China High Speed Automatic Glue Dispenser Machine for LED Lens

• Customization: Available
• After-sales Service: 7*24 Hours
• Precision: High Precision
• Model NO.: WQ-01
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Product Name: Dispensing Machine
• Overall Dimension (L×W×H): 1220 mm × 1700 mm × 1600mm
• Repeatability: +/- 0.025 mm
• Maximum Moving Speed: 1000 mm/S
• Maximum Acceleration: 0.8 G
• Vision: CCD Visual Positioning
• Automation & Handling: Dual Conveyors
• Measurement & Inspection: Barcode Scanner
• Process Enhancement: Booster Pump and Dual-Valve Dispensing
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 100

Product Description

Product Description

 

 

Standard Features 

1. Computer control with Windows OS

2. CCD visual positioning system

3. Servo motor with ball screw

4. Inline CCD visual programming or gerber upload

5. UPS and voltage stabilizer

6. ESD grounding point

7. CE certified

 

Optional Features 

1. Heated valves for viscosity control

2. 35 degree tilt and 360 degree rotation

3. PCB heater enhances material flow for underfill applications

4. Precision weight measurement ensures accurate volumetric dispensing

5. Multiple valves available: Pneumatic jet valve, Slide valve and Screw valve

6. Laser height detection to calibrate Z axis automatically for component deformation

Advantage

 

 

1.Cost-effective with high-performance.

2.Non-contact injection valve to achieve a smaller dispensing diameter and a wider application field.

3.The injection valve improves the reliability and consistency of dispensing, also increases productivity and material utilization

4.The minimum overflow width of Underfill is only 0.2mm (related to configuration and glue)

5.Recognize the chip body, which is more accurate than Mark point recognition and positioning

6.Identity recognition, automatic program call, foolproof, data statistics and other functions to realize intelligent manufacturing
 

 

Specification

 

Specifications	iJet-7L Dispensing Machine
Dimension(mm)	L1220×W1700×H1600
Dispensing area(mm)	Single-valve: X: 650  Y: 630  Z: 30
Repeatability (mm)	±0.025
Maximum moving speed (mm/s)	1000
Maximum acceleration (g)	0.8
Standard configuration	Electrostatic interface;  LED lighting;  CCD visual positioning   232 scanner socket;  Lifting device
Optional configuration	Booster pump;  UPS;  Voltage Regulator;  Barcode scanner   Micro-balance (0.1mg);  Laser altimetry (SICK)   Dual conveyors;  Dual-valve;  Four-direction tilt

Applications

 

1. Electronics Manufacturing (Largest Application)

• Semiconductors: Underfill, chip bonding, die attachment.

• PCB Assembly: Solder mask, conformal coating, potting, component retention.

• Consumer Electronics: Waterproof gasketing, lens & battery bonding, thermal paste.

• Displays: Touch panel bonding (OCA), edge sealing.

2. Automotive & Aerospace

• Electronics: Potting sensors, ECUs, LED modules.

• Structural: Windshield bonding, gaskets, vibration damping, thread locking.

• EV Batteries: Thermal interface materials, module sealing & bonding.

3. Medical Devices

• Disposables: Sealing catheters, IV sets.

• Durable/Implantables: Encapsulating electronics (pacemakers, hearing aids).

• Precision Assembly: Bonding small, complex parts.

4. General Industrial & Consumer Goods

• Appliances: Gasket sealing, component bonding.

• LED Lighting: Thermal paste, phosphor, lens sealing.

• General Assembly: Bonding toys, jewelry, eyewear.

1. Potting & Encapsulation: Filling a housing or cavity to protect components from shock, vibration, moisture, and corrosion.
2. Sealing & Gasketing: Creating a continuous bead along the edge of a part to prevent ingress of dust, water, or air.
3. Bonding & Adhesive Application: Applying dots, lines, or patterns to join two components together.
4. Coating: Applying a protective layer (like conformal coating) over an entire surface or assembly.
5. Underfilling: Capillary flow of adhesive under a semiconductor chip to reinforce solder joints.
6. Precision Lubrication: Applying minute, consistent amounts of grease or oil to gears, bearings, or connectors.

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
 

 

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.