| Customization: | Available |
|---|---|
| After-sales Service: | 1 Year |
| Warranty: | 1 Year |
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| Processing Area and Working Range | |
| Flat Plate Processing Area (Length × Width) | 6000mm × 2500mm |
| X-axis Stroke | 6050mm |
| Y-axis Stroke | 2520mm |
| Z-axis Stroke | ≥300mm |
| Precision | |
| X,Y-axis Positioning Accuracy | ±0.03mm/m (Full Length 0.08mm) |
| X,Y-axis Repeat Positioning Accuracy | ±0.02mm |
| Speed | |
| Maximum Linked Positioning Speed of X/Y-axis | 140m/min |
| Maximum Acceleration of X/Y-axis | 2.0G |
| Power Parameters | |
| Phase Number | 3 |
| Rated Power Voltage | 380V |
| Frequency | 50Hz |
| Total Power Protection Class | IP54 |
| Load and Dimensions | |
| Maximum Load of Worktable | 4800kg/unit |
| Overall Dimensions (Length × Width × Height) | 15500mm × 4200mm × 2500mm (Subject to actual product) |
| Equipment Operation Environment | |
| Temperature Requirement | The machine tool can be placed in an environment of 0~40°C (if the ambient temperature of the machine tool's site is outside this range, special instructions are required); the laser is recommended to be placed in an environment of 18~25°C with air conditioning installed. |
| Humidity Requirement | ≤70% (for laser only) |
| Gas Requirements | |
| Machine Tool Auxiliary Compressed Air (Non-high-pressure Air Cutting) | Air Supply Capacity: 0.63m³/min; Air Supply Pressure: 0.45-0.8MPa; Dew Point Temperature: Not Higher than 5°C; Oil and Dust Content: 0.003ppm, Treatment Precision: 0.01μm |
| Cutting Gas Purity | Nitrogen: ≥99.7% (General Nitrogen or Liquid Nitrogen); General Oxygen: ≥99.5%, Pure Oxygen: ≥99.95%, High-purity Oxygen: ≥99.999% |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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