1900 Series Precision and Stability Lithography Equipment for Advanced Semiconductor Production
| Customization: | Available |
|---|---|
| After-sales Service: | 7*24 Hoiurs |
| Function: | Abrasion Resistance, High Temperature Resistance |
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Basic Info.
- Model NO.
- LHM-1102
- Demoulding
- Automatic
- Condition
- New
- Certification
- ISO, CE
- Warranty
- 12 Months
- Automatic Grade
- Automatic
- Installation
- Vertical
- Driven Type
- Electric
- Mould Life
- 300,000-1,000,000 Shots
- Light Source Intensity
- ≥ 1800
- Dose Accuracy/Repeatability
- Spec Value
- Imaging Quality (Spherical/Coma/Astigmat
- ≤ 0.2nm
- Chuck Variation
- Within Tolerance
- Lot Uniformity
- Stable
- Scanner Interface
- Intuitive Human-Machine Interaction
- Track Interface
- Transparent Process Flow Management
- Transport Package
- Wooden Pack with Sea-Freight
- Specification
- customized
- Trademark
- Himalaya
- Origin
- Imported
- Production Capacity
- 100
Product Description
1900 Series Advanced Lithography Equipment - Overview
The 1900 Series is a high-end lithography system designed for advanced semiconductor process production. It is currently installed and in a "warm-up" state at a domestic wafer fabrication plant (FAB), ready for operation.
System Overview & Appearance
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Application: Advanced semiconductor chip manufacturing.
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Key Features: High precision and exceptional stability.
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Current Status: Installed and operational at a domestic semiconductor fab.
Control System & User Interface
The system adopts the industry-standard Scanner + Track configuration:
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Scanner Interface: Intuitive human-machine interaction.
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Track Interface: Transparent process flow management supporting stable high-volume production.
Peripheral Equipment & Support Systems
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Complete Configuration: Includes wafer load/unload modules, liquid cooling and gas handling units, and online monitoring and control modules.
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Rack System: Fully configured with coat/develop track systems, all modules functional.
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Monitoring Data: Key parameters such as THK (thickness) and PA (process capability) show normal results, meeting all advanced process requirements.
Lithography Performance Results
Key performance parameters meet or exceed specifications, demonstrating exceptional capability:
| Key Parameter | Specification | Actual Performance |
| Light Source Intensity | ≥ 1800 | 2046 |
| Dose Accuracy/Repeatability | Spec value | Better than spec |
| Imaging Quality (Spherical/Coma/Astigmatism) | ≤ 0.2nm | Meets requirement |
| Chuck Variation | Within tolerance | All within tolerance |
| Lot Uniformity | Stable | Stable, meets mass production requirements |
Key Advantages
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High-Performance Imaging: All critical imaging metrics exceed specification requirements.
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Excellent Lot Uniformity: Ensures consistent performance across high-volume production.
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Mature Integrated Process: Proven Track + Scanner solution.
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Production-Ready: Directly supports advanced process mass production without additional modifications.
Frequently Asked Questions: 1900 Series Advanced Lithography Equipment
Q1: What is the primary application for the 1900 Series lithography system?
A: The 1900 Series is designed for advanced semiconductor process production, enabling the manufacturing of high-performance, next-generation chips. It is production-line ready for the most demanding lithography steps.
Q2: How does the 1900 Series ensure consistent, high-quality output in a high-volume manufacturing (HVM) environment?
A: Consistency is guaranteed through several key features:
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Superior Stability: The system demonstrates exceptional lot-to-lot uniformity, which is critical for high yields in mass production.
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Performance Beyond Spec: Key parameters like dose accuracy and light source intensity consistently meet or exceed specifications, ensuring reliable performance day after day.
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Mature Integration: The seamless integration of the Scanner and Track creates a stable and predictable process flow.
Q3: What are the key imaging performance metrics, and how do they benefit our process?
A: The system delivers exceptional imaging quality critical for advanced nodes:
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High-Resolution Patterning: Capable of extremely fine line widths.
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Minimal Aberrations: Imaging aberrations (sphere, coma, astigmatism) are controlled to ≤ 0.2nm, leading to sharper, more accurate patterns and better device performance.
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Precision Over Entire Field: Chuck-to-chuck variation is minimal and stays within strict tolerances.
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