Gold/Alloy/Copper Wire High Speed Fully Automatic Wire Bonder with 45ms/Wire
| Customization: | Available |
|---|---|
| After-sales Service: | 7*24 Hours |
| Function: | Abrasion Resistance, Lubrication, High Temperature Resistance, Anti-Corrosion, Anti-Cold |
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Basic Info.
- Model NO.
- CCDAL-02
- Demoulding
- Wire Bonder
- Condition
- New
- Certification
- ISO, CE
- Warranty
- 12 Months
- Automatic Grade
- Automatic
- Installation
- Vertical
- Driven Type
- Electric
- Mould Life
- >1,000,000 Shots
- Applicable Wire Diameter
- φ15 ~ φ50μm (Gold or Copper)
- Maximum Bonding Area
- X: 56mm, Y: 80mm
- Repeatability
- ±3μm (@ 3-Sigma)
- Position Accuracy
- ±3μm (@ 3-Sigma)
- Applicable IC Products
- to, Sot, Sop, Ssop, Tssop, Solc, Qfp, DIP, BGA,
- Magazine Compatibility
- Length: 100 to 275 mm Width: 30 to 90mm
- Weight
- 660kg
- Bonding Cycle
- 45 Ms Per Wire
- Transport Package
- International Trade Standard
- Specification
- 985mm*960mm*1770mm
- Trademark
- Himalaya
- Origin
- China
- HS Code
- 8486402200
- Production Capacity
- 100
Product Description
This high-performance wire bonder is designed to tackle the most challenging integrated circuit (IC) and multi-chip module packaging applications. It achieves exceptional placement accuracy of ±2μm at an impressive cycle time of 45ms, ensuring maximum throughput and yield in high-volume production environments. With a generous bonding area of 56mm x 80mm, it efficiently handles a wide range of package types, including QFP, BGA, COB, TSSOP, and optoelectronic devices.
| Parameters / Specifications | ||
| Category | Parameter | Specification |
| Performance | Bonding Accuracy | +/-2um @ 3σ |
| Bonding Cycle Time | 45ms @ 2mm wire length | |
| Max. Bonding Area | X: 56mm, Y: 80mm | |
| Mechanical | XYZ Resolution | 500 nm |
| Material Handling Mechanism | Vertical Stick | |
| Number of Sticks | 2~3 | |
| Wire Bonding | Applicable Wire Diameter | 15 ~ 50 um |
| Material Handling | Lead Frame Length | 85 ~ 300 mm |
| Lead Frame Width | 22 ~ 63 mm | |
| Lead Frame Thickness | 0.07 ~ 0.7 mm (Custom required if >1.0mm) | |
| Physical | Weight | ~861 kg |
| Dimensions (L x W x H) | 1040 mm x 920 mm x 1960 mm | |
| Compatible Packages | 50T, SOP, SSOP, TSSOP, DPN, QPH, QFP, BGA, COB, Optocouplers, etc. | |
Features
-
High Performance Platform: Built on a new generation platform and architecture for higher speed (UPH) and stability.
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Enhanced Process Control: Improved accuracy of force control and Ultrasonic Generator (USG) output reduces the possibility of non-stick on ball (NSB) and pad peeling.
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Adaptive Temperature Control: Features an adaptive system to effectively improve bonding accuracy.
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Advanced Bond Head: Equipped with a dual-frequency transducer and a lightweight nano wire clamp for wider product adaptability.
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Energy Efficient: An intelligent Power control engine effectively controls energy consumption.
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Sophisticated Software: A new wire arc algorithm accommodates more materials and meets the requirements of complex products.
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Configurable Vision: Can be equipped with a laser conversion head to adapt to multi-layer chipset products.
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Broad Application Range: Suitable for IC products with stick frame depths within 33mm.
-
Substrate-Based & Advanced Packages:
-
QFP (Quad Flat Package)
-
BGA (Ball Grid Array)
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50T (Likely a 50-mil or specific type of Thick package)
-
-
Chip-Level and Specialized Packaging:
-
COB (Chip-On-Board)
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Optocouplers (Opto-isolators)
-
-
Lead-Frame Based Packages:
-
SOP (Small Outline Package)
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SSOP (Shrink Small Outline Package)
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TSSOP (Thin Shrink Small Outline Package)
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DPN (Dual Flat No-lead package, likely a typo for DFN)
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QPH (Quad Flat Package, Heatster version)
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Packaging & Freight Services
We ensure your semiconductor equipment arrives in perfect condition, anywhere in the world.
Secure Packaging: Protected with shock-absorbing bubble foam inside a robust wooden crate for maximum transit safety.
Global Logistics: We arrange and manage reliable shipping via road, sea, and air freight to meet your timeline and budget needs.
Your precision equipment is handled with care from our door to yours.
We also work closely with prominent domestic enterprises: Sunny Optical Technology (a leader in optical components), Sanan Optoelectronics (a major force in optoelectronic semiconductors), HT-Tech (a specialist in advanced packaging), Tsinghua Tongfang (with strong R&D capabilities from academia-industry integration), TUS Holdings (a hub for tech incubation), and TCL (making strides in semiconductor display and related fields).
Additionally, we partner with top-tier academic institutions such as Xi'an Jiaotong University and Northwestern Polytechnical University, leveraging their research prowess to drive innovation in semiconductor equipment technology. Together, these collaborations enable us to advance capabilities and deliver cutting-edge solutions in the semiconductor equipment sector.
1. What is a wire bonder?
A wire bonder is a precision machine used in semiconductor packaging to create electrical interconnections between an integrated circuit (IC) chip and its package (or substrate) using very fine wires.
2. What is the purpose of wire bonding?
Its primary purpose is to provide a reliable electrical path for signals and power to travel from the silicon die out to the larger leads of the package, which then connect to a printed circuit board (PCB).
3. What are the main types of wire bonding?
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Ball Bonding: Uses a flame-off (EFO) to form a molten ball at the wire tip, which is then bonded. Primarily used for gold wire on the first bond to the chip.
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Wedge Bonding: Uses a wedge tool to press the wire directly onto the bonding pad. Used for aluminum wire, fine-pitch applications, and the second bond.
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Ball bonding is for gold wire, Wedge bonding is for gold or aluminum wire.
4. What materials are used for bonding wire?
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Gold (Au): The most common material, offers excellent conductivity and reliability.
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Copper (Cu): Becoming increasingly popular due to lower cost and higher strength, but requires a protective atmosphere to prevent oxidation.
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Aluminum (Al): Often used for power devices and wedge bonding applications.
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