Advanced Copper Layer Stripping System for Semiconductor Manufacturing

• Customization: Available
• Feature 1: High Precision
• Feature 2: High Efficiency
• Model NO.: HIMALAYA-8640
• Productivity: ≥ 9,600 Wafers/Hour
• Transmission Speed: 1.0 - 4.0 M/Min
• Operating Speed: 2.5 M/Min
• Breakage Rate: < 0.5%
• Uptime: ≥ 98%
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Corrosion Stripping Copper Equipment refers to industrial systems designed to selectively remove copper layers or corrosion products from substrates through chemical, electrochemical, or plasma-assisted processes. These systems are critical in:

1. Semiconductor Manufacturing

   • Stripping excess copper interconnects post-CMP

   • TSV copper pillar trimming in 3D packaging

2. PCB Fabrication

   • Etching residual copper traces

   • Preparing high-density interconnect (HDI) boards

3. Metal Recovery

   • Recycling copper from electronic waste

Features
•Dual-groove design, fast switching, significantly reducing the liquid change time;
•Accurate liquid roller, stable liquid dosage,
•Multiple parallel water washes, ensure cleaning effectiveness
while improving the utilization rate of pure water.

Performance

Item	Value
Productivity	≥9600wafer/h, 182B & 210B
Transmission speed	1.0-4.0m/min
Operating speed	2.5m/min
Breakage rate	<0.5%.
Uptime	≥98%

Parameter

Item	Value
Cleaning process	Edge lsolation→Rinse→tin-plating→Rinse→5 stage Rinse→DRY

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.