| Customization: | Available |
|---|---|
| After-sales Service: | Free Training |
| Condition: | New |
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High-Precision Die Bonding System for Advanced Semiconductor Packaging
This automated die bonding system is engineered for high-yield, high-accuracy assembly of semiconductor devices, including challenging applications like Double Tin and Matrix Lead Frame packages (e.g., PDFN-10R). It combines exceptional placement accuracy with robust process control to ensure superior bond quality and reliability.
Core Process Capabilities & Performance:
Productivity: Achieves 6,000 to 9,000 units per hour*.
Placement Accuracy: XY Position Accuracy of ±1.5mil (38µm) with Angular Deflection within ±2°.
Bonding Force: Programmable bonding pressure from 30g to 300g for delicate control.
Solder Process: Supports soft solder with void rates as low as 2% (single) and 5% (total), ensuring >100% coverage with a >10mil edge margin.
Material Handling Flexibility:
Wafer Compatibility: Handles wafers from 20x20mil up to 12-inch standard (6-inch and 8-inch optional).
Substrate Range: Accommodates substrates from 110mm to 300mm in length and 12mm to 102mm in width.
Solder Delivery: Utilizes Sn wire with a diameter of 0.25mm to 1.0mm.
Advanced Thermal Management System:
Heating Profile: An 8-zone heating track with a 3-zone cooler ensures a precise thermal profile.
Temperature Performance: Maximum operating temperature of 450°C across all zones with an accuracy of ±3°C.
Utility & Physical Specifications:
Utilities: Requires compressed air (250 LPM @ 3bar), forming gas (15% H/ 85% N), and vacuum (>-8bar).
Power: Dual-mode power consumption: ~1,100W (Standard) and ~2,200W (High-Power).
Footprint: Compact machine dimensions of 1,900 x 1,400 x 1,700 mm and a weight of approximately 1,600 kg.
| Die Bonding System Technical Specifications | ||
| Category | Parameter | Specification / Value |
| System Capabilities | Productivity | 6,000 - 9,000 UPH* (e.g., Double Tin + Matrix Lead Frame PDFN-10R) |
| Solder Thickness | 1 - 3 mil | |
| Wafer Tilt | < 2 mil (Chip Size < 150x150 mil) | |
| < 1° (Chip Size > 150x150 mil) | ||
| Soft Solder Voids | Single Void: ≤ 2% | |
| Total Area: ≤ 5% | ||
| Soft Solder Coverage | 100% (Wafer to Pad Edge > 10 mil) | |
| XY Position Accuracy | ± 1.5 mil (38 μm) | |
| Angular Deflection | ± 2° | |
| Material Handling | Wafer Size Range | 20x20 mil - 560x560 mil (0.5x0.5 mm - 14x14 mm) |
| Standard Wafer Size | 12 inches | |
| Optional Wafer Sizes | 8 inches, 6 inches | |
| Substrate Size (L x W x Thk) | 110-300 mm x 12-102 mm x 0.1-1.0 mm | |
| (4.33"-11.81" x 0.47"-4" x 4-39 mils) | ||
| Box Size (L x W x H) | 110-300 mm x 16-120 mm x 68-160 mm | |
| (4.33"-11.81" x 0.63"-4.72" x 2.68"-6.30") | ||
| Bonding System | Bonding Pressure | 30 - 300 g (Programmable) |
| Solder System | Tin Wire Diameter | 0.25 - 1.0 mm |
| Tin Delivery Mode | Sn, Write, Press (Optional) | |
| Heating Track | Heating Zones | 8 |
| Cooling Zones | 3 | |
| Max Operating Temp. (All Zones) | 450 °C | |
| Temperature Accuracy | ± 3 °C | |
| Utilities & Power | Compressed Air | 250 LPM @ 3 bar (min.) |
| Mixed Forming Gas | 15% H + 85% N | |
| Vacuum | > -8 bar | |
| Voltage & Frequency | 220/240 VAC, 50/60 Hz | |
| Max Load Current | 10 A | 29 A | |
| Power Consumption | ~1,100 W (Standard) | |
| ~2,200 W (High Power) | ||
| Physical Specs | Machine Dimensions (W x D x H) | 1,900 x 1,400 x 1,700 mm |
| Weight | ~1,600 kg | |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
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