Advanced Double Valve Glue Dispensing Robot for PCB Applications

Product Description

High Quality Vertical Furnaces Target Semiconductor SMT Dispensing and Filling Machine

Product Description

 

Precision Desktop Dispensing Machine for Automated Production Lines

Our advanced desktop dispensing machine is engineered for seamless integration into modern production lines, offering unparalleled flexibility, reliability, and efficiency. Designed for a wide range of sealing, bonding, potting, and coating applications in electronics, semiconductors, and medical device manufacturing, this system combines a compact footprint with powerful, customizable performance.

Key Features & Benefits:

• Compact Desktop Design: Specifically designed to fit effortlessly into any production line or benchtop setup, saving valuable floor space while delivering industrial-grade performance.

• Unmatched Customization (DIY Mode): Enjoy complete creative freedom. The system supports free matching of motion axes (X, Y, Z) and dispensing heads, with a capacity for 1 to 12 heads simultaneously. Tailor the machine precisely to your application's requirements for maximum throughput and complexity.

• High-Rigidity Double Y-Axis: Features a multi-axis structure built from high-rigidity aluminum alloy. The innovative Double Y-axis design allows two workstations to operate alternately, dramatically increasing productivity by eliminating idle time during the manual loading and unloading of parts.

• Automated & Silent Lacquer Feeding: Integrated automatic liquid supply system ensures consistent material delivery, eliminates pot life issues, and maintains a quiet, safe operating environment for operators.

• International Ready: Choose a fully English-marked machine body and an optional software interface in English or Chinese, making it perfectly suited for a global workforce and international applications.

• Superior Reliability & Accuracy: Constructed with high-quality main components and a robust frame, the machine guarantees exceptional dispensing accuracy, repeatability, and long-term operational reliability.

• Comprehensive Support: A wide range of fixtures, tooling, and dispensers are available to handle virtually any material (from epoxies to silicones) and any component geometry.

 

 

Technical Specifications: HMLA Series Multi-Layer Curing Ovens

Feature	HMLA-300	HMLA-400	HMLA-600
Physical Dimensions
Equipment Size (L×D×H)	1800 × 1550 × 2200 mm	2000 × 1550 × 2200 mm	2200 × 1550 × 2200 mm
Equipment Weight	≈ 1500 kg	≈ 1600 kg	≈ 1800 kg
Max. Jig Dimension (L×D×H)	300 × 250 × 25 mm	400 × 350 × 25 mm	600 × 500 × 25 mm
Heating System
Number of Heating Zones	4 (2 top, 2 bottom)	4 (2 top, 2 bottom)	4 (2 top) *
Max. Curing Temperature	≤ 200°C	≤ 200°C	≤ 200°C
Heating-up Time	≈ 15-30 min	≈ 15-30 min	≈ 15-30 min
Control Accuracy	± 1.0°C	± 1.0°C	± 1.0°C
Zone Temperature Difference	± 2.0°C	± 2.0°C	± 2.0°C
Conveyor System
Deposit Board Level (Pitch)	25 mm	50 mm	75 mm
Number of Layers	64	32	16
Single-Layer Capacity	5 kg	5 kg	5 kg
Total Machine Capacity	250 kg	250 kg	250 kg
Transport Direction	Left to Right	Left to Right	Left to Right
Input/Output Height	900 ± 20 mm	900 ± 20 mm	900 ± 20 mm
Electrical & Utilities
Total Power	25 kW	30 kW	35 kW
Consumed Power	5 kW	6 kW	7 kW
Power Requirement	3P 380V/220V/480V 50/60Hz	3P 380V/220V/480V 50/60Hz	3P 380V/220V/480V 50/60Hz
Air Exhaust Requirement	5 m³/H	5 m³/H	5 m³/H
Control & Operation
Bake Time Range	8 - 10,000 min	8 - 10,000 min	8 - 10,000 min
Temperature Control	PID + High-Frequency Pulse	PID + High-Frequency Pulse	PID + High-Frequency Pulse
Parameter Storage	Multiple Recipes	Multiple Recipes	Multiple Recipes
Transport Motor	Servo / Stepper	Servo / Stepper	Servo / Stepper
Push Board Motor	Stepper	Stepper	Stepper
Safety & Build
Surface Temperature	≤ 50°C	≤ 50°C	≤ 50°C
Treatment with Support Edge	≥ 5 mm	≥ 5 mm	≥ 5 mm

 

Durable casting steel
Ultra-low noise, imported steel casting,high precision and wear resistance

Power Supply
Stable performance,Strong anti-interference performance,Excellent insulation performance,Long service life

ELATECH Timing Belt
Low noise /high strength/wear resistance / good elasticity /Built-in steel wire is durable, more accurate and stable.

