Jiangsu Himalaya Semiconductor Co., Ltd. is a premier semiconductor equipment manufacturer and global exporter established in 2019. We specialize in providing high-performance, cost-effective semiconductor manufacturing solutions to clients worldwide, with a strong presence in 30+ countries and a network of 200+ satisfied customers and suppliers.
We design and manufacture advanced semiconductor production equipment, including:
Die Bonders – High-precision chip attachment for IC packaging
Wire Bonders – Reliable interconnects for semiconductor devices
Laser Processing Machines – Wafer marking, grooving, cutting (Si, SiC, glass, ceramics)
Wafer Dicing Saws – Precision cutting for MEMS, optoelectronics, and advanced packaging
Laser Annealing Systems – For Si/SiC wafers
Automatic Dispensing Equipment – High-accuracy silicone & epoxy application
Audited Supplier 
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