Seamless Edge Finishing Machine for Precision Chamfering Solutions

• Customization: Available
• After-sales Service: Online
• Warranty: 1 Year
• Model NO.: TAE-01
• Layout: Vertical (Space-Saving)
• Weight: 450 Kg
• Working Table Size: 100 × 90 Cm
• Tapping Range: M2–M16
• Spindle Speed: 1, 400–4, 000 Rpm
• Spindle Travel: 30–60mm
• Power Head: 92 Drill Tapping Head
• Motor Power: 1.5 Kw
• Transport Package: Wooden Box
• Specification: 150 × 140 × 180 cm
• Trademark: Himalaya
• Origin: China
• HS Code: 8458110090
• Production Capacity: 800

Product Description

After-sales Service	Online	Warranty	1 Year
Structure	Turntable	Layout	Turntable
Controlling Mode	PLC	Number of Shaft	5
Hole Diameter	<50mm	Automatic Grade	Semiautomatic
Precision	Precision	Certification	BV
Condition	New	Weight	600kg
Trademark	HMLA	Transport Package	Fumigated Wood
Specification	165*170*210cm	Origin	China

Specification

Product name	Rotary table multi-station drilling chamfering tapping machine
Brand	HMLA
Mode	Multi-station drilling chamfering tapping machine
Condition	New
Tapping range	M2-M16
Spindle speed	1400-4000min
Spindle Travel	30-60mm
Motor	1.5kw
Control System	PLC
Power head	92 Drill tapping head
Loading form	Automatic processing of manual feeding turntable rotation
Layout	Vertical
Application	Aluminum parts, brass parts, die-casting parts, iron parts
Weight	450kg
Equipment size	150*140*180cm
Working Table	100*90cm
Color	Silver gray
Transport Package	Fumigated wood

Packing & Delivery

Company Profile

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in exporting business and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!

We manufacture equipments for Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting(Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si /Sic Wafe, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine(Wafer Packaging)), Automatic Silicone Dispensing Equipment.

As well as we provide some solutions for handling exhausted metal sorter equipments, customized coating and plating machine, TGV & manual/semiautomatic/automatic equipments, so on.