High-Performance G Etching Equipment for Accurate Production Needs

Product Description

Product Description

  

G Texturing And Etching Automatic Loading And Unloading Machine

Use Of Equipment:
Automatic loading of stacked silicon 
wafers for texturing process

Main Technical Parameter
Capacity(2 channels):≥ 9600 pcs/h
Capacity(2 channels):≥ 14000 pcs/h
Fragment Rate:≤ 0.02%
Power On Rate:≥ 99%

Chain Oxidation Automation Equipment

Use Of Equipment:
Automatic feeding for chain oxidation process

Main Technical Parameter
Capacity:≥ 9500 pcs/h
Fragment Rate:≤ 0.01%
Power On Rate:≥ 99%

 

PVD automatic wafer loading and unloading machine

Use Of Equipment:
Automatic chip loading and unloading 

for PVD process of hit battery
Capacity:≥ 4000 pcs/h
Fragment Rate:≤ 0.05% 
Power On Rate:≥ 99%

SSX PECVD Automatic Loading and Unloading Wafer Machine

Use Of Equipment:
Automatic loading and unloading sheet for tubular 

PECVD graphite boat
Capacity:≥ 5400 pcs/h
Fragment Rate:≤ 0.04%
Power On Rate:≥ 99%

Quartz boat loading and unloading machine

Use Of Equipment:
Automatic loading and unloading of quartz boat for 
diffusion and annealing process

Main Technical Parameter
Capacity:≥ 9600 pcs/h
Fragment Rate:0.03%
Power On Rate:≥ 99%

Efficient PERC battery ALD loading and unloading equipment

Use Of Equipment:
Automatic chip loading and 
unloading for ALD process

Main Technical Parameter
Capacity: ≥ 7500 pcs/h
Fragment Rate: ≤ 0.02%
Power On Rate: ≥ 99%

Application

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.