CCD Vision Glue Dispensing System High-Speed Dispensing for FPC Package

• Customization: Available
• After-sales Service: Provided
• Precision: High Precision
• Model NO.: DK-04
• Condition: New
• Certification: ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Desktop
• Driven Type: Electric
• Product Name: Dispensing Machine
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• Dimension (L x W x H): 810 mm X 660 mm X 760 mm
• Weight: 105 Kg
• Working Area: X: 260 mm, Y: 260 mm, Z: 100 mm
• Max. Moving Speed: 800 mm/S
• Repeatability: +/- 0.025 mm (± 25 Microns)
• Power Supply: 220V, 50/60 Hz
• Required Air Pressure: ≥ 0.65 MPa (~94 Psi)
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 100

Product Description

Product Description

Standard Features 

Computer Control, Windows OS
CCD visual positioning system
Servo Motor
UPS and voltage stabilizer
ESD grounding point-
CE certifed

 

Optional Features 

Automatic constant temperature system to ensure the fuidity consistent
Laser Height Detection to calibrate Z axis automatically for component
deformation

Key Features

Key Features & Advantages
Ultra-Precise Dispensing for Semiconductor Applications
Repeatability: ±0.025mm (ideal for micro-dots, underfill, and die-attach adhesives)
Max Speed: 800mm/s (optimized for high-throughput production)
Multi-Axis Servo Control (X, Y1, Y2, Z) - Ensures smooth motion for complex dispensing paths

Smart CCD Vision Alignment
Automated Pattern Recognition - Compensates for substrate misalignment
Real-Time Inspection - Detects missing glue or dispensing errors

Semiconductor-Grade Control System

Industrial PC + High-Speed Motion Control Card
User-Friendly Anda Software with drag-and-drop programming
Supports SECS/GEM Protocol for seamless integration into smart factories

Reliability & Cleanroom Compatibility
Vacuum Nozzle Cleaning System - Prevents clogging in precision applications
Anti-Static Design (ESD Protection) - Critical for semiconductor environments
Low-Particulate Construction - Suitable for ISO Class 5-8 cleanrooms

Optimized for Semiconductor Workflows
Working Area: X1/X2 (260mm), Y1/Y2 (260mm), Z (100mm) - Fits wafer trays & JEDEC carriers
Compact Footprint (1120×740×760mm) - Saves valuable cleanroom space

Product Parameters

TSV Series desktop dispensing system is applicable for LENS dispensing, FPC package, SMT red glue dispensing, solder past dispensing, LED package, fingerprint identifcation module, etc. 

 

Specifications	TSV-300	HSV-300
Dimension (mm)	L810×W660×H760	L900×W650×H1460
Weight (kg)	105	190
Control	Industrial personal computer + motion control card
Software	Anda control software + windows system
Programming	Visual programming
Number of spindles	X,Y,Z
Spindle drive	Servo motor + module
Working area (mm)	X:260 ; Y:260 ; Z:100
Quantity of rubber valve	1 (standard configuration)
Max. Moving speed (mm/s)	800
Repeatability (mm)	± 0.025
Coating capacity (cc)	30
Valve nozzle cleaning device	Vacuum cleaning
Equipment alarm	Menu + sound and light alarm
Coating inspection	Automatic detection
Power supply	220V 50/60Hz
Required air pressure (Mpa)	≥ 0.65
Safety standards	CE
Rated power (kw)	1
Standard configuration	CCD visual positioning;  Electrostatic interface;  232 scanner socket

Applications

Key Applications in Semiconductor & Advanced Electronics

Flip-Chip Underfill Dispensing
Die Attach Adhesive Application
Wafer-Level Packaging (WLP) Encapsulation
Advanced PCB Assembly (SiP, Fan-Out)
MEMS & Sensor Packaging

Engineered for high-mix, low-volume semiconductor production as well as high-volume manufacturing, the TSV-200D delivers consistent, repeatable dispensing with near-zero waste.
 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!

Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Packaging & Freight Services

We ensure your semiconductor equipment arrives in perfect condition, anywhere in the world.

Secure Packaging: Protected with shock-absorbing bubble foam inside a robust wooden crate for maximum transit safety.

Global Logistics: We arrange and manage reliable shipping via road, sea, and air freight to meet your timeline and budget needs.

Your precision equipment is handled with care from our door to yours.
 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.