Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA

• Customization: Available
• After-sales Service: 12 Months
• Condition: New
• Model NO.: FCDB-01
• Speed: High Speed
• Precision: Precision
• Certification: ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Appplication: Coc
• Chip Size: 0.15 to 1.5mm
• Substrate Size: 0.15 to 4mm
• Production Cycle: 70s
• Patch Pressure: 10g to 100g
• Xy Placement Accuracy: +/-1.5um@3sigma
• Die Rotation Accuracy: 0.3deg@3sigma
• Sensor Resolution Ratio: 3072*2048
• Transport Package: Wooden
• Specification: Customzied
• Trademark: Himalaya
• Origin: China
• Production Capacity: 100

Product Description

Flip chip die bonder

DA1201FC Flip Chip and Die AttachX/Y placement accuracy:

Flip-chip/high-precision die attach mode: ±10-15μm@3σ;

Die attach mode: ±10-25μm@3σ;

Specially designed for flip chip devices with low pin count, DA1201FC provides a fully automatic high-speed flip chip solution for various devices, such as SOIC, SO, QFN, BGA, LGA, etc. At the same time, it is equipped with die attach system;

High-speed and high precision die bonding capability;

MS Windows® operating system and flexible connectivity;

Flip chip and die bonding in one machine - the conversion between the two processes is simple and easy;

Comprehensive inspection system;

High density lead frame handling capability.

Specification

	Item	DA1201FC
Flip Chip/ High Precision Die Attach Module	X/Y placement accuracy	±10-15μm @3o
	Theta placement accuracy	5mm≤Diesize≤10mm ±0.15°@3o;1mm≤Diesize≤5mm ±0.3°@3o; 0.25mm≤Diesize≤1mm ±1°@3o
Die Attach Module	x/Y placement accuracy	±10-25μm @3o
	Theta placement accuracy	Die size≥1mm ±0.5°@3o; Die size≤1mm ±1°@3o
Materials Handling Capability	Die size	0.15x0.15mm-6x6mm
	Substrate dimensions	Length:100-300mm;width:40-100mm; Thickness:0.1-0.8mm(Standard)0.8-2.0mm (Optional)
	Magazine dimensions	110-310mmx20-110mmx70-153mm(LengthxWidthx Height
Wafer System	Wafer size	6"-12"
	Auto-theta alignment	±10°Range
	Theta	360°
Bond Head System	Bond force	20-1000 g(Programmable
Pattern Recognition System	PR system	Multi-color
	Resolution	1280pixelx640 pixel(Customizable)
	Pixel&FOV	±1/4pixel  (±lum@FOV2mm)
	Angular accuracy	0 . 1°
Dimensions&Weight	Dimension	2250x1650×1750 mm(LengthxWidthxHeight)
	Weight	1600kg

Packing & Delivery

Wooden pack with air-freight, sea-freight or express service

Company Profile

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu Himalaya Semiconductor Co., Ltd. is a premier semiconductor equipment manufacturer and global exporter established in 2019. We specialize in providing high-performance, cost-effective semiconductor manufacturing solutions to clients worldwide, with a strong presence in 30+ countries and a network of 200+ satisfied customers and suppliers.

We design and manufacture advanced semiconductor production equipment, including:
Die Bonders – High-precision chip attachment for IC packaging
Wire Bonders – Reliable interconnects for semiconductor devices
Laser Processing Machines – Wafer marking, grooving, cutting (Si, SiC, glass, ceramics)

FAQ

Q1: Does it work with phone cases?

A: Yes! Charges through cases up to 8mm thick (plastic, silicone, or TPU).

Q2: Why does my device charge slowly?

A: Ensure your phone supports 15W wireless charging. Lower power may apply for non-Qi devices.

Q3: How do I claim warranty service?

A: Email your order ID and issue description to ***@***.com. We’ll respond within 24 hours.