30W UV CO2 Laser Engraving Machine Mopa Acrylic Jewelry or Wafer Marking
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Product Attributes
- Customization
- Available
- After-sales Service
- 7*24 Hours
- Warranty
- 1 Year
- Model NO.
- DK-01
- Application
- Leather Industry, Domestic, Printing & Packaging, Construction Industry, Molds & Dies, Crafts Industr
- Cooling System
- Air Cooling
- Technical Class
- Continuous Wave Laser
- Automatic Grade
- Automatic
- Applicable Material
- Nonmetal
- Type
- Oscillating Mirror
- Laser Classification
- Free Electron Laser
- Engraving Method
- Vector Engraving
- Beam Quality
- M²<1.6
- Power Stability
- ±1% RMS
- Minimum Line Width
- 50μm
- Marking Speed
- up to 300 Characters/Second
- Pulse Frequency
- 1.6kHz-1000kHz
- Substrate
- Plastic, Metal, Ceramics
- Engraving Depth
- Less Than 0.016"
- Repeat Accuracy
- ±0.0001"
- Laser Output Power
- 20W
- Transport Package
- Crate
- Specification
- 1400mm*915mm*1200mm
- Trademark
- Himalaya
- Origin
- China
- Production Capacity
- 1000
Product Images of 30W UV CO2 Laser Engraving Machine Mopa Acrylic Jewelry or Wafer Marking
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Product Description
Revolutionize Your Engraving: Introducing Our High-Precision Fiber Laser Engraving Machine
In the fast-paced world of modern manufacturing, precision, versatility, and reliability are not just advantages-they are necessities. Meet our state-of-the-art High-Precision Fiber Laser Engraving Machine, engineered to deliver exceptional engraving quality across a wide range of materials. This advanced industrial solution combines superior laser technology with intelligent automation to streamline your production process and enhance your product value.
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Superior Beam Quality: Achieves crisp micro-engravings, fine lines (min. 50µm), and intricate details.
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High-Speed Engraving: Boost productivity with rapid processing speeds.
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Excellent Engraving Depth: Capable of achieving precise depths up to ≤0.016" for permanent markings.
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Compact & Efficient Air-Cooling: No need for bulky water chillers, saving space and reducing maintenance.
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Built-in Protection: A backward reflection isolator protects the laser oscillator from damage caused by reflected light.
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Broad Material Compatibility: Perfect for engraving stainless steel, aluminum, titanium, plastics, and more.
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Low Power Consumption: Energy-efficient operation without compromising on performance.
1. Unmatched Laser Performance for Flawless Results
At the heart of the system is a high-quality fiber laser oscillator renowned for its exceptional beam quality (M² < 1.6). This ensures a perfectly focused spot, leading to sharp, clean, and consistent engravings every time-from deep marks to high-contrast surface engraving on metals, plastics, ceramics, and more.2. Intelligent, User-Friendly Operation
Our integrated Smart Control System features an intuitive human-machine interface (HMI) and a powerful, independent process database. This makes operation simple for beginners while offering rich functionality for experts. Easily store and recall parameters for different materials and engraving depths, ensuring optimal results with just a click.3. High-Speed Precision with Imported Core Components
Speed and accuracy are guaranteed by our imported high-speed galvanometer and F-theta lens. This combination provides extremely low thermal drift and stable spot trajectory control, enabling high-speed, high-precision engraving and cutting.4. Automated Precision with CCD Vision Positioning
Achieve perfect alignment batch after batch with the integrated CCD positioning system. It automatically pre-scans workpieces, identifies Mark points, and precisely positions the laser, eliminating human error and ideal for high-volume precision engraving tasks.5. Robust and Reliable Mechanical Design
Durability is built-in with an imported linear motor system paired with an optical encoder. This ensures a fully closed-loop drive for the processing platform, offering high precision, easy maintenance, and a long operational lifespan.

