Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging

• Customization: Available
• After-sales Service: Free Training
• Condition: New
• Model NO.: HMLY-DB-005
• Speed: Super High Speed
• Precision: High Precision
• Certification: RoHS, CE
• Warranty: 24 Months
• Automatic Grade: Automatic
• Type: Ultra High-speed Chip Mounter
• Configuration: Inline or Standalone
• Communication: TCP/IP
• Power Supply: 220V
• Chip Size Range: 0.8–25 mm
• Wafer Support: 8-Inch / 12-Inch
• Substrate/Leadframe Width: 30–120 mm
• Substrate/Leadframe Length: 150–300 mm
• Bond Force Range: 30 GF – 4000 GF
• Machine Dimensions (W×d×h): 2170 mm × 1450 mm × 1800 mm
• Weight: 1800kg
• Transport Package: Wooden Box by Sea Shipping
• Specification: standard package
• Trademark: Himalaya
• Origin: China
• Production Capacity: 5000

Product Description

Die Bonder

Chip Bonding Equipment (Die Bonder)
Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles to pick-and-place flipped chips onto substrates, then connecting the chip electrodes through thermal processes.

Functions and Features
Die Attachment
The core function involves precisely securing chips onto packaging substrates to ensure stable mechanical and electrical connections.

 

Electrode Bonding
The process typically includes heating to form electrical interconnections between chip electrodes (e.g., solder bumps/pads) and corresponding substrate electrodes.

 

Flip-Chip Technology
Advanced bonders utilize flip-chip methods, where the die is inverted and bonded via solder bumps/copper pillars to the substrate (e.g., C4, μ-bump bonding).

 

Yield Control
Integrated with mapping software to define acceptance/rejection criteria for dies (e.g., positional accuracy, bond strength), ensuring high production yield.

Specification

SSA-1A00000B Die Bonder – Specifications Summary
Category	Parameter	Specification
General	Model	SSA-1A00000B
	Configuration	INLINE or Standalone
	Communication	TCP/IP
	Power Supply	220V
	Cleanliness Class	Class 100 (ISO 5)
	Compressed Air Pressure	0.5–0.8 MPa
Compatibility	Chip Size Range	0.8–25 mm
	Chip Thickness	>20 µm
	Wafer Support	8-inch / 12-inch
	Substrate/Leadframe Width	30–120 mm
	Substrate/Leadframe Length	150–300 mm
	Substrate Thickness	<3 mm
Performance	Bond Force Range	30 gf – 4000 gf
	Bond Force Deviation	30–250 gf: <5% / 250–4000 gf: <10%
	UPH (Units Per Hour)	Standard: >2000 pcs/h / High-speed: >3000 pcs/h
	XY Placement Accuracy	±0.020 mm (Standard) / ±0.010 mm (High Precision)
	Angle Placement Accuracy	<0.5° (Standard) / <0.1° (High Precision)
	XY Resolution	0.0001 mm
	Angle Resolution	0.01°
	CPK (Process Capability)	>3σ
Solder Paste	Solder Paste Dot Size	0.2×0.2 mm – 20×20 mm
Reliability	MTBA (Mean Time Between Assist)	>3 hours
	MTBF (Mean Time Between Failures)	>120 hours
Physical	Machine Dimensions (W×D×H)	2170 mm × 1450 mm × 1800 mm
	Weight	1800 kg

Applications

Key Applications of Die Bonding

Integrated Circuit (IC) Packaging

Power Electronics

MEMS & Sensors

RF & Microwave Devices

Advanced Packaging Technologies

Key Configurations

Ultra-Precise, High-Speed Bonding

3,000–5,000 UPH – Optimized for dot/press soldering and lead frames.

±70 μm Accuracy – Tight tolerances (<1° tilt, ≤5% void rate) for reliability.

Smart & Scalable – AI-assisted alignment, multi-machine linking, GSM remote monitoring.

Flexible Configurations – Robotic/conveyor loading, solder path programming, 8-zone temp control.

