Premium Precision Silicone Glue Dispenser for Crafting Projects

• Customization: Available
• After-sales Service: Provided
• Precision: High Precision
• Model NO.: DK-02
• Condition: New
• Certification: RoHS, ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Desktop
• Driven Type: Electric
• Product Name: Dispensing Machine
• Feature 1: High Precision
• Feature 2: High Efficiency
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 100

Product Description

Automatic Silicone Glue Dispensing Equipment Desktop Dispenser 

Product Description

TSV-200D Desktop Vision Glue Dispensing Machine - Product Description

Precision. Efficiency. Intelligence.
 

The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor Co., Ltd. is a high-precision, automated dispensing solution designed for industries requiring micron-level accuracy in adhesive application. Equipped with CCD visual positioning, multi-axis servo control, and intelligent programming, this machine ensures flawless dispensing for semiconductor packaging, advanced PCB assembly, MEMS devices, and high-precision electronics manufacturing.

 

Specifications	TSV-200D	HSV-200D
Dimension (mm)	L1120×W740×H760	L1200×W740×H146
Weight (kg)	100	130
Control	Industrial personal computer + motion control card
Software	Anda control software + windows system
Programming	Visual programming
Number of spindles	X,Y1,Y2,Z
Spindle drive	Servo motor + module
Working area (mm)	X1 X2: 260;  Y1 Y2: 260;  Z: 100
Quantity of rubber valve	1 (standard configuration)
Max. Moving speed (mm/s)	800
Repeatability (mm)	± 0.025
Coating capacity (cc)	30
Valve nozzle cleaning device	Vacuum cleaning
Equipment alarm	Menu + sound and light alarm
Coating inspection	Automatic detection
Power supply	220V 50/60Hz
Required air pressure (Mpa)	≥ 0.65
Safety standards	CE
Rated power (kw)	1.3		1.5
Standard function	CCD visual positioning Electrostatic interface 232 scanner socket

 

Applications

Key Applications in Semiconductor & Advanced Electronics

Flip-Chip Underfill Dispensing
Die Attach Adhesive Application
Wafer-Level Packaging (WLP) Encapsulation
Advanced PCB Assembly (SiP, Fan-Out)
MEMS & Sensor Packaging
 

 

Engineered for high-mix, low-volume semiconductor production as well as high-volume manufacturing, the TSV-200D delivers consistent, repeatable dispensing with near-zero waste.

Key Features

Key Features & Advantages

Ultra-Precise Dispensing for Semiconductor Applications

• Repeatability: ±0.025mm (ideal for micro-dots, underfill, and die-attach adhesives)
• Max Speed: 800mm/s (optimized for high-throughput production)
• Multi-Axis Servo Control (X, Y1, Y2, Z) - Ensures smooth motion for complex dispensing paths

Smart CCD Vision Alignment

• Automated Pattern Recognition - Compensates for substrate misalignment
• Real-Time Inspection - Detects missing glue or dispensing errors

Semiconductor-Grade Control System

• Industrial PC + High-Speed Motion Control Card
• User-Friendly Anda Software with drag-and-drop programming
• Supports SECS/GEM Protocol for seamless integration into smart factories

Reliability & Cleanroom Compatibility

• Vacuum Nozzle Cleaning System - Prevents clogging in precision applications
• Anti-Static Design (ESD Protection) - Critical for semiconductor environments
• Low-Particulate Construction - Suitable for ISO Class 5-8 cleanrooms

Optimized for Semiconductor Workflows

• Working Area: X1/X2 (260mm), Y1/Y2 (260mm), Z (100mm) - Fits wafer trays & JEDEC carriers
• Compact Footprint (1120×740×760mm) - Saves valuable cleanroom space

 

Certifications

We are an ISO 9001-certified manufacturer and innovator specializing in semiconductor equipment, with 6 registered utility model patents (UM Patents) in China. Our patented technologies cover:
Semiconductor annealing systems
Cleaning equipment for semiconductor etching
UV debonding machines
And more .
Backed by ISO 9001 quality management, we ensure high precision, reliability, and efficiency in semiconductor manufacturing processes. Our R&D-driven solutions enhance production yield and cost-effectiveness for global clients in IC packaging, MEMS, and advanced wafer processing.

Partner with us for cutting-edge, patent-protected semiconductor equipment tailored to your needs.

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.