Precision Fiber Laser Engraving Machine for Gold and Silver Jewelry

• Customization: Available
• After-sales Service: 7*24 Hours
• Warranty: 1 Year
• Model NO.: MK-0930
• Laser Visibility: Visible
• Applicable Material: Metal
• Cooling System: Water Cooling
• Technical Class: Pulse Laser
• Laser Wavelength: Fiber Laser
• Laser Classification: Semiconductor Laser
• Type: Semiconductor Laser Marking Machine
• Marking Method: Scanning Marking
• Product Name: Fiber Laser Marking
• After-Sale Service: Provided
• Output Power: 20W
• Wavelength: 1064nm (IR)
• Standard Lens: F160 (160mm Focal Length)
• Marking Area: 100×100mm
• Max. Marking Speed: 7m/S (22.97'/S)
• Marking Depth: ≤0.4mm
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 100

Product Description

 

Product Description

Introducing Our High-Precision Fiber Laser Marking Machine

Our fiber optic laser marking machine is an advanced industrial solution designed for high-speed, ultra-precise, and durable marking on a wide range of materials. Utilizing a high-quality fiber laser oscillator, this system delivers exceptional beam quality, reliability, and efficiency, making it ideal for industries requiring deep, smooth, and highly accurate engravings.

 

Key Features & Advantages

1. Superior Laser Performance

• High Beam Quality (M² < 1.6) - Ensures sharp, clean, and consistent markings.
• Stable Power Output (±1% RMS over 8 hours) - Guarantees long-term reliability without fluctuations.
• Wide Pulse Frequency Range (1.6kHz-1000kHz) - Adapts to various materials and marking needs.

2. Compact & Efficient Design

• Air-Cooled System - No bulky water cooling required, reducing maintenance.
• Fiber-Optic Output - Enables flexible integration into production lines and 3D marking systems.
• Small Footprint (1.8'×2.6'×2.5') - Saves workspace without compromising performance.

3. Advanced Protection & Precision

• Backward Reflecting Isolator - Blocks reflected laser light to protect the oscillator from damage.
• High-Speed Marking (Up to 300 characters/sec) - Boosts productivity with rapid processing.
• Ultra-Fine Detailing (Min. line width: 50μm, Min. character size: 0.01'') - Perfect for micro-engravings, QR codes, and barcodes.

4. Broad Material Compatibility

• Metals (Stainless steel, aluminum, titanium, etc.)
• Plastics & Composites
• Ceramics & Glass (with proper settings)

5. User-Friendly & Reliable Operation

• Easy Integration - Works with standard electrical supply (110V-220V, 50Hz/60Hz).
• Low Power Consumption (500W) - Energy-efficient while maintaining high performance.
• Red Guide Light (650nm) - Ensures precise alignment for accurate marking.

Brief Description

1. Various metal materials, part of non-metal materials.
2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for processing fields that need high marking depth, smoothness and accuracy.

Features:

1.Small and compact size, use common air-cooling system.
2.Fiber output, can apply flexibly, and easy to make 3D processing system.
3.Install backward reflecting isolator, which uses the particularity of wavelength and direction of laser, and the special structure inside the backward reflecting isolator, to block the laser reflected by work piece, in order to avoid the laser enter the laser oscillator again to damage the laser oscillator.

Specification:

Model	G20
Laser output power	20W
Focus lens	F160 (standard)   F254(optional)
Lens type	F160 (standard)	F254(optional)
Marking area	3.9''×3.9''	6.3''×6.3''
Marking speed	300 characters/sec, height=0.039''	300 characters/sec, height=0.039''
Min. character size	0.01''	0.02''
Min. line width	50μm	90μm
Wave length	1064nm
Beam quality M2	<1.6
Power stability(8h)	<±1% rms
Pulse repetition frequency	1.6kHz-1000kHz
Marking depth	≤0.016''
Marking speed	≤22.97'/s
Repetition accuracy	±0.0001''
Power consumption	500W
Indication light	Red light wavelength=650nm
Cooling mode	Air cooling
Running temperature	15ºC-35ºC
Electrical source requirement	110-220V/ 50Hz (60Hz) / 4A
Dimensions (L*W*H)	1.8'×2.6'×2.5'
Weight	121 KG

Applications

Applications

 Industrial Part Marking (Serial numbers, logos, QR codes)
 Electronics & Semiconductor (PCB, IC chips)
 Medical & Dental Devices (Surgical tools, implants)
 Automotive & Aerospace (Engine components, VIN marking)
 Jewelry & Luxury Goods (Custom engravings, branding)

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.