Advanced Micro LED Wafer Laser Transfer Automation Solution
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Product Highlights
- Fully Automated Operation: Features fully automatic three-color loading and unloading for high efficiency.
- Customized Product Size: Processed product size is tailored according to specific customer requirements.
- Flexible Customization: Offers flexible customization options for ODM and OEM services.
- High Yield Performance: Designed for high yield and high efficiency in micro-LED mass transfer.
- Roll-to-Roll Scalability: Compatible with Roll-to-Roll (R2r) processes for scalable production.
- Curved Display Support: Supports curved and foldable screens for flexible display applications.
- UV/Excimer Laser Type: Utilizes UV/Excimer lasers for precise micro-LED device transfer.
Product Attributes
- Customization
- Available
- Application
- Detector, Temperature Measurement
- Batch Number
- 2022+
- Model NO.
- HM-02
- Certification
- CE, RoHS
- Manufacturing Technology
- Logic IC
- Material
- Power Semiconductor
- Model
- PC817
- Package
- BGA
- Signal Processing
- Analog Digital Composite and Function
- Type
- Intrinsic Semiconductor
- Product Name
- Micro LED Wafer Laser Mass Transfer System
- Stroke Range
- X/Y: 400 mm
- Stroke Range 2
- Z: 20 mm
- Material Compatibility
- Micro-LED-Specific Substrates
- Automation
- Fully Automated RGB Loading/Unloading
- Scalability
- Compatible with Roll-to-Roll (R2r)
- Laser Type
- UV/Excimer Lasers
- Flexible Displays
- Supports Curved/Foldable Screens
- Transport Package
- Packed with Wooden Box by Sea Shipping
- Specification
- 1500kg
- Trademark
- Himalaya
- Origin
- China
- Production Capacity
- 5000
Product Images of Advanced Micro LED Wafer Laser Transfer Automation Solution
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Advanced Micro LED Wafer Laser Transfer Automation Solution -
Advanced Micro LED Wafer Laser Transfer Automation Solution -
Advanced Micro LED Wafer Laser Transfer Automation Solution -
Advanced Micro LED Wafer Laser Transfer Automation Solution -
Advanced Micro LED Wafer Laser Transfer Automation Solution -
Advanced Micro LED Wafer Laser Transfer Automation Solution -
Advanced Micro LED Wafer Laser Transfer Automation Solution
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Product Description
Micro LED Wafer Laser Mass Transfer System solution Fully automatic three-color machinery equipment factory
Laser mass transfer is used in the new display industry to transfer three-color chips to the substrate through direct transfer/secondary transfer.
X-axis: Stroke 400 mm; resolution 0.1 μm
Y-axis: Stroke 400 mm; resolution 0.1 μm
Z-axis: Stroke 20 mm; resolution 0.1 μm
θ-axis: Stroke 120°; resolution 0.0001°
Transfer material: Micro-LED device-specific substrate
Size of processed products: Tailored according to customers' requirements
High yield
High efficiency
Fully automatic three-color loading and unloading
Laser mass transfer is used in the new display industry to transfer three-color chips to the substrate through direct transfer/secondary transfer.
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our semiconductor equipment is packed with wooden carton
About the Supplier
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Company Profile
Empowering Global Semiconductor Excellence: An Introduction to Jiangsu Himalaya Semiconductor Co., Ltd.
In the rapidly evolving landscape of global electronics, precision and reliability are the cornerstones of success. Since its establishment in 2019, Jiangsu Himalaya Semiconductor Co., Ltd. Has emerged as a pivotal force in the semiconductor industry, specializing in the high-level integration and international trade of advanced manufacturing equipment.
With a footprint extending to over 30 countries and a robust network of more than 200 global customers and suppliers, we serve as the critical link in the semiconductor supply chain. Our mission is clear: To secure the most cost-effective, high-performance solutions for our clients while ensuring seamless, risk-free transactions for our partners.
Comprehensive Equipment Solutions for Semiconductor Manufacturing
We take pride in our diverse portfolio of high-precision machinery designed to meet the rigorous demands of modern wafer processing and packaging.
