80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer

Product Details
Customization: Available
After-sales Service: 7*24 Hours
Warranty: 12 Months
Gold Member Since 2023

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  • 80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer
  • 80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer
  • 80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer
  • 80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer
  • 80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer
  • 80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer
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  • Overview
  • Product Description
  • Product Parameters
  • Key Features
  • Company Profile
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
LPM-01
Customized
Non-Customized
Standard Modular Design
Standard Modular Design
Cooling System
Air Cooling
Applicable Material
Nonmetal
Technical Class
Pulse Laser
Type
Semiconductor Laser
Laser Power
80W Mopa
Laser Wavelength
1064 Nm
Max. Scribing Speed
600 mm/S
Line Width
< 40 Um
Scribing Depth
0 - 200 Um
Scribing Accuracy
+/- 0.1 mm
Positioning System
CCD Vision System
Compatible Wafer Size
156 * 156 mm to 168 * 168 mm
Equipment Weight
1200 Kg
Transport Package
Crate
Specification
12, 140 * 1, 440 * 1, 800 mm
Trademark
Himalaya
Origin
China
Production Capacity
1000

Product Description

Product Description

High-Precision Laser Scribing Machine for Superior Wafer Yield

Our SHL2-4000V19 Laser Scribing Machine represents the pinnacle of efficiency and precision in solar cell production. Designed for maximum throughput and minimal breakage, this system integrates an advanced 80W MOPA laser with a high-accuracy CCD vision system to deliver clean, consistent scribing on wafers ranging from 156mm to 168mm.

Achieving a remarkable throughput of 3,200 wafers per hour with a breakage rate of less than 1%, this machine is engineered to enhance your production line's profitability. The non-contact laser process ensures minimal heat impact (HAZ <80μm) and superior edge quality, guaranteeing the integrity of your Grade A+ silicon wafers. For manufacturers seeking to optimize capacity and reduce waste, the SHL2-4000V19 is the reliable, high-performance solution.

80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for WaferOur laser scribing machine cutting samples


 

80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer
80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer

 

Product Parameters

Laser Scribing Machine - Technical Datasheet
Parameter Specification
Model SHL2-4000V19
Laser Power 80W MOPA
Laser Wavelength 1064 nm
Max. Scribing Speed 600 mm/s
Line Width < 40 Um
Heat Affected Zone (HAZ) < 80 um
Scribing Depth 0 - 200 um (Adjustable)
Scribing Accuracy ± 0.1 mm
Positioning System CCD Vision System
Cleaving Method Mechanical Cleaving
Throughput 3200 wafers/hour
Breakage Rate < 1% (for Grade A+ wafers)
Compatible Wafer Size 156 * 156 mm to 168 * 168 mm
Equipment Dimensions (L*W*H) 12,140 * 1,440 * 1,800 mm
Equipment Weight 1200 kg
 
 

80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer

Key Features

Core Technical Advantages:

  • MOPA Laser Source: Allows independent control of pulse parameters for optimal scribing quality on brittle silicon.

  • CCD Vision Positioning: Enables high-precision alignment, critical for thin and fragile wafers.

  • Controlled Mechanical Cleaving: Provides a clean, reliable break after the laser scribing process.

     

    80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer
    80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer


     

Company Profile

Jiangsu Himalaya Semiconductor Co., Ltd. is a premier high-tech enterprise specializing in the research, development, production, and sales of advanced manufacturing equipment for the semiconductor and photovoltaic (PV) industries. Named after the majestic mountain range, we aspire to reach the highest peaks of innovation, reliability, and service in the global technology sector.

Our mission is to empower the world's transition to clean energy and technological advancement by providing manufacturers with cutting-edge, intelligent equipment that enhances production efficiency, maximizes yield, and reduces operational costs.

80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer

Packaging & Shipping

Package Component Specification Purpose
Primary Package IPPC ISPM 15 Standard Solid Wooden Case, reinforced with steel straps. Protects against physical impact, moisture, and pests. Meets international phytosanitary regulations.
Internal Cushioning High-density foam, custom-molded to the machine's shape. Absorbs shocks and vibrations, preventing movement inside the case.
Weatherproofing Heavy-duty plastic wrapping and desiccant bags placed inside the case. Protects against humidity, rain, and salt spray during transit.
Component Securing All internal components are bolted to the machine frame; loose parts are secured in custom foam-lined boxes within the main crate. Prevents damage from internal shifting.
Labeling External labels with handling icons (Fragile, This Side Up, Keep Dry), machine model, gross weight, and dimensions.  



80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer
IPPC standard wooden pack


80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer

FAQ

1. What is Himalaya Semiconductor's core business?
We are a high-tech manufacturer specializing in advanced equipment for the semiconductor and photovoltaic (PV) industries. Our core products include high-precision laser scribing machines, laser dicing systems, and turnkey automation solutions.

2. Where is your company located?
Our headquarters and main production facility are located in Jiangsu Province, China, a major hub for advanced manufacturing and technology.

3. Are you a certified manufacturer?
Yes. We are ISO 9001 certified for our quality management systems, ensuring that our products meet international standards for reliability and performance. We also comply with relevant industry-specific safety certifications.

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