Advanced Fully Automatic Laser Marking Machine for Wafer ID

• Customization: Available
• After-sales Service: Provided
• Function: Laser ID Marking
• Model NO.: Himalaya-6688-2
• Demoulding: No
• Condition: New
• Certification: RoHS, ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Desktop
• Driven Type: Electric
• Mould Life: Laser Warranty for One Year
• Product Name: ID Laser Marking Machine
• Feature 1: High Precision
• Feature 2: High Efficiency
• After-Sale Service: Provided
• Transport Package: Complies with International Logistics Standards
• Specification: 1400 x2400x 2440 (including tricolor light)
• Trademark: Himalaya
• Origin: China

Product Description

Fully Automatic  Wafer ID Laser Marking Machine

Product Description

 

1. Applied to semiconductor wafer ID marking, compatible with products under 12 inches;
2. Fully automatic operation, equipped with FFU purification system;
3. Suitable for common wafer materials such as silicon, silicon carbide, gallium arsenide, etc; 4. Comply with SEMI standards and support SECS/GEM communication protocol;
Hard marking: Point diameter: 90um; Depth 300um

 

Category	Specification
Application	Semiconductor Wafer ID (Identification) Marking
Wafer Compatibility	Up to 12 inches (300mm)
Operation Mode	Fully Automatic
Cleanroom Environment	Equipped with FFU (Fan Filter Unit) Purification System
Applicable Materials	Silicon (Si), Silicon Carbide (SiC), Gallium Arsenide (GaAs), and other common wafer materials
Compliance & Communication	Complies with SEMI standards; supports SECS/GEM communication protocol

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.