High-Speed Carton Box Manufacturing Machine for Efficient Packaging
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Product Highlights
- High-Speed Packaging: Output speed ranges from 24 to 40 boxes per minute for efficient production.
- PLC Control System: Ensures safe, stable operation with intuitive human-machine interface.
- Robotic Arm Feeding: Fully servo drive mechanism for flexible and stable material handling.
- Intelligent Detection: Automatically stops and displays causes for abnormalities to prevent errors.
- Stainless Steel Body: Constructed with 304 stainless steel for durability and CMP compliance.
- Customizable Box Sizes: Supports custom sizes within L:70-160mm, W:20-50mm, H:20-40mm range.
- Multi-Industry Application: Suitable for pharmaceutical, food, electronics, cosmetics, and auto parts.
- Cost Reduction: Saves labor and reduces procurement costs for product packaging boxes.
Product Attributes
- Customization
- Available
- After-sales Service
- Provided
- Warranty
- 24 Months
- Model NO.
- HIMALAYA-550
- Laser Visibility
- Visible
- Applicable Material
- Nonmetal
- Cooling System
- Air Cooling
- Technical Class
- Pulse Laser
- Laser Wavelength
- Fiber Laser
- Laser Classification
- Free Electron Laser
- Type
- CO2 Laser Marking Machine
- Marking Method
- Scanning Marking
- Feature 1
- High Precision
- Feature 2
- High Efficiency
- After-Sale Service
- Provided
- Transport Package
- Customized or Wooden Box Packaging
- Specification
- Standard Specifications
- Trademark
- Himalaya
- Origin
- China
Product Images of High-Speed Carton Box Manufacturing Machine for Efficient Packaging
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Product Description
Scope of application:
The tamper-proof carton automatic forming and packaging integrated machine is a new product developed by our company. It has obtained many invention patents, has a wide range of applications, high efficiency, stable operation, and can be used for multiple purposes. It is suitable for the automatic forming and packaging of carton in the pharmaceutical, daily chemical, food, electronics, cosmetics, auto parts and hardware industries.
The equipment adopts automatic components such as manipulator automatic feeding, carton forming, product boxing, and box sealing. The PLC control system makes the machine safer and more stable, and the human-machine interface operation platform makes the machine easier and faster to use, making the entire packaging process more automated.
The equipment has sufficient strength and rigidity; ensure that the equipment remains stable under high-speed operation; reduce the wear of each component and ensure the extra-long life of the whole machine.
Functional feature:
• It can automatically complete the automatic forming of paper boxes, adhesive spraying, product packaging, sealing, and other tasks.
• This machine adopts PLC control and Chinese touch screen operation, which is intuitive and simple. It monitors the actions of various parts through photoelectric monitoring. If there are any abnormalities during operation, it can automatically stop and display the cause, so as to timely troubleshoot.
• The equipment uses a robotic arm to pick up materials and preform paper boxes, and the entire machine's motion mechanism adopts a fully servo drive, making it more stable and flexible to operate.
• This machine is equipped with an intelligent detection device. The paper box conveying without materials does not work, and the material conveying without paper boxes does not work, completely eliminating the problem of empty box packaging.
• This machine can be used alone or in conjunction with other equipment to form a complete production line.
• This new type of packaging machine can save labor, improve production efficiency, and effectively reduce the procurement cost of product packaging boxes, achieving comprehensive cost reduction and efficiency increase.
• The device has product counting and operation speed display functions.
• The box is made of 304 stainless steel. Suitable for CMP requirements, the body surface is made of stainless steel material.
• Randomly equipped with spare parts, accessories, and special tools, the quantity shall be provided according to the packing list.
Main technical parameters
| Boxing Speed/Output | 24-40(Boxes/minute) |
| External dimensions of the machine | 3200x1700x1600 |
| Box size range | (L):70-160mm (W):20-50mm (H):20-40mm(Custom sizes available) |
| Box material requirements | White card 250-350g/m2 Gray card 300-400g/m2 |
| Compressed air pressure/air consumption | ≥ 0.6Mpa/≤2500L/min |
| Total power of the equipment | 9KW |
| Total weight of the machine | 1500Kg |
| Power supply type | 380V |
| Machine noise | ≤80dB |


Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
About the Supplier
This supplier has been audited by BV. Verify the report on the official BV website with ID "MIC-ASI2342144". Items marked "" are certified.
Company Profile
Empowering Global Semiconductor Excellence: An Introduction to Jiangsu Himalaya Semiconductor Co., Ltd.
