| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Warranty: | 12 Months |
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Laser IC Marking Equipment
Equipment features:
1. Support MES Mark module system
2. Mark Auto download
3. Automatic generation of printing information
4. Supports Mark 2D functionality
5. Automatically read Mapping to distinguish printing defects
6. Support LOT END printing clearance function
7. Support scanning to replace text
8. Automatic text alignment with fixed text width
| No. | Feature | Description |
|---|---|---|
| 1 | MES Mark Module System | Supports integration with Manufacturing Execution Systems (MES) for traceability. |
| 2 | Mark Auto Download | Automatically downloads marking data from connected systems. |
| 3 | Automatic Printing Info Generation | Dynamically generates printing content (e.g., serial numbers, dates) without manual input. |
| 4 | 2D Mark Functionality | Capable of printing high-precision 2D codes (e.g., QR, DataMatrix) for tracking. |
| 5 | Automatic Mapping & Defect Detection | Uses mapping technology to identify and flag printing defects (e.g., incomplete marks). |
| 6 | LOT END Printing Clearance | Automatically clears or finalizes marks at the end of a production batch. |
| 7 | Scan-to-Text Replacement | Allows scanning existing marks to update/replace text dynamically. |
| 8 | Auto Text Alignment & Fixed Width | Ensures consistent text alignment and uniform character spacing for readability. |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
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