12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly
Product Details
| Customization: | Available |
|---|---|
| After-sales Service: | Free Training |
| Condition: | New |
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Basic Info.
- Model NO.
- DB-01
- Speed
- Super High Speed
- Precision
- High Precision
- Certification
- RoHS, ISO, CE
- Warranty
- 24 Months
- Automatic Grade
- Automatic
- Type
- Ultra High-speed Chip Mounter
- Product Name
- Die Bonding Machine
- Item Number
- SD8012
- Suitable with
- Pdfn,To252-8r,To220/247/3p, Photovoltaic Devices
- Bonding Pressure
- 30-300g (Programmable)
- Track Width
- up to 70mm
- Wafer Size
- 12/ 8/6 Inches
- Tin Wire Diameter
- 0.25-1mm
- Tin Delivery Mode
- Sn, Write, Press (Optional)
- Transport Package
- Wooden Box by Sea Shipping
- Specification
- standard package
- Trademark
- Himalaya
- Origin
- China
- Production Capacity
- 5000
Product Description
12inch Fully automatic soft solder die bonding machine factory
This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new architecture designed for 12-inch wafer structure and is compatible with 8-6-inch products. It also takes into account the placement of large-size high-density lead frames, such as PDFN, TO252-8R, TO220/247/3P, photovoltaic devices, SOP, DPAK matrix, etc.
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonding,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us ?
A3:OEM/ODM/Designing.
This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new architecture designed for 12-inch wafer structure and is compatible with 8-6-inch products. It also takes into account the placement of large-size high-density lead frames, such as PDFN, TO252-8R, TO220/247/3P, photovoltaic devices, SOP, DPAK matrix, etc.
Die Bonder System Capabilities
Productivity & Bonding Performance
| Parameter | Specification |
| Productivity (UPH) | 6K-9K* (Double Tin + Matrix Lead Frame PDFN-10R) |
| Solder Thickness | 1mil-3mil |
| Wafer Tilt | <2mil (Chip Size <150x150mil) |
| <1° (Chip Size >150x150mil) | |
| Soft Solder Voids | ≤2% (Single Void), ≤5% (Total Wafer Area) |
| Soft Solder Coverage | 100% (Wafer to Pad Edge >10mil) |
| XY Position Accuracy | ±1.5mil (38μm) |
| Angular Deflection | ±2° |
Material Handling
| Component | Size Range |
| Wafer Size | 20×20-560×560mil (0.5×0.5-14×14mm) |
| Substrate Size | Length: 110-300mm (4.33"-11.81") |
| Width: 12-102mm (0.47"-4") | |
| Thickness: 0.1-1mm (4-39mils) | |
| Box Size | Length: 110-300mm (4.33"-11.81") |
| Width: 16-120mm (0.63"-4.72") | |
| Height: 68-160mm (2.68"-6.30") |
Machine Specifications
| Parameter | Specification |
| Dimensions | 1,900 × 1,400 × 1,700 mm (W×D×H) |
| Weight | ~1,600 kg |
| Bonding Pressure | 30-300g (programmable) |
| Wafer Compatibility | 12" (8" & 6" optional) |
Solder Handling & Heating System
| Parameter | Specification |
| Tin Wire Diameter | 0.25-1mm |
| Tin Delivery Mode | Sn, Write, Press (optional) |
| Heating Zones | 8 (Heating) + 3 (Cooling) |
| Max Temperature | 450°C (Preheat/Sn/Bonding/Cooling zones) |
| Temp Accuracy | ±3°C |
Power & Utilities
| Parameter | Specification |
| Compressed Air | 250 LPM @ 3bar (min.) |
| 23 LPM @ 3bar (min.) | |
| Mixed Air: 15% H2+ 85% N2 | |
| Vacuum | >-8bar |
| Voltage | 220/240 VAC |
| Frequency | 50/60 Hz |
| Max Load Current | 10A / 29A |
| Power Consumption | ~1,100W / ~2,200W |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonding,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us ?
A3:OEM/ODM/Designing.
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