Precision Wafer Alignment Technology for Circuit Manufacturing Excellence

Product Details
Customization: Available
Sensor Type: Reflective Optical Fiber
Wafer Size: 6 to 12 Inch
Gold Member Since 2023

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  • Precision Wafer Alignment Technology for Circuit Manufacturing Excellence
  • Precision Wafer Alignment Technology for Circuit Manufacturing Excellence
  • Precision Wafer Alignment Technology for Circuit Manufacturing Excellence
  • Precision Wafer Alignment Technology for Circuit Manufacturing Excellence
  • Precision Wafer Alignment Technology for Circuit Manufacturing Excellence
  • Precision Wafer Alignment Technology for Circuit Manufacturing Excellence
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  • Overview
  • Product Description
  • Product Parameters
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
Ag100
Alignment Time
2.5s
Transport Package
Wooden Package
Specification
50kg
Trademark
Himalaya
Origin
China
HS Code
8541590000
Production Capacity
500

Product Description

Product Description

For calibration steps in various devices within the semiconductor manufacturing process, capable of handling semiconductor wafers or glass substrates ranging from 6 inches to 12 inches. the products has been certified by SEMI S2. It is designed to minimize the contact area between the gripper and the wafer surface, thereby reducing particle contamination caused by surface friction. Customer-made services is available. 

Product Features

Suitable for 200-300mm wafers
High-speed, high-accuracy centering and notch locating
Size, shape, material of spindle can be changed according to the wafer type
Spindle diameter, shape, and material can be changed based on wafer size and material, and Bernoulli adsorption method can be used
Control communicaiton mode: serial port RS2320 or parallel port I/O mode
Gaps that do not meet SEMI specifications and edge shapes can also be customized for design

Precision Wafer Alignment Technology for Circuit Manufacturing Excellence
Precision Wafer Alignment Technology for Circuit Manufacturing Excellence

 

Product Parameters

 

Item Ag 106G Ag120G Ag114S Ag108S
structure Mechanical clamping type Vacuum suction type
sersor type Reflective optical fiber Linear sensor
wafer size 6'' 8''-12'' 6''-8'' 8''-12''
Time required to determine position 2.5s(no re-clamping action is performed) 3s(no re-clamping action is performed)
Position accuracy Wafer Center: within±0.3mm, Notch Positioning: within±0.3° Wafer Center: within±0.1mm, Notch Positioning: within±0.1°
Control communication method RS232/RS485/TCP/IP
Power supply DC24V 10A DC 24V 6A
Vaccum                                                   - more than -53kpa
 
Exhibition & Customers

Precision Wafer Alignment Technology for Circuit Manufacturing ExcellencePrecision Wafer Alignment Technology for Circuit Manufacturing Excellence

Packaging & Shipping

Precision Wafer Alignment Technology for Circuit Manufacturing ExcellencePrecision Wafer Alignment Technology for Circuit Manufacturing Excellence
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

 

Q3:Why choose us?
A3:OEM/ODM/Designing service.

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