Advanced Semiconductor Wafer Grinding System for Precision Tasks
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Product Highlights
- Full-Automatic Operation: Equipped with wafer level handling robot and fool-proofing system for efficient processing.
- Stable Vacuum System: Features water ring vacuum pump ensuring stable vacuum and minimal vibration.
- Customized Chuck Table: Ultra-precision chuck table base adaptable to different hardness of wafer materials.
- Visual Management System: Integrated visual system for real-time monitoring of the grinding process.
- Flexible Customization: OEM/ODM services provided with customized features according to specific needs.
- Long Mould Life: Designed for durability with a mould life exceeding 1,000,000 shots.
Product Attributes
- Customization
- Available
- After-sales Service
- Online Service
- Function
- High Temperature Resistance
- Model NO.
- HM-0260
- Demoulding
- Automatic
- Condition
- Used
- Certification
- ISO
- Warranty
- 12 Months
- Automatic Grade
- Automatic
- Installation
- Desktop
- Driven Type
- Electric
- Mould Life
- >1,000,000 Shots
- Product Name
- Wafer Back Grinding Equipment
- Feature 1
- Guaranteed Quality
- Feature 2
- Customized According to Needs
- OEM/ODM Service
- Provided
- Transport Package
- Customized or Wooden Box Packaging
- Specification
- Standard Specifications
- Trademark
- Himalaya
- Origin
- China
Product Images of Advanced Semiconductor Wafer Grinding System for Precision Tasks
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Advanced Semiconductor Wafer Grinding System for Precision Tasks -
Advanced Semiconductor Wafer Grinding System for Precision Tasks -
Advanced Semiconductor Wafer Grinding System for Precision Tasks -
Advanced Semiconductor Wafer Grinding System for Precision Tasks -
Advanced Semiconductor Wafer Grinding System for Precision Tasks -
Advanced Semiconductor Wafer Grinding System for Precision Tasks -
Advanced Semiconductor Wafer Grinding System for Precision Tasks
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Product Description
High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating
Equipped with material information scanning and input system
Equipped wtith wafer level handling robot
Equipped with Fool-proofing system to identify the positive and negative side of the wafer
Equipped with water ring vacuum pump to ensure the stable vacuum and the small vibration
Equipped With a visual management system for the grinding process
Equipped with customized ultra-precision chuck table base,excellent performance, small vibration, that can adapt to different hardness of wafer materials
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1. Applicable Products:Si wafer,glass,metal plating
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2. Processing method:full-automatic
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3. Applicable wafer size: 100mm-200mm
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4. Final product thickness:80μm
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5. Grinding speed:0.1μm-50mm/s
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6. Z-axis minimum stroke:120mm
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7. Applicable material thickness:≤1800μm
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8. TTV:≤2.5μm,WTW≤2.5μm,Ra≤0.02μm
| Parameter | Specification |
|---|---|
| Applicable Products | Si wafer, glass, metal plating |
| Processing Method | Full-automatic |
| Applicable Wafer Size | 100 mm - 200 mm |
| Final Product Thickness | ≥ 80 μm |
| Grinding Speed | 0.1 μm/s - 50 mm/s |
| Z-Axis Minimum Stroke | 120 mm |
| Applicable Material Thickness (input) | ≤ 1800 μm |
| TTV (Total Thickness Variation) | ≤ 2.5 μm |
| WTW (Within-Wafer Thickness Variation) | ≤ 2.5 μm |
| Ra (Surface Roughness) | ≤ 0.02 μm |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM Designing.
About the Supplier
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Company Profile
Empowering Global Semiconductor Excellence: An Introduction to Jiangsu Himalaya Semiconductor Co., Ltd.
In the rapidly evolving landscape of global electronics, precision and reliability are the cornerstones of success. Since its establishment in 2019, Jiangsu Himalaya Semiconductor Co., Ltd. Has emerged as a pivotal force in the semiconductor industry, specializing in the high-level integration and international trade of advanced manufacturing equipment.
With a footprint extending to over 30 countries and a robust network of more than 200 global customers and suppliers, we serve as the critical link in the semiconductor supply chain. Our mission is clear: To secure the most cost-effective, high-performance solutions for our clients while ensuring seamless, risk-free transactions for our partners.