1. Advanced Bonding & Marking
Precision at the microscopic level is essential for chip integrity. Our core lineup includes:
Die Bonders: Ensuring high-speed, accurate placement of chips.
Wire Bonding: Providing reliable electrical interconnections with industry-leading stability.
Laser Marking: Specialized ID marking for IC wafers to ensure full traceability throughout the lifecycle.
2. Cutting-Edge Laser Processing
As wafers become thinner and materials more complex, our laser solutions provide the necessary finesse without compromising structural integrity:
Laser Grooving & Cutting: Expertly designed for glass, ceramics, and wafer packaging.
Internal Modification Machines: Specialized laser technology for Si/SiC (Silicon Carbide) and LT/LN (Lithium Tantalate/Lithium Niobate) wafers.
Laser Annealing: Optimized for Si/SiC substrates to enhance electrical properties and repair lattice damage.
3. Dicing & Dispensing
Automatic Dicing Saw Machines: High-efficiency dicing for wafer packaging applications.
Automatic Silicone Dispensing Equipment: Precision fluid control for protective coating and encapsulation.
Customized Industrial Solutions
Beyond standard machinery, Jiangsu Himalaya Semiconductor provides specialized engineering solutions tailored to unique factory requirements:
TGV (Through Glass Via) Technology: Offering manual, semi-automatic, and fully automatic equipment for next-generation 3D packaging.
Coating & Plating: Customized machines designed for specific surface treatment and metal deposition needs.
Environmental & Resource Management: Efficient solutions for handling exhausted metal sorter equipment, promoting sustainable manufacturing practices.
Why Partner with Jiangsu Himalaya Semiconductor?
In a market defined by volatility, we offer stability and strategic advantage. We understand that for our customers, the "final stage" of procurement is the most critical. We utilize our deep industry expertise to filter through global options, delivering products that balance cost with cutting-edge performance.
For our suppliers, we are a partner of trust. We strive for one-time payment collection and comprehensive risk avoidance, allowing manufacturers to focus on innovation while we handle the complexities of global distribution.
Contact Us Today
Whether you are scaling your production line or seeking a reliable global export partner, Jiangsu Himalaya Semiconductor Co., Ltd. is ready to elevate your operations.
Explore the peak of semiconductor technology with Himalaya.
About Our Factory & Business Background
- Address
- Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
-
Registered Capital
- 100,000,000 RMB
-
Terms of Payment
- LC, T/T, PayPal, Western Union
-
International Commercial Terms(Incoterms)
- FOB, CIF, CFR, EXW
-
Average Lead Time
-
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months -
Nearest Port
- Shenzhen Port
-
Minimum Order Quantity
- 1 Set
-
Supply Chain Partners
- 30
Our Production Capability & Technical Expertise
-
Main Products
- Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
-
Inspection Type for Finished Products
- 100% inspection(Visual inspection & Function inspection)
-
Inspection Method for Finished Products
- Finished product checked by packing staff
-
Customization Options
- Flexible customization
-
ODM Service Available
- Yes
-
OEM Service Available
- Yes
-
Traceability of Raw Materials
- No
Our Industry Experience & Global Business Record
-
Year of Establishment
- 2019-09-12
-
Export Year
- 5 Years
-
Main Markets
- Europe
-
Repeat Buyers Choice
- 80%~100%
FAQ
- Can the product size be customized?
- Yes, the size of processed products is tailored according to customer requirements.
- Is OEM and ODM service available?
- Yes, both OEM and ODM services are available with flexible customization options.
- What are the lead times for production?
- Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.
- What is the minimum order quantity?
- The minimum order quantity is 1 set.
- What payment terms are accepted?
- Accepted payment terms include LC, T/T, PayPal, and Western Union.
- How is the equipment inspected before shipping?
- Finished products undergo 100% inspection including visual and function checks by packing staff.
- What types of lasers are used in this system?
- The system uses UV/Excimer lasers suitable for micro-LED device-specific substrates.
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