| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Warranty: | 12 Months |
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The MPS-0806L laser cutting machine adopts configurations such as a precision linear motor platform and a Han's super customized system, greatly meeting the needs of customers.
Product features:
1. Use a stable movable gantry marble platform.
2. The entire machine adopts high-quality linear motors and high-resolution grating rulers, with high accuracy and processing efficiency.
3. Stable equipment, user-friendly operation interface, real-time feedback of processing status, ensuring the orderly progress of cutting and processing.
| Feature Category | Specific Feature | Description & Benefit |
| Structural Design | Stable Movable Gantry Marble Platform | Uses a marble base for exceptional stability and vibration damping, ensuring precision. The movable gantry design saves space and enhances rigidity. |
| Motion & Accuracy | High-Quality Linear Motors & High-Resolution Grating Rulers | Provides high-speed movement, exceptional accuracy, and high processing efficiency. The closed-loop system ensures precise positioning. |
| Operation & Control | User-Friendly Operation Interface | Makes the equipment easy to learn and use, reducing operator training time and potential for error. |
| Process Monitoring | Real-Time Feedback of Processing Status | Allows the operator to monitor the job progress continuously, ensuring orderly and reliable cutting processing. |
Product application:
Professional application for cutting various metal materials such as carbon steel plate, stainless steel plate, galvanized plate, electrolytic plate, aluminum alloy, brass, and copper.
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
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