Achieve Perfect Alignment with Precision Wafer Mounting Equipment System

• Customization: Available
• After-sales Service: 1 Year
• Warranty: 1 Year
• Model NO.: KM-02
• Classification: Mini Laminating Machine
• Application: Semiconductor
• Driven Type: Manual
• Automatic Grade: Semi-Automatic
• Membrane Material: UV Film
• Plastic Film Mulching Modes: Cold Laminating
• Performance: Anti Ultraviolet Erosion
• Wafer Size: 6 Inch to 8 Inch
• Power: 500W
• Input Power Supply: 100-240V AC 50-60Hz
• Air Pressure: 0.5-0.8 MPa
• Film Type: Blue Film/UV Film
• Plate Heating Temperature: 0~65c
• Film Thickness: 0.05~0.2mm
• Film Function: Manual
• Transport Package: Crate Pack
• Specification: L933*W450*H317mm
• Trademark: Himalaya
• Origin: China
• Production Capacity: 200

Product Description

Product Description

 

A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure uniform adhesion.
 

Wafer Laminator

 

The wafer laminating machine is a machine that coats the blue film or UV film on the wafer and the FRAME iron ring frame, so that the wafer and the FRAME iron ring frame are fixed together. This equipment can stretch and cover the film on the semiconductor (wafer, glass, LED, PCB), and paste the film on the back of the wafer, that is, the cutting frame, through the circular knife and the cross-cutting knife, and can also protect the film from the Patterned wafer surface lift-off.

 

 

Parameter

 

Dimension	L933*W450*H317mm
Compatible size	6"~8"
Total power	500W
Input power supply	100-240V AC 50-60HZ
Air pressure	0.5-0.8Mpa
Film type	Blue film/UV film
Plate heating temperature	0~65ºC
Film thickness	0.05~0.2mm
Film function	Manual
Film cutting function	Manual rotary

 

The main function

 

1. Suitable for blue film, UV film, PET substrate film and double layer film.

2. An optional micro-hole film platen that can be applied to ultra-thin wafers.

3. The heated and elastic lamination plate can be adapted to different thicknesses of wafers.

4. Unique film roller pressure adjustable design.

5. Equipped with circular cutter and cross cutter.

6. Optional plasma air bar electrostatic removal device.7. Small size, desktop placement type.

 

 

Key Features

 

Vacuum-sealed environment - Prevents air entrapment & delamination
Precision temperature control - For thermally activated adhesives (EVA, POE, etc.)
Adjustable pressure system - Ensures even bonding without damage
Automated / semi-automated operation - For high-throughput manufacturing

 

Primary Applications

Solar Panel Manufacturing

Encapsulation of PV cells with EVA/POE films & backsheets

Prevents moisture ingress & improves durability

Printed Circuit Boards (PCBs) & Flex Circuits
Multi-layer PCB lamination (FR4, polyimide films)
Flexible PCB bonding (smart devices, wearables)
 

Electronics & Displays
Touch panel lamination (OGS, cover glass bonding)

OLED/QLED display encapsulation

Automatic substrate laminating machine is our independent research and development, manufacturing of high performance, high stability, high yield automatic substrate laminating machine. Manually place the material box or Magazine containing the substrate and the membrane ring into the device.  Equipment operation will automatically take out the substrate in the material box or Magazine, put it into the working area, the membrane ring is also put into the working area;  Then automatic film, film cutting operations.  After finishing the film, put the finished product into the receiving box. Save manpower, avoid human-caused errors and increase output.


Characteristics

01 Compatible with multi-size substrate \film ring applications

02 Magazine/Material box/basket canbe loaded without stopping

03 Product switching is quick and easy

04 Menu function options fordifferent applications

05 High stability,no bubbles

06 High speed production mode withhigh precision


Operation:

1. First set vacuum time 15s, laminating 35s,remove bubble 3 min,temperature 40ºC
2. Press "automatic" start pre-heating
3. Open laminating door
4. Tear protect film and take inside the mould
5. Take glass with frame on LCD
6. Click LCD centre when in right position
7. Put laminating mould on LCD
8. Take LCD corner something out, prevent broken LCD
9. Take glass inside in laminating zone
10. Then lid on, press start.
11. After wait setting remove bubble time, automatic exhaust
12. Take screen out, finish.
 

Detailed Photos

 

Exhibition & Customers

Field Application

Film Frame Mounter: Applications

A Film Frame Mounter is essential in semiconductor manufacturing for bonding wafers to tape and frames. Key applications include:

1. Wafer Dicing Preparation: Mounting whole wafers onto film frames before dicing to hold dies in place during cutting.

2. Die Attach Preparation: Re-mounting diced wafers onto new frames after expansion, creating optimal spacing for die pickup.

3. Advanced Packaging: Handling ultra-thin wafers in processes like Fan-Out WLP using special UV tapes for support and easy release.

 

Packaging & Shipping

Packaging:
 

Materials: Hardened plywood crate, shock-absorbing foam, desiccant, anti-corrosion strips.

Freight: Air-freight, sea-freight or railway 
 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.