High Precision Plasma Cleaning Machine for Semiconductor Surfaces

Product Details
Customization: Available
After-sales Service: Provided
Function: Abrasion Resistance, High Temperature Resistance, Anti-Corrosion
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High Precision Plasma Cleaning Machine for Semiconductor Surfaces pictures & photos
High Precision Plasma Cleaning Machine for Semiconductor Surfaces pictures & photos
High Precision Plasma Cleaning Machine for Semiconductor Surfaces pictures & photos
High Precision Plasma Cleaning Machine for Semiconductor Surfaces pictures & photos
High Precision Plasma Cleaning Machine for Semiconductor Surfaces pictures & photos
High Precision Plasma Cleaning Machine for Semiconductor Surfaces pictures & photos
  • High Precision Plasma Cleaning Machine for Semiconductor Surfaces
  • High Precision Plasma Cleaning Machine for Semiconductor Surfaces
  • High Precision Plasma Cleaning Machine for Semiconductor Surfaces
  • High Precision Plasma Cleaning Machine for Semiconductor Surfaces
  • High Precision Plasma Cleaning Machine for Semiconductor Surfaces
  • High Precision Plasma Cleaning Machine for Semiconductor Surfaces

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Overview

Basic Info.

Model NO.
CM-01
Demoulding
Pull Core
Condition
New
Certification
ISO, CE
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
300,000-1,000,000 Shots
Product Name
Plasma Cleaning Machine
Feature 1
Adjustable
Feature 2
Environmental Protection
OEM/ODM Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China
Production Capacity
100

Product Description

Product Description

High Precision Plasma Cleaning Machine for Semiconductor Surfaces

1.  Stainless steel of the vacuum chamber;

2.  Ultra low temperature -  The temperature is as low as 40 ºC;

3.  Omnidirectional surface cleaning -  Different plasma can enter the ultra-fine slit for cleaning;

4.  Environmental protection - No harmful substances are produced before and after treatment, and keep away from the harmful solvents to human body;

5.  Stability - Continuity and constancy to maintain the stability of machinery and equipment during operation;

6.  Cleaning - Remove dust and oil, fine cleaning and static electricity;

7.  Excitation - Improve the adhesion ability of the surface and greatly increase the surface energy of the object;

8.  Platy stripping -  AF / AS layer platy stripping.
 

Function 

configuration

Technical parameter
Model VP-60L VP-80L VP-100L VP-150L
Dimensions (mm) L=1200;  W=920;  H=1690

Vacuum chamber 

dimensions (mm)

L=403; W=400;H=403 L=450; W=400;H=450 L=470; W=460;H=470 L=500; W=600;H=500

Vacuum chamber 

material

Stainless steel

Electrode plate 

dimensions (mm)

319(L)×374(W) 320(L)×420(W) 380(L)×440(W) 520(L)×470(W)

Electrode plate 

material

Special aluminum electrode
Weight(kg) 560 580 630 680
Control PLC+ Touch screen

Electrode plate 

structure

Horizontal 8 layers
Vacuum pump system Two-stage rotary plate vacuum pump/ Roots vaccum pump

Vacuum 

measurement 

system

Pilani resistance vacuum gauge

Gas measuring 

system

High precision mass flowmeter
Plasma generator High precision 0-500W plasma generator

High precision 

0-1000W

 plasma generator

Plasma matching unit High precision 0-500W automatic matching unit

High precision 

0-1000W

 automatic matching 

unit

Working vacuum 10-100 Pa

Limit pressure of 

vacuum pump

5×10-1 Pa

Time to achieve 

vacuum time(s)

≤ 55 ≤ 70 ≤ 80 ≤ 100

Time to release 

vacuum time(s)

≤ 15 ≤ 20 ≤ 25 ≤ 30

Gas control range

(sccm)

Mass flow 0-300 (optional)

Mass flow 

0-500  (optional)

Radio frequency 

power supply (w)

0-500

(Adjustable in range)

0-1000(Adjustable in range)

Mode of operation Manual, one key automatic operation
Power supply Three phase 380V
Rated power (kw)    4 
 
High Precision Plasma Cleaning Machine for Semiconductor Surfaces
High Precision Plasma Cleaning Machine for Semiconductor Surfaces
High Precision Plasma Cleaning Machine for Semiconductor Surfaces
Exhibition & Customers


High Precision Plasma Cleaning Machine for Semiconductor SurfacesHigh Precision Plasma Cleaning Machine for Semiconductor SurfacesJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

High Precision Plasma Cleaning Machine for Semiconductor Surfaces
 
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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