| Customization: | Available |
|---|---|
| After-sales Service: | Yes |
| Function: | High Temperature Resistance, High End Ceramic Punching Equipment |
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Serial number, name, model, specification, quantity (set), original manufacturer and place of originEquipment List Table:
| No. | Equipment Name | Model | Specification | Qty | Manufacturer/Origin | Notes |
|---|---|---|---|---|---|---|
| 1 | Four Axis Gantry Platform | - | Travel: 250 × 700 mm | 1 | Clan | Custom mechanical system |
| 2 | Fiber Laser | - | Infrared (IR), 1064nm | 2 | Imported (DE/US/JP) | High-power laser source |
| 3 | Industrial Computer | Weidakang WD-500 | - | 1 | Domestically Produced | i7, 16GB RAM, 1TB SSD (likely) |
| 4 | Laser Processing System | Galvo + Cutting Head | Precision cutting & marking | 2 | Imported (DE) | ±0.02mm accuracy |
| 5 | Material Transfer Components | Custom | - | 1 | Clan | Servo-driven, payload capacity unknown |
| 6 | CCD Component | MV-EM200C | 5MP, 30fps, IP65-rated | 2 | Imported (JP) | Machine vision inspection |
| 7 | Software PLC | OMRON NJ501 | 32 I/O, EtherCAT support | 1 | OMRON (JP) | Industrial automation control |
| 8 | Monitor | GW-1703 | 17" LCD, 1280×1024 resolution | 1 | Great Wall (CN) | Human-Machine Interface (HMI) |
| 9 | Racks and Housing | Custom | 304 stainless steel | 1 | Clan | Structural support |
| 10 | Fixture | Custom | Quick-change design | 2 | Clan | Workholding for parts |
| 11 | Loading/Unloading Platform | Custom | 800 × 600 mm workspace | 2 | Clan | Automated material handling |
| 12 | Smoke Purifier | SP-2000 | 2000 m³/h, HEPA filtration | 1 | Domestically Produced | Fume extraction |
| 13 | Chiller | CW-5200 | Cooling capacity: 5.2 kW | 1 | Domestically Produced | Laser cooling system |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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