High-Precision Laser Marking Machine for BGA and LGA Components

Product Details
Customization: Available
After-sales Service: Provided
Function: Abrasion Resistance, High Temperature Resistance, Anti-Corrosion
Gold Member Since 2023

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  • High-Precision Laser Marking Machine for BGA and LGA Components
  • High-Precision Laser Marking Machine for BGA and LGA Components
  • High-Precision Laser Marking Machine for BGA and LGA Components
  • High-Precision Laser Marking Machine for BGA and LGA Components
  • High-Precision Laser Marking Machine for BGA and LGA Components
  • High-Precision Laser Marking Machine for BGA and LGA Components
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
LMM-01
Demoulding
Pull Core
Condition
New
Certification
RoHS, ISO, CE
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Pneumatic
Mould Life
<300,000 Shots
Product Name
Automatic Substrate Laser Marking
Feature 1
High Precision
Feature 2
High Efficiency
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description


High-Precision Automatic BGA/LGA/SIP Substrate Laser Marking Machine
Product Description
High-Precision Laser Marking Machine for BGA and LGA Components
Product Features
  • Flexible configuration of fiber lasers, green lasers, UV lasers, etc.

  • High-precision digital scanning oscillator & Mechanical + CCD positioning to ensure marking accuracy.

  • Robotic automatic loading and unloading & Magazine material storage box & Dual-module bench marking.

  • With anti-reverse and QR code / character rating detection and other functions.

     

    Application
    Fully automatic laser marking of
    substrate products such as
    BGA/LGA/SIP
Technical specification  
Laser wavelength 1064nm/532nm/355nm
Laser power 10-30W
Positioning accuracy ±5μm
Marking depth 0.008-0.2mm adjustable
Min. character 0.18mm
Repeat Positioning Accuracy ±3μm
UPH ≥50 plates/hr
Max. loading volume at one time Standard material box 4 boxes, 80mm wide
Exhibition & Customers

High-Precision Laser Marking Machine for BGA and LGA ComponentsHigh-Precision Laser Marking Machine for BGA and LGA Components

Jiangsu Himalaya Semiconductor Co., Ltd. is your strategic partner in global semiconductor manufacturing. Since 2019, we have connected a network of over 200 clients and suppliers across 30+ countries, simplifying the complex global supply chain.

We empower our customers by securing the most cost-effective semiconductor equipment-from Advanced Laser Systems and Precision Assembly Tools to Automated Dicing Saws. Simultaneously, we provide suppliers with a reliable channel that ensures prompt payment and minimizes risk.

Dedicated to innovation and value, we deliver the advanced technology and integrated solutions that drive the semiconductor ecosystem forward.

 

High-Precision Laser Marking Machine for BGA and LGA Components
High-Precision Laser Marking Machine for BGA and LGA Components

 

Packaging & Shipping

 

High-Precision Laser Marking Machine for BGA and LGA Components
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:Why choose us?
A3:OEM/ODM/Designing service.

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