Comprehensive Equipment Solutions for Semiconductor Manufacturing
We take pride in our diverse portfolio of high-precision machinery designed to meet the rigorous demands of modern wafer processing and packaging.
1. Advanced Bonding & Marking
Precision at the microscopic level is essential for chip integrity. Our core lineup includes:
Die Bonders: Ensuring high-speed, accurate placement of chips.
Wire Bonding: Providing reliable electrical interconnections with industry-leading stability.
Laser Marking: Specialized ID marking for IC wafers to ensure full traceability throughout the lifecycle.
2. Cutting-Edge Laser Processing
As wafers become thinner and materials more complex, our laser solutions provide the necessary finesse without compromising structural integrity:
Laser Grooving & Cutting: Expertly designed for glass, ceramics, and wafer packaging.
Internal Modification Machines: Specialized laser technology for Si/SiC (Silicon Carbide) and LT/LN (Lithium Tantalate/Lithium Niobate) wafers.
Laser Annealing: Optimized for Si/SiC substrates to enhance electrical properties and repair lattice damage.
3. Dicing & Dispensing
Automatic Dicing Saw Machines: High-efficiency dicing for wafer packaging applications.
Automatic Silicone Dispensing Equipment: Precision fluid control for protective coating and encapsulation.
Customized Industrial Solutions
Beyond standard machinery, Jiangsu Himalaya Semiconductor provides specialized engineering solutions tailored to unique factory requirements:
TGV (Through Glass Via) Technology: Offering manual, semi-automatic, and fully automatic equipment for next-generation 3D packaging.
Coating & Plating: Customized machines designed for specific surface treatment and metal deposition needs.
Environmental & Resource Management: Efficient solutions for handling exhausted metal sorter equipment, promoting sustainable manufacturing practices.
Why Partner with Jiangsu Himalaya Semiconductor?
In a market defined by volatility, we offer stability and strategic advantage. We understand that for our customers, the "final stage" of procurement is the most critical. We utilize our deep industry expertise to filter through global options, delivering products that balance cost with cutting-edge performance.
For our suppliers, we are a partner of trust. We strive for one-time payment collection and comprehensive risk avoidance, allowing manufacturers to focus on innovation while we handle the complexities of global distribution.
Contact Us Today
Whether you are scaling your production line or seeking a reliable global export partner, Jiangsu Himalaya Semiconductor Co., Ltd. is ready to elevate your operations.
Explore the peak of semiconductor technology with Himalaya.
About Our Factory & Business Background
- Address
- Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
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Registered Capital
- 100,000,000 RMB
-
Terms of Payment
- LC, T/T, PayPal, Western Union
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International Commercial Terms(Incoterms)
- FOB, CIF, CFR, EXW
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Average Lead Time
-
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months -
Nearest Port
- Shenzhen Port
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Minimum Order Quantity
- 1 Set
-
Supply Chain Partners
- 30
Our Production Capability & Technical Expertise
-
Main Products
- Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
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Inspection Type for Finished Products
- 100% inspection(Visual inspection & Function inspection)
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Inspection Method for Finished Products
- Finished product checked by packing staff
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Customization Options
- Flexible customization
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ODM Service Available
- Yes
-
OEM Service Available
- Yes
-
Traceability of Raw Materials
- No
Our Industry Experience & Global Business Record
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Year of Establishment
- 2019-09-12
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Export Year
- 5 Years
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Main Markets
- Europe
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Repeat Buyers Choice
- 80%~100%
FAQ
- How to choose a suitable machine?
- You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
- What is the warranty period for the equipment?
- One year warranty and 24 hours online professional technical support.
- Why choose us?
- OEM/ODM Designing.
- What is the minimum order quantity?
- The minimum order quantity is 1 Set.
- What are the payment terms?
- We accept LC, T/T, PayPal, and Western Union.
- What is the lead time for production?
- Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.
- What is the applicable wafer size range?
- The machine supports wafer sizes from 100mm to 200mm.
- Does the machine support customization?
- Yes, we offer flexible customization and OEM/ODM services.
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