High Precision Laser Cutting Equipment with Custom Laser Head

• Customization: Available
• After-sales Service: Free Training
• Function: High Temperature Resistance
• Model NO.: LGCE-01
• Demoulding: Automatic
• Condition: New
• Certification: RoHS, ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Product Name: Laser Grooving Cutting Equipment
• Feature 1: High Precision
• Feature 2: High Efficiency
• OEM/ODM Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

High Precision Laser Grooving Cutting Equipment  with Special Customized Laser Head
 

Product Description

Equipment Advantage

Equipped with high precision linear motor and high speed X-Y motion platform.

Equipped with special customized laser head, which ensures high cutting quality and low heat influence.

The software is easy to operate and the equipment is convenient to maintain.

The cutting mode can be freely combined by narrow beam and wide beam, equipped with a single focus lens cutting system which can improve the processing stability.

Basic Parameters

• 1. Applicable Products:Low-K, CMOS, etc
• 2. Applicable wafer size:200mm-300mm
• 3. Laser head:UV nanosecond or short pulse custom laser head
• 4. Cutting depth:≥10μm
• 5. Cutting speed:0-1000mm/s
• 6. Processing method:full-automatic
• 7. Cutting width: 30~90μm
• 8. Equipped with backlight chuck table which has better edge alignment
   

Specification

Advanced Wafer Dicing System - Technical Overview
Category	Specifications & Description
Product Name	Advanced Wafer Dicing System
Applicable Products	Low-K, CMOS, and other advanced semiconductor wafers
Key Specifications	Wafer Size: 200mm - 300mm
	Laser Head: UV Nanosecond / Custom Short Pulse
	Cutting Depth: ≥ 10μm
	Cutting Width: 30 - 90μm
	Cutting Speed: 0 - 1000 mm/s
	Processing Mode: Full-Automatic
Core Equipment Advantages	Precision Motion System: High-precision linear motor and high-speed X-Y motion platform for superior accuracy.
	Advanced Laser Head: Specially customized laser head ensures high cutting quality with minimal heat impact.
	Dual-Beam Cutting: Cutting mode can be freely combined with narrow and wide beams for flexibility.
	Single Focus Lens System: Enhances processing stability and consistency.
Operational & Design Benefits	User-Friendly: Easy-to-operate software and convenient maintenance design.
	Enhanced Alignment: Equipped with a backlight chuck table for better edge alignment accuracy.

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.