| Laser Engraving System Specifications | ||
| Feature | Specification Set 1 | Specification Set 2 |
| Laser Type | UV Laser | Fiber Laser (inferred) |
| Laser Wavelength | 355 nm | - |
| Output Power | 4W / 7W / 10W / 15W / 25W | 20W |
| Beam Quality (M²) | - | < 1.6 |
| Marking/Engraving Speed | 250 characters/sec | ≤ 7 m/s (22.97 ft/s) |
| Standard Marking Area | 100 x 100 mm | 100 x 100 mm (3.9" x 3.9") |
| Standard Lens | F160 | F160 |
| Min. Line Width | 10 µm - 15 µm | 50 µm |
| Min. Character Size | - | 0.01" |
| Max. Engraving Depth | - | ≤ 0.016" |
| Repeat Accuracy | - | ± 0.0001" |
| Pulse Repetition Frequency | 10 - 200 kHz | - |
| Cooling Method | Water Cooling | Air Cooling |
| Power Supply | AC 220V, 50Hz, 16A | - |
| Total Power Consumption | ≤ 1.5 kW | - |
| System Dimensions | 600 x 800 x 1350 mm | 550 x 790 x 760 mm (1.8' x 2.6' x 2.5') |
Technical Specifications (Model: G20)
Ideal Applications
This versatile machine is the perfect solution for industries demanding permanent, high-quality engravings:
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Industrial Part Engraving: Serial numbers, logos, data matrix codes, and barcodes.
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Electronics & Semiconductors: Engraving PCBs, IC chips, and components.
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Medical & Dental Devices: Engraving surgical tools, implants, and instruments for traceability.
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Automotive & Aerospace: VIN engraving, part identification, and component tracking.
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Jewelry & Luxury Goods: Custom deep engraving, personalized designs, and branding.
We serve various industries including electronics, medical devices, automotive, and jewelry, offering both standard solutions and customized laser systems. Our commitment to innovation, quality, and customer satisfaction makes us a trusted partner for businesses worldwide.
We are an ISO 9001-certified manufacturer and innovator specializing in semiconductor equipment, with 6 registered utility model patents (UM Patents) in China. Our patented technologies cover:
Semiconductor annealing systems
Cleaning equipment for semiconductor etching
UV debonding machines
And more .
Q1: What is the main difference between this fiber laser engraving machine and a CO2 laser?
A: Our fiber laser is primarily designed for marking and engraving metals and hard plastics, offering superior speed and permanence on these materials. CO2 lasers are generally better for non-metal materials like wood, acrylic, leather, and fabric. The fiber laser's superior beam quality also allows for finer detail on small parts.
Q2: What materials can this machine engrave?
A: It is highly effective on a wide range of materials, including:
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Metals: Stainless steel, aluminum, brass, copper, titanium, and anodized aluminum.
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Plastics: ABS, Polycarbonate, Delrin, and many other engineered plastics.
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Other Materials: Ceramics and some coated surfaces.
Q3: Is special training required to operate the machine?
A: The machine features an intuitive, user-friendly software interface that makes basic operation easy to learn. However, we recommend taking advantage of the training we provide to fully utilize the advanced features and the material-specific settings in the process database for optimal results.
Q4: How does the CCD vision positioning system work?
A: The integrated CCD camera automatically scans the workpiece to find pre-defined "mark points" (like a small cross or circle). It then adjusts the engraving path to perfectly align with the actual position of each part. This is essential for high-accuracy batch processing on jigged parts, compensating for minor placement variations.
About the Supplier
This supplier has been audited by BV. Verify the report on the official BV website with ID "MIC-ASI2342144". Items marked "" are certified.
Company Profile
Empowering Global Semiconductor Excellence: An Introduction to Jiangsu Himalaya Semiconductor Co., Ltd.
