Advanced Green Laser Dicing System for Sic Wafer Cutting
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Product Highlights
- Specialized Laser Source: Uses 532nm Green Laser (30W) for minimal thermal impact on brittle materials.
- Advanced Motion System: Equipped with Linear Motors and Ball Screw for high-precision control.
- Customizable Processing: Supports custom dimensions, fixtures, and CCD monitoring systems.
- Stable Marble Base: Marble platform ensures vibration-free operation for consistent quality.
- Versatile Applications: Ideal for electronics, medical devices, ceramics, and glass processing.
- Comprehensive Warranty: Provides 12-month standard warranty with extended service options.
- Professional Support: Offers pre-sales consultation and after-sales technical maintenance.
Product Attributes
- Customization
- Available
- After-sales Service
- Provided
- Warranty
- 12 Months
- Model NO.
- GLC-01
- Application
- Home Appliance, Environmental Equipment, Automotive Industry
- Cooling System
- Air Cooling
- Technical Class
- Continuous Wave Laser
- Applicable Material
- Metal
- Structure Type
- Gantry Type
- Laser Classification
- Free Electron Laser
- Laser Technology
- Laser Control Fault Cutting
- Laser Source
- 532nm Green Laser, 30W
- Motion System
- Linear Motors (X/Y-Axis: 200mm) + Ball Screw Z-Axi
- Vision System
- Custom CCD Monitoring System
- Control System
- Ky-Urcutting Motion Control Software
- Dimensions
- 1410 × 1350 × 2070mm
- Weight
- 1090kg
- Materials
- Brittle Materials, High-Hardness Metals
- Processing Area
- 150×150mm
- Cutting Precision
- ±0.05mm
- Transport Package
- Customized or Wooden Box Packaging
- Specification
- Standard Specifications
- Trademark
- Himalaya
- Origin
- China
Product Images of Advanced Green Laser Dicing System for Sic Wafer Cutting
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Advanced Green Laser Dicing System for Sic Wafer Cutting -
Advanced Green Laser Dicing System for Sic Wafer Cutting -
Advanced Green Laser Dicing System for Sic Wafer Cutting -
Advanced Green Laser Dicing System for Sic Wafer Cutting -
Advanced Green Laser Dicing System for Sic Wafer Cutting -
Advanced Green Laser Dicing System for Sic Wafer Cutting -
Advanced Green Laser Dicing System for Sic Wafer Cutting
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Product Description
Our Precision Green Laser Cutting System represents the forefront of laser processing technology for brittle and heat-sensitive materials. Utilizing a specialized 532nm wavelength laser source, this machine delivers exceptional cutting precision with minimal thermal impact, making it ideal for high-value manufacturing applications in electronics, medical devices, and advanced materials processing.
Technical Parameters
| Parameter | Specification |
|---|---|
| Model | Green Laser Cutting Machine |
| Laser Type | Green Laser (532nm) |
| Laser Power | 30W |
| Cutting Precision | ±0.05mm |
| Cutting Width | <0.15mm |
| Processing Area | 150×150mm (Customizable) |
| Control Mode | Automatic |
| File Format | DXF |
| Cooling Method | Water-cooled |
| Power Supply | 220V/50Hz |
| Customization | Supported |
Application Areas
| Industry | Application |
|---|---|
| Electronics | PCB cutting, semiconductor processing |
| Medical Devices | Precision component manufacturing |
| Advanced Materials | Ceramic drilling, diamond cutting |
| Research & Development | Material processing experiments |
| Precision Manufacturing | Glass perforation, brittle material processing |
Core Technical Configuration
| Component | Specification |
|---|---|
| Laser Source | 532nm Green Laser, 30W |
| Machine Structure | Integrated Sheet Metal Cabinet + Marble Platform |
| Motion System | Linear Motors (X/Y-axis: 200mm) + Ball Screw Z-axis (100mm) |
| Cooling System | Dual-Temperature Controlled Water Chiller |
| Cutting Head | Custom KY Design |
| Vision System | Custom CCD Monitoring System |
| Control System | KY-URCutting Motion Control Software |
| Industrial PC | Yanhua Industrial Computer |
| Fume Extraction | Custom Smoke Extraction System |
| Fixture System | Customer-Specific (Customizable) |
Performance Characteristics
Cutting Performance
-
Materials: Brittle materials, high-hardness metals, thermal-sensitive substrates
-
Cutting Quality: Smooth edges, burr-free, minimal heat-affected zone
-
Positioning Accuracy: High-precision motion control system
Operational Features
-
User Interface: Intuitive control software
-
Safety: Fully enclosed protective cabinet
-
Stability: Marble base for vibration-free operation
-
Flexibility: Rotatable processing platform
Quality & Service
-
Pre-sales: Professional technical consultation and customization services
-
After-sales: Comprehensive technical support and maintenance services
-
Warranty: Standard manufacturer warranty with extended service options
Physical Specifications
-
Dimensions: 1410 × 1350 × 2070mm (Customizable)
-
Weight: 1090kg
-
Installation Requirements: Clean room environment recommended
About the Supplier
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Company Profile
Empowering Global Semiconductor Excellence: An Introduction to Jiangsu Himalaya Semiconductor Co., Ltd.