SHINANO KENSHI
Stable performance, High precision, High torque, Low noise, High speed

Japan Omron Relay 
Safe and durable, realize the function of using onecontrol signal to control another or several signals
 

Glue Dispensing Process:

Specification

Our dispensing machine can do point, line, arc or other patterns per required.

Features:

Smart CCD Vision Alignment
Automated Pattern Recognition - Compensates for substrate misalignment
Real-Time Inspection - Detects missing glue or dispensing errors

Semiconductor-Grade Control System

Industrial PC + High-Speed Motion Control Card
User-Friendly Anda Software with drag-and-drop programming
Supports SECS/GEM Protocol for seamless integration into smart factories

Reliability & Cleanroom Compatibility
Vacuum Nozzle Cleaning System - Prevents clogging in precision applications
Anti-Static Design (ESD Protection) - Critical for semiconductor environments
Low-Particulate Construction - Suitable for ISO Class 5-8 cleanrooms

Optimized for Semiconductor Workflows
Working Area: X1/X2 (260mm), Y1/Y2 (260mm), Z (100mm) - Fits wafer trays & JEDEC carriers
Compact Footprint (1120×740×760mm) - Saves valuable cleanroom space
 

Applications

1. Solder Paste

• Use: PCB assembly (SMT, rework).
• Key: High precision (±0.01mm), jetting/time-pressure.

2. Hot Melt Glue

• Use: Fast bonding (electronics, automotive).
• Key: Heated nozzle (120-200°C), rapid curing.

3. Silicone Gel

• Use: LED encapsulation, sealing.
• Key: Bubble-free, high-viscosity pumps.

4. SMT Adhesives (Epoxy/UV)

• Use: Component fixation, underfill.
• Key: UV/thermal curing, micro-dosing.

5. Epoxy Resin

• Use: Structural bonding, potting.
• Key: Dual-cartridge mixing, vacuum degassing.

6. UV Adhesive

• Use: Optics, touch panels.
• Key: Instant cure (<5 sec), transparent bonds.

7. Coating Gel

• Use: Conformal coating, protection.
• Key: Robotic precision, adjustable thickness.

Exhibition & Customers

 

Packaging & Shipping

Our dispening machine is packed with wooden pack

Transported by sea, express or truck upon requests.

After Sales Service

Customer Commitment & After-Sales Support
1-Year Comprehensive Warranty

Coverage: Full protection against manufacturing defects (parts/labor included).
Extensions: Optional extended warranty plans available for critical applications.
24/7 Global Technical Support

Response: ≤1-hour emergency response via dedicated hotline/TeamViewer.
Languages: Multilingual engineers (English/Chinese/German/Japanese).
On-Site: Rapid dispatch for unresolved issues (72hrs max for Tier-1 regions).
Value-Added Services

 

Certifications

We are an ISO 9001-certified manufacturer and innovator specializing in semiconductor equipment, with 6 registered utility model patents (UM Patents) in China. Our patented technologies cover:
Semiconductor annealing systems
Cleaning equipment for semiconductor etching
UV debonding machines
And more .
Backed by ISO 9001 quality management, we ensure high precision, reliability, and efficiency in semiconductor manufacturing processes. Our R&D-driven solutions enhance production yield and cost-effectiveness for global clients in IC packaging, MEMS, and advanced wafer processing.

Partner with us for cutting-edge, patent-protected semiconductor equipment tailored to your needs.

 

FAQ

Q1: How to choose a suitable machine?
A1: You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2: What is the warranty period for the equipment?
A2: One year warranty and 24 hours online professional technical support.

Q3: How to choose a suitable machine?
A3: You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.