Wire Bonding Machine for Semiconductor Production

Product Details
Customization: Available
After-sales Service: 1 Year
Condition: New
Gold Member Since 2023

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  • Wire Bonding Machine for Semiconductor Production
  • Wire Bonding Machine for Semiconductor Production
  • Wire Bonding Machine for Semiconductor Production
  • Wire Bonding Machine for Semiconductor Production
  • Wire Bonding Machine for Semiconductor Production
  • Wire Bonding Machine for Semiconductor Production
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  • Overview
  • Product Description
  • Specification
  • Packing & Delivery
  • Company Profile
  • FAQ
Overview

Basic Info.

Model NO.
HM-WB-01
Speed
High Speed
Precision
Precision
Certification
ISO, CE
Warranty
12 Months
Automatic Grade
Automatic
Type
High-speed Chip Mounter
Online Technical Guidance
Per Required
Visit The Production and Use of Customer
2-4 Times/Year
Installations
Vertical
Model Number
H580plus
Linear Table Size
56mm × 80mm
Linear Table
Linear Motor-Driven Xy Table
Precision & Speed
45ms/Line Bonding Cycle
Freight
Air, Sea or Railway
Transport Package
Wooden Pack
Specification
985mm * 960mm * 1770mm
Trademark
Himalaya
Origin
China
Production Capacity
100

Product Description

Wire Bonding Machine for Semiconductor Production
Product Description
Maximize Output, Minimize Downtime: The H580PLUS Automatic Wire Bonder
The Himalaya H580PLUS is a high-performance, fully automatic, vertical injection molding machine designed for mass production. It is a new machine built to international quality and safety standards, as indicated by its numerous certifications. A key highlight of this model is its robust construction, promising a mould life of over one million cycles, making it a durable and cost-effective solution for high-volume manufacturing. The manufacturer supports the product with a comprehensive 12-month warranty and an exceptional package of ongoing technical support and customer partnership.
Specification
Wire Bonding Machine for Semiconductor Production
Wire Bonding Machine for Semiconductor Production
Feature/Specification
Detail
Model Number
H580PLUS
Condition
New
Certifications
CCC, PSE, FDA, RoHS, ISO, CE
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Pneumatic
Mould Life
>1,000,000 Shots
Online Technical Guidance
Once Every Month
Customer Production/Use Visits
2-4 Times/Year
Customer Technical Personnel Invitations
2 Per Year (S2 Opportunities)
Introduction of Domestic Advanced Technology/Updates
Every Year
Transport Package
International Trade Standard
Specification (Dimensions)
985mm * 960mm * 1770mm
Trademark
Himalaya
Origin
China
HS Code
8486402200
Packing & Delivery
Wire Bonding Machine for Semiconductor Production
Wire Bonding Machine for Semiconductor Production
We provide sea-freight, air-freight and railway freight for clients from different countries.
our semiconductor equipment is packed with wooden boxes to secure the transportation to avoid any possible damage to our wire bonding machine.
Company Profile
Jiangsu Himalaya Semiconductor Co., Ltd. 
Jiangsu Himalaya Semiconductor Co., Ltd. (est. 2019) specializes in global semiconductor equipment integration and trade. We supply Die Bonders, Wire Bonding, Laser Marking/Cutting/Grooving systems, and Wafer Processing Solutions (Si/SiC/LT/LN) to 200+ clients across 30+ countries. Our mission: Deliver cost-optimized procurement while ensuring supplier payment security through streamlined transactions.
Wire Bonding Machine for Semiconductor Production
Wire Bonding Machine for Semiconductor Production
Wire Bonding Machine for Semiconductor Production
FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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