Automatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB Board

Product Details
Customization: Available
After-sales Service: 7*24 Hours
Function: High Temperature Resistance
Gold Member Since 2023

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  • Automatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB Board
  • Automatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB Board
  • Automatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB Board
  • Automatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB Board
  • Automatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB Board
  • Automatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB Board
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  • Overview
  • Product Description
  • Key Features
  • Company Profile
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
WCE_01
Demoulding
Automatic
Condition
New
Certification
ISO
Warranty
12 Months
Automatic Grade
Automatic
Installation
Desktop
Driven Type
Electric
Mould Life
>1,000,000 Shots
Product Name
Semiconductor Wafer Saw Machine
Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
Max Effective Travel
310 mm
Feed Speed Range
0.1 to 1000 mm/S
Single Step Increment
0.0001 mm
Maximum Rotation Angle
380°
Spindle Speed Range
6,000 to 60,000 Rpm
Output Power
1.8 Kw (2.4 Kw Optional)
Transport Package
Customized or Wooden Box Packaging
Specification
1200mm × 1629mm × 1849mm
Trademark
Himalaya
Origin
China
Production Capacity
1111

Product Description

Product Description

Automatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB Board
 

Key Features


Our Automatic Wafer Dicing Machine can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc.

X axis maximum effective
input rang of feed speed
310mm
0.1-1000mm/s
310mm 210mm
0.1-1000mm/s 0.1-600mm/s
Y axis max effective 310mm 310mm 170mm
single step increment 0.0001mm 0.0001mm 0.0001mm
reach accuracy 0.003mm/310mm 0.003mm/310mm 0.003mm/170mm
Z axis maximum effective 40mm 40mm 40mm
repetition accuracy 0.001mm 0.001mm 0.001mm
maximum cutter diameter 58 58 58
T axis maximum rotation angle 380° 380° 380°
spindle speed range 6000-60000rpm 6000-60000rpm 6000-60000rpm
output power 1.8KW(2.4KW) 1.8KW(2.4KW) 1.5KW (2.4KW)
power AC380V±10% AC380V±10% AC380V±10%
Size W×D×H 1200mm×1629mm×1849mm 1080mm×1160mm×1800mm 630mmx900mmx1600mm
Automatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB BoardAutomatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB BoardAutomatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB BoardAutomatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB BoardAutomatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB BoardAutomatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB BoardAutomatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB BoardAutomatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB BoardAutomatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB BoardAutomatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB BoardAutomatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB Board
Company Profile


Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!

Our main products: Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping


Packaging & Freight Services

We ensure your semiconductor equipment arrives in perfect condition, anywhere in the world.

  • Secure Packaging: Protected with shock-absorbing bubble foam inside a robust wooden crate for maximum transit safety.

  • Global Logistics: We arrange and manage reliable shipping via road, sea, and air freight to meet your timeline and budget needs.

Your precision equipment is handled with care from our door to yours.
 

FAQ

Q1: How to choose a suitable machine?
A1: You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q2: What is the warranty period for the equipment?
A2: One year warranty and 24 hours online professional technical support.


Q3: How to choose a suitable machine?
A3: You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.

 

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