Advanced Workflow Lamination and Encapsulation System for Efficiency

• Customization: Available
• Feature 1: High Precision
• Feature 2: High Efficiency
• Model NO.: HM-005
• Tact Time: ≤30s/Module
• Material Changeover: ≤3min
• Positioning Accuracy: Start/End Points: <1mm; Path Straightness: <0.8mm
• Overlap Accuracy: ≤0.2mm (Dual-Camera Vision + Ai Correction)
• Equipment Dimensions: 9200×2000×2000mm
• Thermo-Compression: 100°C/0.5MPa
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Features
•Complete the processes of short-side butyl adhesive, short side insulating adhesive, short-side busbar tape, long-side conductive adhesive tape, four-side butyl adhesive tape film covering, and laminating before component lamination
•Suitable module types: Perovskite single - junction, 2T and 4T tandem modules.
•Product specification: <400mm*400mm
•Junction box position: Edge extraction

Performance

ltem	Value
Tact time	≤30s
Material change	≤3min
Positioning accuracy	starting & ending point<1mm; straightness: <0.8mm
Alignment and overlapping difference accuracy	≤0.2mm

Parameter

Item	Value
Dimension	9200mm*2000mm*2000mm

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.

 

Company Profile

Jiangsu Himalaya Semiconductor Co., Ltd. is a premier semiconductor equipment manufacturer and global exporter established in 2019. We specialize in providing high-performance, cost-effective semiconductor manufacturing solutions to clients worldwide, with a strong presence in 30+ countries and a network of 200+ satisfied customers and suppliers.