Fully Automatic Green Laser Cutting System for Sic Wafer Dicing

Product Details
Customization: Available
After-sales Service: Provided
Warranty: 12 Months
Gold Member Since 2023

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  • Fully Automatic Green Laser Cutting System for Sic Wafer Dicing
  • Fully Automatic Green Laser Cutting System for Sic Wafer Dicing
  • Fully Automatic Green Laser Cutting System for Sic Wafer Dicing
  • Fully Automatic Green Laser Cutting System for Sic Wafer Dicing
  • Fully Automatic Green Laser Cutting System for Sic Wafer Dicing
  • Fully Automatic Green Laser Cutting System for Sic Wafer Dicing
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  • Overview
  • Product Description
  • Product Parameters
  • Applications
  • Detailed Photos
  • Specification
Overview

Basic Info.

Model NO.
GLC-01
Application
Home Appliance, Environmental Equipment, Automotive Industry
Cooling System
Air Cooling
Technical Class
Continuous Wave Laser
Applicable Material
Metal
Structure Type
Gantry Type
Laser Classification
Free Electron Laser
Laser Technology
Laser Control Fault Cutting
Laser Source
532nm Green Laser, 30W
Motion System
Linear Motors (X/Y-Axis: 200mm) + Ball Screw Z-Axi
Vision System
Custom CCD Monitoring System
Control System
Ky-Urcutting Motion Control Software
Dimensions
1410 × 1350 × 2070mm
Weight
1090kg
Materials
Brittle Materials, High-Hardness Metals
Processing Area
150×150mm
Cutting Precision
±0.05mm
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
Fully Automatic Green Laser Cutting System for Sic Wafer Dicing
Fully Automatic Green Laser Cutting System for Sic Wafer Dicing

 

Our Precision Green Laser Cutting System represents the forefront of laser processing technology for brittle and heat-sensitive materials. Utilizing a specialized 532nm wavelength laser source, this machine delivers exceptional cutting precision with minimal thermal impact, making it ideal for high-value manufacturing applications in electronics, medical devices, and advanced materials processing.
 
Product Parameters

Technical Parameters

 
 
Parameter Specification
Model Green Laser Cutting Machine
Laser Type Green Laser (532nm)
Laser Power 30W
Cutting Precision ±0.05mm
Cutting Width <0.15mm
Processing Area 150×150mm (Customizable)
Control Mode Automatic
File Format DXF
Cooling Method Water-cooled
Power Supply 220V/50Hz
Customization Supported
 
Applications

Fully Automatic Green Laser Cutting System for Sic Wafer Dicing

Application Areas

 
 
Industry Application
Electronics PCB cutting, semiconductor processing
Medical Devices Precision component manufacturing
Advanced Materials Ceramic drilling, diamond cutting
Research & Development Material processing experiments
Precision Manufacturing Glass perforation, brittle material processing
Detailed Photos

Fully Automatic Green Laser Cutting System for Sic Wafer Dicing

Specification

Core Technical Configuration

 
 
Component Specification
Laser Source 532nm Green Laser, 30W
Machine Structure Integrated Sheet Metal Cabinet + Marble Platform
Motion System Linear Motors (X/Y-axis: 200mm) + Ball Screw Z-axis (100mm)
Cooling System Dual-Temperature Controlled Water Chiller
Cutting Head Custom KY Design
Vision System Custom CCD Monitoring System
Control System KY-URCutting Motion Control Software
Industrial PC Yanhua Industrial Computer
Fume Extraction Custom Smoke Extraction System
Fixture System Customer-Specific (Customizable)
 

Performance Characteristics

Cutting Performance

  • Materials: Brittle materials, high-hardness metals, thermal-sensitive substrates

  • Cutting Quality: Smooth edges, burr-free, minimal heat-affected zone

  • Positioning Accuracy: High-precision motion control system

Operational Features

  • User Interface: Intuitive control software

  • Safety: Fully enclosed protective cabinet

  • Stability: Marble base for vibration-free operation

  • Flexibility: Rotatable processing platform

     

    Fully Automatic Green Laser Cutting System for Sic Wafer Dicing
    Fully Automatic Green Laser Cutting System for Sic Wafer Dicing

     



Quality & Service

  • Pre-sales: Professional technical consultation and customization services

  • After-sales: Comprehensive technical support and maintenance services

  • Warranty: Standard manufacturer warranty with extended service options

 

Physical Specifications

  • Dimensions: 1410 × 1350 × 2070mm (Customizable)

  • Weight: 1090kg

  • Installation Requirements: Clean room environment recommended

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