Technical Specifications

Bonding Station

Dispensor Modular

Wafer Table

Die Placement & Bonding: Precision attachment of dies to substrates (e.g., PCB, lead frame, or other dies for 3D IC stacking).
Force/Thermal Control: Adjustable parameters for diverse materials (Si, GaN, organic substrates).

Adhesive/Paste Deposition: Controlled application of epoxies, underfill, or solder.

Pattern Flexibility: Dots, lines, or custom shapes for varied packaging designs.

Precision Alignment: Holds and positions wafers with micron/sub-micron accuracy.
Flatness Control: Maintains uniform surface contact (critical for lithography and bonding).
Thermal Regulation: Heats/cools wafers for processes like EUV lithography or thermocompression bonding.
Vibration Isolation: Minimizes disturbances in high-precision processes (e.g., overlay alignment).

Application

Die Bonder Applications in Advanced Semiconductor Packaging

Die bonders play a crucial role in 3D heterogeneous integration, enabling high-density interconnects between different functional layers (e.g., sensors, memory, logic). Below is a detailed breakdown of the four key applications you mentioned, along with technical challenges and solutions.

 

1. Interconnection in 3D Stacked Image Sensors (e.g., CIS, SWIR Sensors)

Pixel Layer Fabrication (CMOS image sensor wafer)

Signal Processing Layer (BSI or 3D-stacked ADC/DSP layer)

Hybrid Bonding or Microbump Interconnection

 

2. Multi-Layer Stacking for Memory (NAND, DRAM, HBM)

Wafer Thinning & TSV Formation

Die-to-Die (D2D) or Die-to-Wafer (D2W) Bonding

Underfill & Encapsulation

 

3. MEMS-Sensor Integration (MEMS + ASIC)

MEMS Wafer Fabrication (e.g., accelerometer, gyroscope)

ASIC Wafer Fabrication (signal processing)

D2W or W2W Bonding

 

4. Micro-LED Interconnection with Driving Circuits

Micro-LED Epitaxy & Transfer (GaN/sapphire)

TFT/CMOS Backplane Fabrication

Mass Transfer & Bonding

After Sales Service

Standard Warranty: 12 months or 2,000 operating hours (whichever comes first).
Extended Warranty: Optional coverage up to 36 months.
Global Support: 24/7 technical assistance and spare parts supply.
Training: On-site or remote operation/maintenance training.

Company Profile

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu Himalaya Semiconductor Co., Ltd. is a premier semiconductor equipment manufacturer and global exporter established in 2019. We specialize in providing high-performance, cost-effective semiconductor manufacturing solutions to clients worldwide, with a strong presence in 30+ countries and a network of 200+ satisfied customers and suppliers.

Our Core Semiconductor Equipment
We design and manufacture advanced semiconductor production equipment, including:
Die Bonders – High-precision chip attachment for IC packaging
Wire Bonders – Reliable interconnects for semiconductor devices
Laser Processing Machines – Wafer marking, grooving, cutting (Si, SiC, glass, ceramics)
Wafer Dicing Saws – Precision cutting for MEMS, optoelectronics, and advanced packaging
Laser Annealing Systems – For Si/SiC wafers
Automatic Dispensing Equipment – High-accuracy silicone & epoxy application

Why Choose Us?

Other Products

Global Reach – Trusted by 200+ clients in 30+ countrie

End-to-End Support – From procurement to integration

Cutting-Edge Technology – Precision-engineered for high yield & efficiency

Customization – Tailored solutions for unique production needs

Wire Bonding

Silicone dispensing machine

Wafer dicing

Wafer marking

Laser cutting etc

FAQ

Q: What's the lead time for orders?
A: Standard models ship in 15–30 days; customized units require 30–45 days.

Q: Do you provide after-sales service overseas?
A: Yes, we have partnered service centers in key regions.

Q: Can I request a customized size?
A: Absolutely! We offer tailored attachments.

Q: What documents do you provide for export?
A: Full export package (Commercial Invoice, Packing List, Bill of Lading, COC, etc.).

Q: How do I place an order?
A: Contact us via email/phone for a quote, then confirm with a PO.