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

 

Field Application

 

 

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.