Dry-in/Dry-out (DIDO) Process Chemical Mechanical Polishing Machine System for Wafer Polishing

• Customization: Available
• After-sales Service: Provided
• Function: Abrasion Resistance
• Model NO.: WP-01
• Demoulding: Pull Core
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Pneumatic
• Mould Life: >1,000,000 Shots
• Product Name: 6/8-Inch CMP Device
• Advantage 1: Compatible with 6/8-Inch Wafers
• Advantage 2: Flexible Process Switching
• After-Sale Service: Provided
• Mechanical Configuration: 3-Platen + 4-Head System
• Process: Dry-in/Dry-out Process
• Uniformity Control: Wiw/Wtw <5%
• Material Support: Sic/GaN Compatibility
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 100

Product Description

Product Description

• Compatible with 6/8-inch wafers, fully automatic dry in and dry out, flexible process switching, and wide applicability
• Support the flattening process requirements of SiC, GaN third-generation semiconductors and special materials
• Realize mass sales in China

 

1. Core Architecture & Design

Mechanical Configuration

• 3-Platen + 4-Head System:
  Enables parallel processing (e.g., coarse/fine polishing stages) with independent heads, maximizing throughput.
• Dual-Brush Cleaning:
  Integrated PVA + nylon brushes reduce particle contamination by >30% (post-CMP defect density <0.05/cm²).

Dry-in/Dry-out Process

• Eliminates liquid exposure, critical for moisture-sensitive materials (e.g., SiC wafers), reducing watermark defects by 40% vs. wet handling.

 

2. Process Performance Highlights

Uniformity Control

• WIW/WTW <5%:
  Achieved via real-time pressure zoning (adjustable per 5mm wafer edge exclusion) with ±0.1 psi accuracy.
• Removal Rate (RR) Metrics:

  Material	NU (5mm EE)	Head-to-Head RR Variance
  Oxide	<3% (mean)	≤200Å/min
  Tungsten	<3% (mean)	≤300Å/min

Advanced Material Support

• SiC/GaN Compatibility:
  Uses hybrid pads (e.g., IC1000 + perforated Suba IV) to maintain RR >500Å/min on 6H-SiC substrates.

 

3. Advanced Process Control (APC)

Module	Function	Case Example
I-scan	In-situ thickness monitoring (±50Å)	Detects ILD clearing endpoint
Laser Scan	3D surface topography mapping (1µm res.)	STI trench depth uniformity control
Torque Control	Dynamic downforce adjustment (±2N·m)	Prevents Cu dishing in 5nm nodes

 

4. Key Specifications Comparison

Model	Horizon-T 200CMP (Oxide)	Horizon-T 200CMP (W)	Horizon-T 150CMP
Throughput (WPH)	45	35	45
MTBF/MTTR	>200hrs / <3.5hrs	Identical	Identical
Applications	STI, ILD	BEOL Metal	Cost-sensitive nodes

 

5. Industry Applications

• 5G ICs: Achieves Ra<0.5nm on GaAs for 28GHz mmWave antennas.
• Power Devices: CMP cycle time reduction from 120→80min for SiC IGBTs.

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.