Advanced Zdp-8 Laminating System for Professional Quality Finishing

• Customization: Available
• After-sales Service: Provided
• Warranty: 12 Months
• Model NO.: Zdp-8
• Product Name: Automatic Laminating Machine
• Function: for Ltcc Multi-Layer Substrate
• Certification: ISO
• Condition: New
• Feature 1: High Precision
• Feature 2: High Efficiency
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Zdp-8 Automatic Laminating Machine with The Inter-Layer Precision Alignment

Product Description

  

ZDP-8 automatic laminating machine is one of

the key equipment in the LTCC multi-layer substrate

manufacturing line, mainly used to complete the

stack of raw ceramics. The monolithic raw ceramics

are loaded for the realization of welded multilayer raw

ceramics with the inter-layer precision alignment.

 

Key Features

Key Feature:
It performs inter-layer precision alignment during the stacking process. This is critical for ensuring that the electrical connections (vias) and circuits on each layer line up perfectly before the layers are permanently bonded together under heat and pressure.

Function:
The ZDP-8 automatic laminating machine is a key piece of equipment used to create multilayer LTCC substrates. Its primary role is to precisely stack and laminate individual layers of raw, unfired ceramic material (called "green tape").
 

ZDP-8 Automatic Laminating Machine Specification
Feature	Description
Equipment Name	ZDP-8 Automatic Laminating Machine
Primary Application	LTCC (Low-Temperature Co-fired Ceramic) Multi-layer Substrate Manufacturing Line
Main Function	To stack and laminate multiple layers of monolithic raw ceramic sheets ("green tape") into a unified multilayer structure.
Key Capability	Performs inter-layer precision alignment during the stacking process.
End Result	Produces a welded multilayer raw ceramic block, ready for the firing (co-firing) process.
Overall Role	A key piece of equipment for creating complex, high-density electronic substrates.

Application

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.