| Customization: | Available |
|---|---|
| Basic Operation: | Cuts Adhesive Film to Required Size |
| Application Quality: | Lays Smoothly Without Folding or Wrinkling |
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This machine is an advanced, space-efficient solution for automatically cutting and laying adhesive film onto glass or other surfaces. Designed for operational ease and reliability, it enables a single operator to handle the entire process, significantly improving efficiency and material handling for various material types.
Precision Cutting & Laying: The system automatically cuts the adhesive film to the required size and lays it onto the substrate. It ensures a smooth, high-quality application, completely free of folding, wrinkling, or other defects.
Operational Efficiency & Ease: Featuring a single-station design, it has a compact footprint, occupying significantly less space than common two or three-station machines. It is engineered for single-person operation, allowing one user to manage the entire feeding process effortlessly.
Material Handling & Versatility: The machine can accommodate large material rolls with a length of 200 to 800 meters and a maximum roll diameter of ≤ 700 mm. Its versatility is enhanced by the ability to be compatible with various materials simply by replacing the cutter.
Advanced Assistance & Reliability: It is equipped with a reliable automatic deviation correction system to ensure precise material placement and a laser-assisted positioning function in the feeding area for accurate loading. Additionally, it includes an anti-static function to ensure material stability and handling consistency.
| ltem | Value |
| Working power supply | AC 380V, three-phase five-wire system, 50Hz |
| Working airpressure | 0.6~0.7 MPa |
| Working environment | ≤85%RH |
| Working noise | ≤60dB |
| Design tact time | ≤20s |
| Power | ≤10kW |
| Item | Value |
| Dimension | 7000mm*2000mm*2000mm |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
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