High-Precision Fully Automatic Wafer Marking Equipment for Semiconductor Industry

• Customization: Available
• After-sales Service: 7*24 Hours
• Function: Abrasion Resistance, High Temperature Resistance
• Model NO.: Himalay-31
• Demoulding: Automatic
• Condition: New
• Certification: ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Wavelength: 532nm (Green)
• Cooling: Water/Air-Cooled
• Power Supply: 220V Single-Phase, 4kw
• Movement Range: 315mm (Linear)
• Speed (Avg/Max): 570mm/Sec (Avg) / 1140mm/Sec (Max)
• Precision: +/-12.6 Micron
• Repeatability: ±0.1mm
• Noise Level: 70±2 dB
• Transport Package: Crate
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 22222

Product Description

Product Description

Wafer Handling and Marking System - Technical Overview

Key Features

1. Wafer Compatibility

   • Supports 8-12 inch bare wafers (configurable for 2-12 inches via modular options).
   • Adaptable to SEMI-standard wafers and customizable for non-standard shapes/materials.

2. Automated Handling

   • Loadport System: Integrated FOUP (Front-Opening Unified Pod) compatibility for seamless wafer loading/unloading.
   • Robotic Arm: High-precision film transmission with adjustable speed/accuracy (see Technical Parameters).
   • Automatic Calibration: Centering and angle correction (<3 sec, ±0.1 mm accuracy).

3. Marking & Identification

   • Laser Marking: Supports edge ID marking with SEMI-standard fonts (5x9 single-line, 10x18 double-line), Arabic, barcodes (BC-412 SEMI T1), and QR/DM codes.
   • OCR Recognition: Optional optical character verification.

4. Connectivity & Control

   • SECS/GEM Compliance: Direct integration with factory host systems.
   • File Formats: DXF, PLT.
   • Control System: Galvo-based laser head + Windows 7/10 OS.

5. Environmental Control (Optional)

   • FFU Air Purification: Maintains ISO Class 2 cleanliness.
   • Dust Filtration: 99% efficiency for particles ≥0.3 µm with alarm-triggered manual cleaning.

Technical Specifications

Laser System

Parameter	Detail
Wavelength	532nm (green)
Cooling	Water/air-cooled
Power Supply	220V single-phase, 4kW

Robotic Arm Performance

Metric	Value
Movement Range	315mm (linear) / 340° (rotation)
Speed (Avg/Max)	570mm/sec (avg) / 1140mm/sec (max)
Precision	±12.6µm (linear) / ±0.0045° (rot.)
Repeatability	±0.1mm

Edge Finder & Calibration

Dust Collector

Parameter	Detail
Airflow	265 m³/h (max)
Negative Pressure	230 mbar
Noise Level	70±2 dB
Exhaust Pipe	Ø75mm

 

Factory Interface Requirements

• • Wafer Detection: LED + image sensor for edge/gap recognition (±0.1° accuracy).
  • Center Alignment: 3-second calibration to ±0.1mm.
  • Wafer Switching: Command/communication-controlled size adjustment.
  • Power: DC24V ±10%, 16A (main) / 3A (edge finder).
  • Vacuum: Better than -53kPa.

Applications & Customization

• Semiconductor Fab: High-volume wafer handling with traceability (SECS/GEM).
• R&D Labs: Flexible customization for non-standard substrates.
• Cleanroom Use: Optional FFU maintains ISO Class 2 conditions.

 

Our Advantages

Quality Control
All machines undergos strict testing before leaving thefactory to ensure each device is in perfect conditionfrom production to delivery to every customer

Comprehesive After-sales Service
Lifelong technical services are provided.Any technical problems or needs for technicalassistance during use can be addressed bycontacting online customer service or techniciansensuring worry - free use.

Product Development
A wide variety of products are developedto meet different customer needs,and customers are advised to consult for details

Equipment Integration
With years of equipment research and development experience,the equipment has a higher degree of integration and is more stable.

Certifications

We are an ISO 9001-certified manufacturer and innovator specializing in semiconductor equipment, with 6 registered utility model patents (UM Patents) in China. Our patented technologies cover:
Semiconductor annealing systems
Cleaning equipment for semiconductor etching
UV debonding machines
And more .
Backed by ISO 9001 quality management, we ensure high precision, reliability, and efficiency in semiconductor manufacturing processes. Our R&D-driven solutions enhance production yield and cost-effectiveness for global clients in IC packaging, MEMS, and advanced wafer processing.

Partner with us for cutting-edge, patent-protected semiconductor equipment tailored to your needs.

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!

Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.