High-Precision Laser Cutter for Thin Metal Fabrication Solutions

• Customization: Available
• After-sales Service: Provided
• Warranty: 12 Months
• Model NO.: MPS-0606LM
• Application: Home Appliance, Environmental Equipment, Automotive Industry
• Cooling System: Water Cooling
• Technical Class: Continuous Wave Laser
• Applicable Material: Metal
• Structure Type: Gantry Type
• Laser Classification: Semiconductor Laser
• Laser Technology: Laser Control Fault Cutting
• Reach Accuracy: +0.003mm
• Minimum Measurement: 0.5*0.5mm
• Cutting Substrate: Si, Pkg, PCB etc
• Central System Function: Remove Machine Alarm Processing
• Spindle Output Power: 1.8kw(2.4kw)
• Spindle Speed Range: 6000-60000rpm
• Power: AC380V±10%
• Size: 1200mm×1629mm×1849mm
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Mps-0606lm Precision Laser Cutting Machine for Precision Machining of Thin Metal

Product Description

Product overview:
MPS-0606LM is a product specially for the small format precision laser cutting market. It is mainly used for cutting metal sheets and ceramic substrates, with a closed structure, superior performance, stability, and extremely high cost-effectiveness.

Product features:

1. Use a stable Dinglongmen marble platform.
2. The entire machine adopts high-quality linear motors and high-resolution grating rulers, with high accuracy and processing efficiency.
3. Stable equipment, user-friendly operation interface, real-time feedback of processing status, ensuring the orderly progress of cutting and processing.

 

Key Configurations

The wafer dicing machine consists of several key components designed for precise operation and user control:

Indicator - Displays critical machine parameters such as spindle speed, cutting depth, and operational status.
Control Button - A user interface panel with tactile buttons for initiating, pausing, and adjusting machine functions. Operators can set cutting parameters and control the workflow efficiently.
Control System - The central processing unit that manages machine operations, including motion control, speed regulation, and safety protocols. 
Lighting - Integrated illumination for enhanced visibility during the dicing process. 
Working Table - A precision-engineered platform that holds and positions the wafer during cutting. It typically includes vacuum suction or clamps to secure the material in place for accurate dicing.
 

Technical Specifications

(Custom configurations available upon request.)

X axis	maximum effective input rang of feed speed	310mm 0.1-1000mm/s	310mm	210mm
			0.1-1000mm/s	0.1-600mm/s
Y axis	max effective	310mm	310mm	170mm
	single step increment	0.0001mm	0.0001mm	0.0001mm
	reach accuracy	0.003mm/310mm	0.003mm/310mm	0.003mm/170mm
Z axis	maximum effective	40mm	40mm	40mm
	repetition accuracy	0.001mm	0.001mm	0.001mm
	maximum cutter diameter	58	58	58
T axis	maximum rotation angle	380°	380°	380°
spindle	speed range	6000-60000rpm	6000-60000rpm	6000-60000rpm
	output power	1.8KW(2.4KW)	1.8KW(2.4KW)	1.5KW (2.4KW)
power		AC380V±10%	AC380V±10%	AC380V±10%
Size W×D×H		1200mm×1629mm×1849mm	1080mm×1160mm×1800mm	630mmx900mmx1600mm

 

MPS-0606LM is applied to the precision machining of thin metal with high precision requirements, and has achieved good results at present. 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
 

Q3:Why choose us?
A3:OEM/ODM/Designing service.