Advanced Full-Automatic Wafer De-Taping Machine for Efficient Processing

Product Details
Customization: Available
After-sales Service: Yes
Function: Abrasion Resistance, High Temperature Resistance
Gold Member Since 2023

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  • Advanced Full-Automatic Wafer De-Taping Machine for Efficient Processing
  • Advanced Full-Automatic Wafer De-Taping Machine for Efficient Processing
  • Advanced Full-Automatic Wafer De-Taping Machine for Efficient Processing
  • Advanced Full-Automatic Wafer De-Taping Machine for Efficient Processing
  • Advanced Full-Automatic Wafer De-Taping Machine for Efficient Processing
  • Advanced Full-Automatic Wafer De-Taping Machine for Efficient Processing
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  • Overview
  • Product Description
  • Product Parameters
  • Field Application
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
ADW3000
Demoulding
Pull Core
Condition
New
Certification
ISO, CE
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
300,000-1,000,000 Shots
Control System
PC+PLC
Wafer Type
Taiko and Non-Taiko Wafers
Wafer Size
8", 12", 8/12 Compatible
Wafer Thickness (Taiko)
8" ≥ 100μm, 12" ≥ 150μm
Tape Specification
Pyrolytic or UV Bg Film
Factory Integration
Secs/Gem Supported
Power Supply
AC220V, 12A
Transport Package
Wooden Package
Specification
100Kg
Trademark
Himalaya
Origin
China
HS Code
8541590000
Production Capacity
500

Product Description

Product Description

ADW3000 seriesde-taping machine isapplicable to the de-taping process after wafer thinning. Advanced de-taping technology is applied, which can be compatible with adhesive tape and hot melt tape. 8''-12'' is available to handel.  Taiko and Non-taiko wafers can be processed. It is applicable to tape peeling technoloy of wafers after thinning of 8''-12''

Product Features
Dual-purpose machine, capable of fully automatic de-lamination as well as full UV de-bonding
Employs adanced anti-static rollers and constant temperature hot-melt taple lamination technology
Automatic tape conveyance and application
Suitable for various wafer types includint conventional, ultra-thin and Taiko
Automatic wafer detection, edge scanning, and transportation
Automatic UV or thermal curing de-bonding
A variety of wafer handling technologies available, including vacuum, Bernoulli, and gripper systems
SECS/GEM or basic networking capabilities
Advanced Full-Automatic Wafer De-Taping Machine for Efficient Processing

Product Parameters
Wafer Mounting Equipment Technical Specifications
Category Parameter Specification
Wafer Compatibility Wafer Type Taiko and non-Taiko wafers
Wafer Size 8", 12", 8/12 compatible
Wafer Thickness (Taiko) 8" ≥ 100μm, 12" ≥ 150μm
Wafer Thickness (Non-Taiko) 8" ≥ 80μm, 12" ≥ 100μm
Special Thinning Customizable platen or built-in pre-cut membrane technology
Process Capabilities Membrane Type Various thinning process membranes
Tape Specification Pyrolytic or UV BG film
Platform Type Vacuum airway type/Porous metal/Porous ceramic (optional)
Platform Heating Room temperature ~100°C
UV Function Supported
Electrostatic Elimination Ion air pump
System & Control Control System PC+PLC Base
Factory Integration SECS/GEM Supported
Utilities Power Supply AC220V, 12A
Environmental Control Cleanliness Environmental cleanliness system included
Maintenance Platform cleaning supported
Advanced Full-Automatic Wafer De-Taping Machine for Efficient Processing
Field Application

Advanced Full-Automatic Wafer De-Taping Machine for Efficient ProcessingAdvanced Full-Automatic Wafer De-Taping Machine for Efficient Processing

Exhibition & Customers

Advanced Full-Automatic Wafer De-Taping Machine for Efficient ProcessingAdvanced Full-Automatic Wafer De-Taping Machine for Efficient Processing

Packaging & Shipping

Advanced Full-Automatic Wafer De-Taping Machine for Efficient ProcessingAdvanced Full-Automatic Wafer De-Taping Machine for Efficient Processing

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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