High Speed Fully Automatic Gold/Copper/Aluminum Wire Bonder

• Customization: Available
• After-sales Service: 1 Year
• Function: Anti-Corrosion
• Model NO.: H580PLUS
• Demoulding: Wire Bonding
• Condition: New
• Certification: CCC, PSE, FDA, RoHS, ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Max Bonding Area: X: 56mm, Y: 80mm
• Positioning Accuracy: ±3μm (@3
• Bonding Cycle Time: 45ms/Wire
• Wire Diameter Range: Dia 15 to 50 Micron
• Drive System: Linear Motor (Direct Drive)
• Repeatability: ±3μm (@3σ)
• Magazine Compatibility: L: 100 to 275mm, W: 30 to 90mm, H: 180mm
• Dimensions (W×D×H): 985mm × 960mm × 1770mm
• Transport Package: International Trade Standard
• Specification: 985mm*960mm*1770mm
• Trademark: Himalaya
• Origin: China
• HS Code: 8486402200
• Production Capacity: 100

Product Description

Product Description

 

High-Speed Fully Automatic Gold/Copper Wire Bonder - Technical Description

 

The High-Speed Fully Automatic Gold/Copper Wire Bonder represents the pinnacle of advanced wire bonding technology, designed for superior speed, precision, and reliability in semiconductor packaging. Engineered with cutting-edge servo systems, intelligent force calibration, and next-generation optical components, this system sets new benchmarks in ultra-fine wire bonding for IC, optoelectronic, and advanced microelectronic applications.

This next-generation wire bonder combines ultra-high speed, sub-micron precision, and intelligent process control to meet the demands of advanced semiconductor manufacturing. With its modular design, self-calibration, and material flexibility, it is the ideal solution for high-mix, high-volume production.

 

Wire Bonder Key Specifications

 

Max Bonding Area	X: 56mm, Y: 80mm
Positioning Accuracy	±3μm (@3σ)
Bonding Cycle Time	45ms/wire
Wire Diameter Range	Φ15-50μm (Au/Cu/Al compatible)
Drive System	Linear Motor (Direct Drive)
Repeatability	±3μm (@3σ)
Magazine Compatibility	L: 100-275mm, W: 30-90mm, H: 65-180mm
Material Handling	Vertical Stacked (2-3 magazines)
Post-Bond Inspection	High-Precision PBI
Dimensions (W×D×H)	985mm × 960mm × 1770mm
Weight	≈660kg
Feature	Specification

 

 

Specification

Key Features & Innovations

1. Enhanced Motion & Precision

• New Servo System: Delivers faster response, higher positioning accuracy (±3μm @3σ), and improved UPH (Units Per Hour).
• Linear Motor-Driven XY Table:
  • Maximum Bonding Area: X: 56mm, Y: 80mm
  • Repeatability & Accuracy: ±3μm (3σ)
  • Bonding Cycle: 45ms/wire (ultra-high throughput)

2. Advanced Optical & Imaging System

• New High-Performance Zoom Lens:
  • Wider field of view with crisp, distortion-free imaging.
  • Improved structural stiffness for vibration-free operation.
• High-Precision Post-Bond Inspection (PBI): Ensures defect-free interconnections.

3. Intelligent Bonding Force Control

• Stable & Adaptive Force Feedback: Prevents wire breakage & pad damage.
• Smart Calibration System:
  • Automatic prompts for real-time force recalibration.
  • Fast, accurate, and easy calibration process.

4. Superior Arc Control for Complex Applications

• New Wire Arc Algorithm: Optimized for multiple materials (Au, Cu, Al), ensuring consistent loop shapes even in high-density ICs (BGA, QFP, COB, etc.).

5. Proprietary Core Technologies

• Fully Independent IP (Intellectual Property):
  • Drive system, optics, and control algorithms engineered in-house, ensuring industry-leading performance & reliability.

 

Material Handling & Workflow Efficiency

1. Automated Loading/Unloading

• Vertical Stacked Material Handling:
  • Input/Output Mechanism: 2-3 magazines (buffered)
  • Magazine Compatibility:
    • Length: 100-275mm
    • Width: 30-90mm
    • Height: 65-180mm
    • Pitch Adjustment: 1.5-10mm

2. Fast & Reliable Production

• Soldering Cycle: 45ms/line
• Wire Diameter Range: Φ15-50μm

 

Applications

 

Designed for high-volume production of advanced IC packages, including:
TO, SOT, SOP, SSOP, TSSOP
QFP, DIP, BGA, COB, Optocouplers
Fine-pitch & high-power devices

 

Physical Specifications

• Dimensions (W×D×H): 985mm × 960mm × 1770mm
• Weight: ≈660kg
• Power Supply: Optimized for industrial environments

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.