| Customization: | Available |
|---|---|
| After-sales Service: | Online Service |
| Condition: | New |
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| Technical Specifications: SHD8120 Die Bonder | |
| Parameter Category | Specification Details |
| Model | SHD8120 |
| Loading Method | Wafer stacking and tray |
| Bonding Method | Epoxy |
| Bonding Precision | X/Y ≤ ±25µm, θ < ±3° |
| Max. Bonding Speed (UPH) | 17,000 (varies with chip size & density) |
| Compatible Wafer Size | 12 inches (compatible with 8 inches) |
| Wafer / Wire Head Rotation | 0° - 360° |
| Bonding Force Range | 30 - 500g |
| Process Features | MAP diagram, Double Dispensing, Painting, Optional DAF |
| Chip Size Range | 0.3mm x 0.3mm ~ 4mm x 4mm, Thickness > 75µm |
| Substrate Size (L x W x T) | 100-300mm x 20-100mm x 0.1-1mm |
| Vision System | 256-level grayscale |
| Camera Resolution | 640 × 480 pixels |
| Recognition Accuracy | 0.25 mil |
| Equipment Dimensions (mm) | 1800 (L) x 1490 (W) x 1500 (H) |
| Equipment Weight (kg) | 1800 |
Jiangsu Himalaya Semiconductor Co., Ltd. was established in 2019 and is a rapidly growing company specializing in the international trade and integration of advanced semiconductor industry equipment. With a global vision and strong market presence, the company serves as a trusted bridge between global equipment manufacturers and semiconductor producers, offering cost-effective, high-performance solutions tailored to customer needs.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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