Higher Accuracy Wire Bonding/Welding Machine for Sot, Sop, Qfp, DIP, BGA, COB

• Customization: Available
• Function: High Temperature Resistance
• Demoulding: Pull Core
• Model NO.: WBM-01
• Condition: New
• Certification: CCC, PSE, FDA, RoHS, ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Pneumatic
• Mould Life: >1,000,000 Shots
• Applicable Wire Diameter: φ15 ~ φ50μm (Gold or Copper)
• Maximum Bonding Area: X: 56mm, Y: 80mm
• Repeatability: ±3μm (@ 3-Sigma)
• Position Accuracy: ±3μm (@ 3-Sigma)
• Applicable IC Products: to, Sot, Sop, Ssop, Tssop, Solc, Qfp, DIP, BGA,
• Magazine Compatibility: Length: 100 to 275 mm Width: 30 to 90mm
• Weight: 660kg
• Bonding Cycle: 45 Ms Per Wire
• Transport Package: International Trade Standard
• Specification: 985mm*960mm*1770mm
• Trademark: Himalaya
• Origin: China
• HS Code: 8486402200
• Production Capacity: 100

Product Description

Product Description

 

High Speed Fully Automatic Gold/Copper Wire Bonder

1,New servo system, faster response, higher accuracy, and higher UPH;
2,New zoom lens, wider range, clearer images, and higher structural stiffness;
3,New defense line module to improve consistency in wiring;
4,More stable binding force control, more precise force response;
5,Advanced bonding force calibration capability, fast and accurate, and easy to operate;
6,Intelligent detection function, prompting users to perform timely calibration of bonding force;
7,High precision post weld inspection function (PBI);
8,New line arc algorithm, suitable for more materials and meeting the needs of complex products;
9,The operation control drive system, optical system, and core components with independent intellectual property represent the leading level of the industry;
10,Applicable to IC products:TO, SOT, SOP, SSOP, TSSOP, SOLC, QFP, DIP, BGA, COB, optocoupler, etc

Performance Specifications
Category	Specification
Bonding Performance
Bonding Cycle	45 ms per wire
Applicable Wire Diameter	Φ15 ~ Φ50μm (Gold or Copper)
XY Table & Positioning
Drive Method	Linear Motor Drive
Maximum Bonding Area	X: 56mm, Y: 80mm
Repeatability	±3μm (@ 3-sigma)
Position Accuracy	±3μm (@ 3-sigma)
Inspection & Capabilities
Inspection Function	High Precision Post Weld Inspection (PBI)
Applicable IC Products	TO, SOT, SOP, SSOP, TSSOP, SOLC, QFP, DIP, BGA, COB, Optocoupler, etc.
Material Handling System
Parameter	Specification
Inlet/Outlet Structure	Vertical Stacked
Handling Mechanism	Mechanical
Equipment Material Box	2~3
Buffered Magazines	2~3
Magazine Compatibility
Length	100 ~ 275 mm
Width	30 ~ 90 mm
Height	65 ~ 180 mm
Magazine Pitch	1.5 ~ 10 mm
Physical Dimensions & Weight
Parameter	Specification
Dimensions (W x D x H)	985 mm x 960 mm x 1770 mm
Weight	≈ 660 kg

 
 

Key Features

High-Speed Fully Automatic Gold/Copper Wire Bonder - Technical Specifications

This machine is a high-precision, fully automatic wire bonder designed for a wide range of integrated circuit (IC) packages, featuring a new servo system, advanced optical system, and intelligent force control for superior performance and consistency.

Key Features & Advantages:

• New Servo System: Faster response, higher accuracy, and increased Units Per Hour (UPH).

• Advanced Optics: New zoom lens for a wider view, clearer images, and higher structural stiffness.

• Intelligent Force Control: More stable and precise bonding force with advanced calibration and intelligent calibration prompts.

• Innovative Software: New line arc algorithm for more materials and complex products.

• Proprietary Technology: Features operation control, drive system, optical system, and core components with independent intellectual property.

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!

Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
 

Our Clients

Driving Innovation in Semiconductor Manufacturing

We design and build high-performance semiconductor equipment that serves a world-class clientele, including Honeywell, Foxconn, HT-Tech, Tsinghua Tongfang, Xi'an Jiaotong University, TCL, HP, AVIC Intl., and Tusholdings.

Our solutions are engineered for excellence, supporting applications from mass production to advanced research and development. Partner with us for technology that is trusted by leaders in aerospace, consumer electronics, and academia to push the boundaries of what's possible.

 

Packaging & Shipping

 

Packaging & Freight Services

We ensure your semiconductor equipment arrives in perfect condition, anywhere in the world.

Secure Packaging: Protected with shock-absorbing bubble foam inside a robust wooden crate for maximum transit safety.

Global Logistics: We arrange and manage reliable shipping via road, sea, and air freight to meet your timeline and budget needs.

Your precision equipment is handled with care from our door to yours.
 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.