Advanced Grinding Machine for Hard and Brittle Materials

• Customization: Available
• Drive Motor: 5.5kw
• Spindle: Tsav 100
• Model NO.: R400CV
• Spindle Speed: 0-3200 Rpm
• CBN/Diamond: 300mm
• Grinding Wheel: 250mm Diameter
• Axial Run-out: Less Than 2 Micro Meter
• Vacuum Clamping Units: 50-450mm
• Weight: 1850kg
• Size: 1360*1030*1970mm
• Transport Package: Wooden Box
• Specification: 1360*1030*1970mm
• Trademark: HMLY
• Origin: Germany
• HS Code: 9031410000
• Production Capacity: 300

Product Description

Advantages

(1) R400 series of machines have been designed to take advantage of state-of-the-art grinding technologies and ergonomics.

(2) The fully encapsulated grinding area offers optimum environmental conditions for the operator and reduces risks of contamination.

(3) This concept has been developed and refined for maximum precision when grinding metals, silicon and other semiconductor materials in small batch production, research and development.
(4) Grinding of non-metallic workpieces
(5) Vacuum clamping technology
(6) High-precision frequency-controlled rotary table – concave, convex or parallel adjustable
(7) Workpiece-dependent special clamping techniques possible
(8) Closed grinding chamber
(9) New user-friendly menu navigation via touch panel
(10) Pre-installed grinding programme

Specification

drive motor	5.5kW
spindle	TSAV 100
spindle speed	0-3200 rpm
grinding height from top edge of rotary table top to position of the grinding wheel
CBN/diamond	max. 300 mm
grinding wheel	diameter: 250mm
rotary  table speed	diameter: 270mm
axial run-out	less than 2μm
vacuum clamping units	50-450mm
fine infeed smallest step	1μm
weight	1850kg
space requirement	1360*1030*1970

Packing & Delivery

Fumigated wooden box with soft polyester materials protection to make sure the safty of the goods.

Shipped by sea/land/flight professional carrier all over the globe.

Company Profile

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in exporting business and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!

We manufacture equipments for Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting(Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si /Sic Wafe, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine(Wafer Packaging)), Automatic Silicone Dispensing Equipment.

As well as we provide some solutions for handling exhausted metal sorter equipments, customized coating and plating machine, TGV & manual/semiautomatic/automatic equipments, so on.