In the rapidly evolving landscape of global electronics, precision and reliability are the cornerstones of success. Since its establishment in 2019, Jiangsu Himalaya Semiconductor Co., Ltd. Has emerged as a pivotal force in the semiconductor industry, specializing in the high-level integration and international trade of advanced manufacturing equipment.
With a footprint extending to over 30 countries and a robust network of more than 200 global customers and suppliers, we serve as the critical link in the semiconductor supply chain. Our mission is clear: To secure the most cost-effective, high-performance solutions for our clients while ensuring seamless, risk-free transactions for our partners.
Comprehensive Equipment Solutions for Semiconductor Manufacturing
We take pride in our diverse portfolio of high-precision machinery designed to meet the rigorous demands of modern wafer processing and packaging.
1. Advanced Bonding & Marking
Precision at the microscopic level is essential for chip integrity. Our core lineup includes:
Die Bonders: Ensuring high-speed, accurate placement of chips.
Wire Bonding: Providing reliable electrical interconnections with industry-leading stability.
Laser Marking: Specialized ID marking for IC wafers to ensure full traceability throughout the lifecycle.
2. Cutting-Edge Laser Processing
As wafers become thinner and materials more complex, our laser solutions provide the necessary finesse without compromising structural integrity:
Laser Grooving & Cutting: Expertly designed for glass, ceramics, and wafer packaging.
Internal Modification Machines: Specialized laser technology for Si/SiC (Silicon Carbide) and LT/LN (Lithium Tantalate/Lithium Niobate) wafers.
Laser Annealing: Optimized for Si/SiC substrates to enhance electrical properties and repair lattice damage.
3. Dicing & Dispensing
Automatic Dicing Saw Machines: High-efficiency dicing for wafer packaging applications.
Automatic Silicone Dispensing Equipment: Precision fluid control for protective coating and encapsulation.
Customized Industrial Solutions
Beyond standard machinery, Jiangsu Himalaya Semiconductor provides specialized engineering solutions tailored to unique factory requirements:
TGV (Through Glass Via) Technology: Offering manual, semi-automatic, and fully automatic equipment for next-generation 3D packaging.
Coating & Plating: Customized machines designed for specific surface treatment and metal deposition needs.
Environmental & Resource Management: Efficient solutions for handling exhausted metal sorter equipment, promoting sustainable manufacturing practices.
Why Partner with Jiangsu Himalaya Semiconductor?
In a market defined by volatility, we offer stability and strategic advantage. We understand that for our customers, the "final stage" of procurement is the most critical. We utilize our deep industry expertise to filter through global options, delivering products that balance cost with cutting-edge performance.
For our suppliers, we are a partner of trust. We strive for one-time payment collection and comprehensive risk avoidance, allowing manufacturers to focus on innovation while we handle the complexities of global distribution.
Contact Us Today
Whether you are scaling your production line or seeking a reliable global export partner, Jiangsu Himalaya Semiconductor Co., Ltd. is ready to elevate your operations.
Explore the peak of semiconductor technology with Himalaya.
About Our Factory & Business Background
- Address
- Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
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Registered Capital
- 100,000,000 RMB
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Terms of Payment
- LC, T/T, PayPal, Western Union
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International Commercial Terms(Incoterms)
- FOB, CIF, CFR, EXW
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Average Lead Time
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Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months -
Nearest Port
- Shenzhen Port
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Minimum Order Quantity
- 1 Set
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Supply Chain Partners
- 30
Our Production Capability & Technical Expertise
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Main Products
- Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
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Inspection Type for Finished Products
- 100% inspection(Visual inspection & Function inspection)
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Inspection Method for Finished Products
- Finished product checked by packing staff
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Customization Options
- Flexible customization
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ODM Service Available
- Yes
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OEM Service Available
- Yes
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Traceability of Raw Materials
- No
Our Industry Experience & Global Business Record
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Year of Establishment
- 2019-09-12
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Export Year
- 5 Years
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Main Markets
- Europe
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Repeat Buyers Choice
- 80%~100%
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