In the rapidly evolving landscape of global electronics, precision and reliability are the cornerstones of success. Since its establishment in 2019, Jiangsu Himalaya Semiconductor Co., Ltd. Has emerged as a pivotal force in the semiconductor industry, specializing in the high-level integration and international trade of advanced manufacturing equipment.
With a footprint extending to over 30 countries and a robust network of more than 200 global customers and suppliers, we serve as the critical link in the semiconductor supply chain. Our mission is clear: To secure the most cost-effective, high-performance solutions for our clients while ensuring seamless, risk-free transactions for our partners.
Comprehensive Equipment Solutions for Semiconductor Manufacturing
We take pride in our diverse portfolio of high-precision machinery designed to meet the rigorous demands of modern wafer processing and packaging.
1. Advanced Bonding & Marking
Precision at the microscopic level is essential for chip integrity. Our core lineup includes:
Die Bonders: Ensuring high-speed, accurate placement of chips.
Wire Bonding: Providing reliable electrical interconnections with industry-leading stability.
Laser Marking: Specialized ID marking for IC wafers to ensure full traceability throughout the lifecycle.
2. Cutting-Edge Laser Processing
As wafers become thinner and materials more complex, our laser solutions provide the necessary finesse without compromising structural integrity:
Laser Grooving & Cutting: Expertly designed for glass, ceramics, and wafer packaging.
Internal Modification Machines: Specialized laser technology for Si/SiC (Silicon Carbide) and LT/LN (Lithium Tantalate/Lithium Niobate) wafers.
Laser Annealing: Optimized for Si/SiC substrates to enhance electrical properties and repair lattice damage.
3. Dicing & Dispensing
Automatic Dicing Saw Machines: High-efficiency dicing for wafer packaging applications.
Automatic Silicone Dispensing Equipment: Precision fluid control for protective coating and encapsulation.
Customized Industrial Solutions
Beyond standard machinery, Jiangsu Himalaya Semiconductor provides specialized engineering solutions tailored to unique factory requirements:
TGV (Through Glass Via) Technology: Offering manual, semi-automatic, and fully automatic equipment for next-generation 3D packaging.
Coating & Plating: Customized machines designed for specific surface treatment and metal deposition needs.
Environmental & Resource Management: Efficient solutions for handling exhausted metal sorter equipment, promoting sustainable manufacturing practices.
Why Partner with Jiangsu Himalaya Semiconductor?
In a market defined by volatility, we offer stability and strategic advantage. We understand that for our customers, the "final stage" of procurement is the most critical. We utilize our deep industry expertise to filter through global options, delivering products that balance cost with cutting-edge performance.
For our suppliers, we are a partner of trust. We strive for one-time payment collection and comprehensive risk avoidance, allowing manufacturers to focus on innovation while we handle the complexities of global distribution.
Contact Us Today
Whether you are scaling your production line or seeking a reliable global export partner, Jiangsu Himalaya Semiconductor Co., Ltd. is ready to elevate your operations.
Explore the peak of semiconductor technology with Himalaya.
About Our Factory & Business Background
- Address
- Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
-
Registered Capital
- 100,000,000 RMB
-
Terms of Payment
- LC, T/T, PayPal, Western Union
-
International Commercial Terms(Incoterms)
- FOB, CIF, CFR, EXW
-
Average Lead Time
-
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months -
Nearest Port
- Shenzhen Port
-
Minimum Order Quantity
- 1 Set
-
Supply Chain Partners
- 30
Our Production Capability & Technical Expertise
-
Main Products
- Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
-
Inspection Type for Finished Products
- 100% inspection(Visual inspection & Function inspection)
-
Inspection Method for Finished Products
- Finished product checked by packing staff
-
Customization Options
- Flexible customization
-
ODM Service Available
- Yes
-
OEM Service Available
- Yes
-
Traceability of Raw Materials
- No
Our Industry Experience & Global Business Record
-
Year of Establishment
- 2019-09-12
-
Export Year
- 5 Years
-
Main Markets
- Europe
-
Repeat Buyers Choice
- 80%~100%
FAQ
- How to choose a suitable machine?
- You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
- What is the warranty period for the equipment?
- One year warranty and 24 hours online professional technical support.
- Why choose us?
- OEM/ODM/Designing service.
- What is the minimum order quantity?
- The minimum order quantity is 1 set.
- What are the lead times?
- Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.
- What payment terms are accepted?
- We accept LC, T/T, PayPal, and Western Union.
- Is customization available?
- Yes, flexible customization is available for box sizes and other requirements.
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