Advanced Electronic Component Drying Oven with Customizable Settings

Product Details
Customization: Available
After-sales Service: Provide
Function: High Temperature Resistance
Gold Member Since 2023

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  • Advanced Electronic Component Drying Oven with Customizable Settings
  • Advanced Electronic Component Drying Oven with Customizable Settings
  • Advanced Electronic Component Drying Oven with Customizable Settings
  • Advanced Electronic Component Drying Oven with Customizable Settings
  • Advanced Electronic Component Drying Oven with Customizable Settings
  • Advanced Electronic Component Drying Oven with Customizable Settings
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  • Overview
  • Product Description
  • Application
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
DF-01
Demoulding
Pull Core
Condition
New
Certification
ISO
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
300,000-1,000,000 Shots
Speed Range
70 ~ 400mm/Min
Contrl Temperature Area
3-8
Furnace Height
30-100
Net Band Width
200-1000mm
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China
Production Capacity
100

Product Description

Product Description
 

1,Index parameter

Net band width: 200-1000MM

Contrl temperature area: 3-8

Temperature zone length: 300/450/1000mm

Maximum temperature: 350 degrees centigrade

Furnace height: 30-100

Atmosphere: air

 

2,Progressiveness

Far infrared or hot air heating, all stainless steel clean furnace, light environmental protection materials insulation, efficient energy saving, multi temperature zone control, reliable and convenient transmission system, has been used in China and the United States space system reliable.


3,Detail and application display

Advanced Electronic Component Drying Oven with Customizable Settings

Application

Advanced Electronic Component Drying Oven with Customizable Settings

Exhibition & Customers

Advanced Electronic Component Drying Oven with Customizable SettingsAdvanced Electronic Component Drying Oven with Customizable SettingsJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Advanced Electronic Component Drying Oven with Customizable Settings
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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