In the rapidly evolving landscape of global electronics, precision and reliability are the cornerstones of success. Since its establishment in 2019, Jiangsu Himalaya Semiconductor Co., Ltd. Has emerged as a pivotal force in the semiconductor industry, specializing in the high-level integration and international trade of advanced manufacturing equipment.
With a footprint extending to over 30 countries and a robust network of more than 200 global customers and suppliers, we serve as the critical link in the semiconductor supply chain. Our mission is clear: To secure the most cost-effective, high-performance solutions for our clients while ensuring seamless, risk-free transactions for our partners.
Comprehensive Equipment Solutions for Semiconductor Manufacturing
We take pride in our diverse portfolio of high-precision machinery designed to meet the rigorous demands of modern wafer processing and packaging.
1. Advanced Bonding & Marking
Precision at the microscopic level is essential for chip integrity. Our core lineup includes:
Die Bonders: Ensuring high-speed, accurate placement of chips.
Wire Bonding: Providing reliable electrical interconnections with industry-leading stability.
Laser Marking: Specialized ID marking for IC wafers to ensure full traceability throughout the lifecycle.
2. Cutting-Edge Laser Processing
As wafers become thinner and materials more complex, our laser solutions provide the necessary finesse without compromising structural integrity:
Laser Grooving & Cutting: Expertly designed for glass, ceramics, and wafer packaging.
Internal Modification Machines: Specialized laser technology for Si/SiC (Silicon Carbide) and LT/LN (Lithium Tantalate/Lithium Niobate) wafers.
Laser Annealing: Optimized for Si/SiC substrates to enhance electrical properties and repair lattice damage.
3. Dicing & Dispensing
Automatic Dicing Saw Machines: High-efficiency dicing for wafer packaging applications.
Automatic Silicone Dispensing Equipment: Precision fluid control for protective coating and encapsulation.
Customized Industrial Solutions
Beyond standard machinery, Jiangsu Himalaya Semiconductor provides specialized engineering solutions tailored to unique factory requirements:
TGV (Through Glass Via) Technology: Offering manual, semi-automatic, and fully automatic equipment for next-generation 3D packaging.
Coating & Plating: Customized machines designed for specific surface treatment and metal deposition needs.
Environmental & Resource Management: Efficient solutions for handling exhausted metal sorter equipment, promoting sustainable manufacturing practices.
Why Partner with Jiangsu Himalaya Semiconductor?
In a market defined by volatility, we offer stability and strategic advantage. We understand that for our customers, the "final stage" of procurement is the most critical. We utilize our deep industry expertise to filter through global options, delivering products that balance cost with cutting-edge performance.
For our suppliers, we are a partner of trust. We strive for one-time payment collection and comprehensive risk avoidance, allowing manufacturers to focus on innovation while we handle the complexities of global distribution.
Contact Us Today
Whether you are scaling your production line or seeking a reliable global export partner, Jiangsu Himalaya Semiconductor Co., Ltd. is ready to elevate your operations.
Explore the peak of semiconductor technology with Himalaya.
About Our Factory & Business Background
- Address
- Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
-
Registered Capital
- 100,000,000 RMB
-
Terms of Payment
- LC, T/T, PayPal, Western Union
-
International Commercial Terms(Incoterms)
- FOB, CIF, CFR, EXW
-
Average Lead Time
-
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months -
Nearest Port
- Shenzhen Port
-
Minimum Order Quantity
- 1 Set
-
Supply Chain Partners
- 30
Our Production Capability & Technical Expertise
-
Main Products
- Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
-
Inspection Type for Finished Products
- 100% inspection(Visual inspection & Function inspection)
-
Inspection Method for Finished Products
- Finished product checked by packing staff
-
Customization Options
- Flexible customization
-
ODM Service Available
- Yes
-
OEM Service Available
- Yes
-
Traceability of Raw Materials
- No
Our Industry Experience & Global Business Record
-
Year of Establishment
- 2019-09-12
-
Export Year
- 5 Years
-
Main Markets
- Europe
-
Repeat Buyers Choice
- 80%~100%
FAQ
- What materials can this laser cutter process?
- It is suitable for brittle materials, high-hardness metals, thermal-sensitive substrates, ceramics, diamonds, and glass.
- Is customization available for this machine?
- Yes, customization is supported for dimensions, fixtures, and the CCD monitoring system.
- What is the warranty period?
- We provide a 12-month warranty with extended service options available.
- What is the lead time for orders?
- The lead time is 1-3 months during the off-season and 3-6 months during the peak season.
- What are the payment terms?
- We accept LC, T/T, PayPal, and Western Union.
- What is the minimum order quantity?
- The minimum order quantity is 1 set.
- What cooling system does the machine use?
- The machine features a dual-temperature controlled water chiller for stable operation.
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